Patents by Inventor Wen Chu

Wen Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200109476
    Abstract: The present disclosure provides a method of manufacturing a gas sensor. The method includes the following operations: a substrate is received; a conductor layer is formed over the substrate; the conductor layer is patterned to form a conductor with a plurality of openings by an etching operation, the openings being arranged in a repeating pattern, a minimal dimension of the opening being about 4 micrometers; and a gas-sensing film is formed over the conductor.
    Type: Application
    Filed: December 6, 2019
    Publication date: April 9, 2020
    Inventors: MING-TA LEI, CHIA-HUA CHU, HSIN-CHIH CHIANG, TUNG-TSUN CHEN, CHUN-WEN CHENG
  • Publication number: 20200107130
    Abstract: A MEMS microphone includes a substrate having an opening, a first diaphragm, a first backplate, a second diaphragm, and a second backplate. The first diaphragm faces the opening in the substrate. The first backplate includes multiple accommodating-openings and it is spaced apart from the first diaphragm. The second diaphragm joints the first diaphragm together at multiple locations by pillars passing through the accommodating-openings in the first backplate. The first backplate is located between the first diaphragm and the second diaphragm. The second backplate includes at least one vent hole and it is spaced apart from the second diaphragm. The second diaphragm is located between the first backplate and the second backplate.
    Type: Application
    Filed: July 9, 2019
    Publication date: April 2, 2020
    Inventors: Chun-Wen Cheng, Chia-Hua Chu, Wen-Tuan Lo
  • Patent number: 10609463
    Abstract: An integrated microphone device is provided. The integrated microphone device includes a substrate, a plate, and a membrane. The substrate includes an aperture allowing acoustic pressure to pass through. The plate is disposed on a side of the substrate. The membrane is disposed between the substrate and the plate and movable relative to the plate as acoustic pressure strikes the membrane. The membrane includes a vent valve having an open area that is variable in response to a change in acoustic pressure.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: March 31, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chun-Wen Cheng, Wen-Cheng Kuo, Chia-Hua Chu, Chun-Yin Tsai, Tzu-Heng Wu
  • Publication number: 20200082043
    Abstract: A simulation evaluation model of a high voltage ride through capability includes a wind turbine system aerodynamic model, a torque control model, a converter model, and a high voltage fault generating device model connected in sequence; the wind turbine system aerodynamic model is configured to calculate an airflow input power; the torque control model is configured to calculate a rotor electromagnetic torque according to the airflow input power; the high voltage fault generating device model is configured to simulate a high voltage fault and output a predetermined voltage on a low voltage side of a transformer; and the converter model is configured to calculate a stator reactive current, an active power and a reactive power of the wind turbine system during the high voltage fault according to the airflow input power, the rotor electromagnetic torque and the predetermined voltage on the low voltage side of the transformer.
    Type: Application
    Filed: June 29, 2018
    Publication date: March 12, 2020
    Applicant: GUODIAN UNITED POWER TECHNOLOGY COMPANY LTD.
    Inventors: Jingchun CHU, Ling YUAN, Lei PAN, Wenchao CHEN, Chong JIAO, Fa XIE, Wen DU, Yanping LI, Qian WANG, Xuefeng LIN, Yan DING
  • Publication number: 20200083168
    Abstract: A method for semiconductor manufacturing is disclosed. The method includes receiving a device having a first surface through which a first metal or an oxide of the first metal is exposed. The method further includes depositing a dielectric film having Si, N, C, and O over the first surface such that the dielectric film has a higher concentration of N and C in a first portion of the dielectric film near the first surface than in a second portion of the dielectric film further away from the first surface than the first portion. The method further includes forming a conductive feature over the dielectric film. The dielectric film electrically insulates the conductive feature from the first metal or the oxide of the first metal.
