Abstract: A calibration apparatus and method for a capacitive sensing device, in which a calibration capacitor device connects to the capacitive sensing device which is connected to an integration circuit that generates a voltage output and a latch output, a transforming circuit transforms a sensitivity calibration parameter into a pair of corresponding analog signal outputs, and an offset calibration parameter into a corresponding analog signal output, at least two first switches between the pair of corresponding analog signal outputs and a fixed potential according to system clock's levels, and at least a third switch switches between the corresponding analog signal output and another fixed potential according to the system clock's levels. The apparatus determines the switch between the pair of signal outputs according to the latch output.

Abstract: A semiconductor structure comprising a semiconductor unit, a first conductive structure, a first conductive plug, and a second conductive structure is provided. The semiconductor unit has a substrate on a first side of the semiconductor unit. The substrate has at least a hole. The first conductive plug is in the hole and the hole may be full of the conductive plug. The first conductive structure is on the surface of the semiconductor unit. The surface is at the first side of the semiconductor unit. The second conductive structure is on a surface at a second side of the substrate of the semiconductor unit.

Abstract: The present invention relates to a new layout for inductive loops of the electromagnetic-induction system, and particularly relates to a new layout for inductive loops of the electromagnetic-induction system which can be integrated with another type of input system. The inductive loop structure of the layout for inductive loops of the electromagnetic-induction system comprises a plurality of -shaped regions, a plurality of switches, a plurality of grounding lines, a grounding switch, and a plurality of signal ports. The -shaped regions are connected with each other to form a fence-shaped inductive loop structure, but the -shaped regions are not interlaced with each other. By this way, the difficulties and the complication for layout for inductive loops of the electromagnetic-induction system are decreased. Therefore, it helps the layout for inductive loops of the electromagnetic-induction system to be integrated with another type of input system into one system.

Abstract: An electrically heated tool adapted for an anchoring device includes a housing having an opening, a heating head extending forwardly out of the opening, and a movable member disposed movably on the heating head and extending forwardly out of the opening. The movable member has an engagement hole permitting extension of the heating head therethrough, a front annular surface, a loading portion disposed on the front annular surface, and a loading space defined between the loading portion and the front annular surface. The movable member is movable relative to the heating head between an extended position whereat a front pressing surface of the heating head is spaced apart from a forwardly protruding nose of the device, and a retracted position whereat the front pressing surface contacts the nose. A spring is disposed for biasing the movable member toward the extended position.

Abstract: The disclosure relates to a micro-electromechanical system (MEMS) device having an electrical insulating structure. The MEMS device includes at least one moving part, at least one anchor, at least one spring and an insulating layer. The spring is connected to the anchor and to the moving part. The insulating layer is disposed in the moving part and the anchor. Each of the moving part and the anchor is divided into two conductive portions by the insulating layer. Whereby, the electrical signals of different moving parts are transmitted through the insulated electrical paths which are not electrically connected.

Abstract: An electric pencil sharpener includes a housing unit having an opening, a driving member driven by a motor, a cutting unit, and a panel unit. The cutting unit includes an outer frame mounted removably in the housing unit and including a ring gear, an inner frame disposed pivotally within the outer frame, and at least one cutting member disposed pivotally on the inner frame. The inner frame has a driven portion connected co-rotatably and removably to the driving member, and a cutting groove. The cutting member has a blade portion adjacent to the cutting groove, and a planetary gear portion meshing with the ring gear. The panel unit is mounted removably to the housing unit for covering the opening, and has a pencil-feeding hole. When the panel unit is removed from the housing unit, the cutting unit can be taken out of the housing unit through the opening.

Abstract: A multi-axis accelerometer is consisted of a substrate with sensing electrodes and a structure layer. The structure layer includes anchor bases fixed on the substrate. A first proof mass is disposed over the substrate and has a first opening and a second opening symmetric to each other. The first proof mass is suspended to the anchor bases. Fixed sensing blocks are disposed on the substrate, and capacitors are formed between each fixed sensing block and the first proof mass for sensing acceleration along two in-plane directions. A second proof mass and a third proof mass are disposed in the first opening and the second opening and are asymmetrically suspended. Separate electrodes are disposed on the substrate and form two differential capacitors with the second proof mass and the third proof mass for sensing the out-of-plane acceleration.

Abstract: A crystal oscillator includes a cover, a crystal blank and an Integrated Circuit (IC) chip. The cover has a surface, a cavity formed in the surface, a plurality of conductive contacts and a conductive sealing ring. The conductive contacts are disposed on the surface, and the conductive sealing ring is disposed on the surface and surrounds the conductive contacts. The IC chip is connected to the conductive contacts and the conductive sealing ring, and forms a hermetic chamber with the cover and the conductive sealing ring. The crystal blank is located in the hermetic chamber, and is electrically connected to the IC chip. Furthermore, a method for manufacturing a crystal oscillator is also provided.

Abstract: A display suspending frame device includes a suspending seat and at least one suspending frame. The suspending seat includes an upright mounting plate, a rear slide rail set disposed forwardly of the mounting plate and connected to the mounting plate, and a front slide rail set disposed forwardly of the rear slide rail set and connected to the rear slide rail set. The at least one suspending frame is for mounting to a rear face of a display and is mounted slidably on the front slide rail set. By arranging the rear slide rail set between the mounting plate of the suspending seat and the front slide rail set, a space is provided for accommodating an electronic device.

Abstract: A cover structure is disposed at the electronic device. The electronic device includes a frame with an opening and a power supply. The cover structure includes a cover and a pivotal portion. The cover includes an inner surface, an outer surface, and a touch portion. The pivotal portion includes a pivotal part and a trigger. The pivotal part is located on the inner surface. The trigger is located at the opening of the frame and connected with the pivotal part. The touch portion corresponds to the opening. When the touch portion is pressed, the pivotal part drives the trigger to trigger the power supply to drive the electronic device.