    Type: Application
    Filed: November 12, 2019
    Publication date: March 12, 2020
    Inventors: Cheng-Yi Wu, Li-Hsuan Chu, Ching-Wen Wen, Chia-Chun Hung, Chen Liang Chang, Chin-Szu Lee, Hsiang Liu
  • Publication number: 20200076126
    Abstract: A connector assembly with latching provided by a rotating latch bar. The connector has a low height, with the rotating latch bar providing secure engagement between mated connectors of the connector assembly. The latch bar may be shaped to provide spring force that urges the mated connectors together. The connector assembly may be formed with a cable connector and a board connector. The low height of the board connector enables the connector to be mounted close to high speed electronic components, such as a processor, even if covered by a heat sink, as the connector may fit under the heat sink. The cable connector may be coupled, via a cable, to an I/O connector or other component remote from the high speed electronic component.
    Type: Application
    Filed: March 12, 2019
    Publication date: March 5, 2020
    Applicants: Amphenol AssembleTech (Xiamen) Co., Ltd, Amphenol East Asia Ltd.
    Inventors: Wen Chu Yang, Hang Li, Shujian Wang, Hui Tang, Zhenxing Liu, Xiyin Zhou, Wende Xu, Lo-Wen Lu
  • Publication number: 20200076132
    Abstract: A connector assembly configured for compact, high speed electronic systems. The assembly includes a board connector and a cable connector that may be mated by moving the cable connector in a mating direction perpendicular to a printed circuit board to which the board connector is mounted. The cable and board connectors may latch when mated and may be unlatched and unmated by pulling on a tab at a top of the cable connector in a direction opposite the mating direction. As a result, little clearance is required around the board connector to access the latching components. Such a connector may enable an electronic device with high signal integrity because the connector can be mounted close to an electronic component that processes high speed signals, providing a short, and high integrity signal paths for high speed signals.
    Type: Application
    Filed: March 12, 2019
    Publication date: March 5, 2020
    Applicants: Amphenol AssembleTech (Xiamen) Co., Ltd, Amphenol East Asia Ltd.
    Inventors: Wen Chu Yang, Hui Tang, Zhenxing Liu, Joan Lu, Hank Hsu
  • Publication number: 20200070343
    Abstract: Systems, apparatus, and methods are described for robotic learning and execution of skills. A robotic apparatus can include a memory, a processor, sensors, and one or more movable components (e.g., a manipulating element and/or a transport element). The processor can be operatively coupled to the memory, the movable elements, and the sensors, and configured to obtain information of an environment, including one or more objects located within the environment. In some embodiments, the processor can be configured to learn skills through demonstration, exploration, user inputs, etc. In some embodiments, the processor can be configured to execute skills and/or arbitrate between different behaviors and/or actions. In some embodiments, the processor can be configured to learn an environmental constraint. In some embodiments, the processor can be configured to learn using a general model of a skill.
    Type: Application
    Filed: June 28, 2019
    Publication date: March 5, 2020
    Inventors: Andrea Lockerd THOMAZ, Vivian Yaw-Wen Chu
  • Publication number: 20200071157
    Abstract: A MEMS device includes a first layer and a second layer including a same material, a third layer disposed between the first layer and the second layer, a first air gap separating the first layer and the third layer, a second air gap separating the second layer and the third layer, a plurality of first pillars exposed to the first air gap and arranged in contact with the first layer and the third layer, a plurality of second pillars exposed to the second air gap and arranged in contact with the second layer and the third layer.
    Type: Application
    Filed: August 29, 2018
    Publication date: March 5, 2020
    Inventors: CHEN HSIUNG YANG, CHUN-WEN CHENG, CHIA-HUA CHU, EN-CHAN CHEN
  • Patent number: 10578655
    Abstract: A device for measuring low currents is proposed to include: a transimpedance amplifier to convert an analog current signal into an analog voltage signal; an analog-to-digital converter to acquire a graph that plots a curve representing variation of the analog voltage signal using digital codes; a statistic module to acquire a set of crossing numbers by: for each of the digital codes, making a straight line that has a constant value equaling the digital code across time in the graph, and counting a number of crossings of the curve with the straight line; and an analysis module to analyze distribution of the crossing numbers, and to output an output code based on the distribution of the crossing numbers.