Abstract: A back frame module includes a base plate, two locking plate members, a cable organizing plate, and a stowage plate. The base plate is adapted to be provided on a rear face of a display. The locking plate members, the cable organizing plate, and the stowage plate are selectively connected to the base plate. The locking plate members are adapted for mounting of a computer device therebetween. The cable organizing plate is adapted to stow a cable of the display or of the computer device. The stowage plate is adapted to stow an adapter of the display or other accessories. The locking plate members, the cable organizing plate, and the stowage plate can be selectively substituted by a support plate. The back frame module thus has various states of use to satisfy different user requirements.

Abstract: An apparatus and a method for driving a sensorless motor are described and shown in the specification and drawings, where the method includes steps as follows. First, a control signal is acquired, where the control signal has information of a predetermined rotational speed. Next, energy is supplied and progressively increased to the sensorless motor, so as to rotate a rotor of the sensorless motor. Then, a position of the rotor is detected. Finally, the energy is gradually regulated so that the sensorless motor is maintained at the predetermined rotational speed.

Abstract: An electromagnetic induction coordinate detecting method for detecting the trace of at least one electromagnetic pointing device on an electromagnetic sensor board is disclosed. The method includes the following steps: first, a delayed period for each electromagnetic pointing device is pre-determined. Then, whether a board-trigger signal from the electromagnetic sensor board is received is determined. If yes, the electromagnetic pointing device emits an electromagnetic signal after the delayed period. Finally, the electromagnetic sensor board calculates the coordinate and the pressure of each electromagnetic pointing device according to the received electromagnetic signal.

Abstract: This invention provides an optical lens assembly comprising, in order from an object side to an image side: a first lens element with positive refractive power; a second lens element with positive refractive power; a third lens element with negative refractive power having a concave object-side surface and a convex image-side surface, at least one of the object-side and image-side surfaces thereof being aspheric; and a fourth lens element with positive refractive power having an aspheric object-side surface and an aspheric image-side surface; wherein the number of lens elements with refractive power is four.

Abstract: A stereo projection optical system includes an image engine configured for providing light superimposed spatial information, a color selector positioned to receive a light output of the image engine, a transmission-type light modulator positioned to receive an emergent light of the color selector. The color selector is configured for selectively modifying the polarization of the light output according to the wavelength of the light output. The transmission-type light modulator alternates between a dark state and a bright state. From the foregoing, it will be apparent that the stereo projection optical system according to the present invention provides advantages in that its structure can be simplified with the reduction of its size by synthesizing lift and right image signals by displaying the stereoscopic image signal using a single projector.

Abstract: A fabrication method of a power semiconductor structure with reduced gate impedance is provided. Firstly, a polysilicon gate is formed in a substrate. Then, dopants are implanted into the substrate with the substrate being partially shielded by the polysilicon gate. Afterward, an isolation layer is formed to cover the polysilicon gate. Thereafter, a thermal drive-in process is carried out to form at least a body surrounding the polysilicon gate. Then, the isolation layer is removed to expose the polysilicon gate. Afterward, a metal layer is deposited on the dielectric layer and the polysilicon gate, and a self-aligned silicide layer is formed on the polysilicon gate by using a thermal process.

Abstract: A bi-directional DC to DC power converter includes two DC sources, two inductors respectively connected to the two DC sources, a first switch and a second switch respectively connected to the two inductors, two capacitors respectively connected to the two switches, and a third switch connected between the two inductors. The first, second and third switches are respectively connected reversely with a diode in parallel. When the third switch is alternately turned on and off and the first and second switches are always turned off, the power converter operates as a boost power converter and electric energy flows from the two DC sources to the two capacitors. When the third switch is always turned off and the first and second switches are synchronously turned on or off, the power converter operates as a buck power converter and electric energy flows from the two capacitors to the two DC sources.

Abstract: In one embodiment, a semiconductor device package includes: (1) a substrate unit; (2) connecting elements disposed adjacent to a periphery of the substrate unit and extending upwardly from an upper surface of the substrate unit; (3) a semiconductor device disposed adjacent to the upper surface of the substrate unit and electrically connected to the substrate unit; and (4) a package body disposed adjacent to the upper surface of the substrate unit and covering the semiconductor device. A lateral surface of the package body is substantially aligned with a lateral surface of the substrate unit. The package body defines openings that at least partially expose respective ones of the connecting elements. At least one of the connecting elements has a width WC, and at least one of the openings has a width WU adjacent to an upper surface of the package body, such that WU>WC.

Abstract: A fabrication method of a power semiconductor structure with reduced gate impedance is provided. Firstly, a polysilicon gate is formed in a substrate. Then, dopants are implanted into the substrate with the substrate being partially shielded by the polysilicon gate. Afterward, an isolation layer is formed to cover the polysilicon gate. Thereafter, a thermal drive-in process is carried out to form at least a body surrounding the polysilicon gate. Then, the isolation layer is removed to expose the polysilicon gate. Afterward, a metal layer is deposited on the dielectric layer and the polysilicon gate, and a self-aligned silicide layer is formed on the polysilicon gate by using a thermal process.

Abstract: An optical touch locating system and method thereof is disclosed herein. The method includes the following steps. A step is used for activating the coordinate detecting module. A step is used for calculating the distance between two optical touch apparatuses. A step is used for sequentially locating a plurality of anchor points. When indicating to detect a first anchor point, a step is used to touch one of four corners on a display device by a touch object. A step is used for sequentially detecting and locating the remaining anchor points. At final step, according to the distance between two optical touch apparatuses and the coordinates of the anchor points, the touch working area. is confirmed.