    Type: Grant
    Filed: February 14, 2017
    Date of Patent: March 3, 2020
    Assignee: INSTITUTE OF NUCLEAR ENERGY RESEARCH ATOMIC ENERGY COUNCIL, EXECUTIVE YUAN
    Inventors: Chi-Wen Hsieh, Yi-Chun Lin, Tseng-Te Huang, Ming-Chen Yuan, Chien-Hau Chu, Yu-Chin Chi
  • Publication number: 20200067557
    Abstract: A signal transmission device includes a transceiver circuitry and a control circuitry. The transceiver circuitry is configured to receive first device data from an external device through a channel. The control circuitry is configured to calculate a least one system parameter of the transceiver circuitry based on the first device data, second device data associated with the transceiver circuitry, and at least one requirement of a predetermined communication protocol, in order to link with the external device.
    Type: Application
    Filed: March 6, 2019
    Publication date: February 27, 2020
    Inventors: Wen-Juh KANG, Yu-Chu CHEN, Hua-Shih LIAO
  • Publication number: 20200058595
    Abstract: A method for forming a semiconductor device structure is provided. The method includes forming a first overlay grating over a substrate. The method includes forming a layer over the first overlay grating. The method includes forming a second overlay grating over the layer. The second overlay grating has a third strip portion and a fourth strip portion, the third strip portion and the fourth strip portion are elongated in the first elongated axis and are spaced apart from each other, there is a second distance between a third sidewall of the third strip portion and a fourth sidewall of the fourth strip portion, the third sidewall faces away from the fourth strip portion, the fourth sidewall faces the third strip portion, the first distance is substantially equal to the second distance, and the first trench extends across the third strip portion and the fourth strip portion.
    Type: Application
    Filed: October 24, 2019
    Publication date: February 20, 2020
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Long-Yi CHEN, Jia-Hong CHU, Chi-Wen LAI, Chia-Ching LIANG, Kai-Hsiung CHEN, Yu-Ching WANG, Po-Chung CHENG, Hsin-Chin LIN, Meng-Wei CHEN, Kuei-Shun CHEN
  • Patent number: 10567248
    Abstract: Example task assignment methods disclosed herein for video analytics processing in a cloud computing environment include determining a graph, such as a directed acyclic graph, including nodes and edges to represent a plurality of video sources, a cloud computing platform, and a plurality of intermediate network devices in the cloud computing environment. Disclosed example task assignment methods also include specifying task orderings for respective sequences of video analytics processing tasks to be executed in the cloud computing environment on respective video source data generated by respective ones of the video sources.
    Type: Grant
    Filed: November 29, 2016
    Date of Patent: February 18, 2020
    Assignee: Intel Corporation
    Inventors: Hong-Min Chu, Shao-Wen Yang, Yen-Kuang Chen
  • Patent number: 10562820
    Abstract: A low-temperature co-fired microwave dielectric ceramic material includes: (a) 85 wt % to 99 wt % ceramic material comprising Mg2SiO4, Ca2SiO4, CaTiO3, and CaZrO3, wherein a weight ratio of Mg2SiO4 relative to Ca2SiO4 is of (1?x):x, a weight ratio of CaTiO3 relative to CaZrO3 is of y:z, and a weight ratio of entities of Mg2SiO4 and Ca2SiO4 relative to CaTiO3 is of (1?y?z):y, 0.2?x?0.7, 0.05?y?0.2, 0.05?z?0.4; and (b) 1 wt % to 15 wt % glass material composed of Li2O, BaO, SrO, CaO, B2O3, and SiO2.
    Type: Grant
    Filed: October 11, 2018
    Date of Patent: February 18, 2020
    Assignee: WALSIN TECHNOLOGY CORPORATION
    Inventors: Li-Wen Chu, Kuei-Chih Feng, Chih-Hao Liang
  • Patent number: 10564366
    Abstract: A plug device for plugging in at least two optical modules is provided, wherein the plug device is disposed in a housing and includes a first circuit board, a first connecting module, and a movable module. The first connecting module includes a plurality of electrical connectors, and the movable module includes a plate, at least one frame, and at least one joining member. The electrical connectors are disposed on the first circuit board. The frame is connected to the plate and has a plurality of accommodating portions. The optical modules can be respectively accommodated in the accommodating portions. The plate can be affixed to or separated from the housing by the joining member.
    Type: Grant
    Filed: May 31, 2018
    Date of Patent: February 18, 2020
    Assignee: Delta Electronics, Inc.
    Inventors: I-Wen Chan, Shu-Hong Chu
  • Publication number: 20200038598
    Abstract: The present disclosure relates to a sub-assembly for a medicament delivery device, comprising: a cap having a tubular body provided with a distal opening, the cap being configured to be mounted to a proximal end of a medicament delivery device, and a tubular remover configured to be received in the distal opening of the cap, the remover having a proximal end portion configured to be fixedly attached to the cap, a housing, an internal structure arranged inside the housing and provided with a proximal inclined surface, and wherein the remover has a plurality of radially flexible legs extending longitudinally from a proximal end of the remover to a distal end thereof, each leg having a gripper configured to engage with a delivery member shield of a medicament delivery device, and each leg having a guide finger configured to extend distally beyond the grippers for cooperating with an internal structure of a medicament delivery device to guide radial expansion of the legs when the remover is mounted in a medicamen
    Type: Application
    Filed: September 25, 2017
    Publication date: February 6, 2020
    Inventors: Chun Chu, Wen-Yen Lee, Hsuan Wang
  • Patent number: 10546964
    Abstract: A solar cell with a molybdenum back electrode layer and a molybdenum selenide ohmic contact layer over the molybdenum back electrode, is provided. The molybdenum selenide layer includes an accurately controlled thickness. A distinct interface exists between the molybdenum back electrode layer and the molybdenum silicide layer. The molybdenum silicide layer is produced by forming a molybdenum layer or a molybdenum nitride layer or a molybdenum oxide layer over an initially formed molybdenum layer such that an interface exists between the two layers. A selenization and sulfurization process is carried out to selectively convert the molybdenum-containing layer to molybdenum selenide but not the original molybdenum back electrode layer which remains as a molybdenum layer.
    Type: Grant
    Filed: November 15, 2012
    Date of Patent: January 28, 2020
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shih-Wei Chen, Wen-Chin Lee, Wen-Tsai Yen, Chung-Hsien Wu, Kuan-Chu Chen
  • Publication number: 20200024135
    Abstract: An integrated circuit (IC) with an integrated microelectromechanical systems (MEMS) structure is provided. In some embodiments, the IC comprises a semiconductor substrate, a back-end-of-line (BEOL) interconnect structure, the integrated MEMS structure, and a cavity. The BEOL interconnect structure is over the semiconductor substrate, and comprises wiring layers stacked in a dielectric region. Further, an upper surface of the BEOL interconnect structure is planar or substantially planar. The integrated MEMS structure overlies and directly contacts the upper surface of the BEOL interconnect structure, and comprises an electrode layer. The cavity is under the upper surface of the BEOL interconnect structure, between the MEMS structure and the BEOL interconnect structure.
    Type: Application
    Filed: September 30, 2019
    Publication date: January 23, 2020
    Inventors: Chun-Wen Cheng, Chia-Hua Chu
  • Patent number: D875034
    Type: Grant
    Filed: October 6, 2018
    Date of Patent: February 11, 2020
    Assignee: Qingdao Sentury Tire Co., Ltd.
    Inventors: Wen Sun, Yixin Zhang, Jingjing Chu, Nan Yu
  • Patent number: D876584
    Type: Grant
    Filed: September 3, 2018
    Date of Patent: February 25, 2020
    Assignee: Qingdao Sentury Tire Co., Ltd.
    Inventors: Wen Sun, Yanmei Zhang, Jingjing Chu, Yixin Zhang