Abstract: A voltage-boosting generator for reducing the effects due to operating voltage variation and temperature change. The generator comprises a delay line circuit and a voltage boosting circuit. The delay line circuit is used to perform a time delay according to an initial boosting signal and to produce a control signal. The voltage boosting circuit is used to boosted voltage according to the control signal.

Abstract: A voltage-boosting generator for reducing the effects due to operating voltage variation and temperature change. The generator comprises a delay line circuit and a voltage boosting circuit. The delay line circuit is used to perform a time delay according to an initial boosting signal and to produce a control signal. The voltage boosting circuit is used to boosted voltage according to the control signal.

Abstract: Disclosed is a MEMS sensor including a sense element and a single anchor that supports the sense element arranged in a central hub-like fashion that reduces the effects of thermal stress. Usually, two or more anchors are required to suitably constrain the sense element's motion. The anchor disclosed herein, however, supports the sense element with connection elements having a connection geometry that substantially limits the motion of the sense element to a single-degree-of-freedom. The connection elements may include, for example, converging flexures, an extender bar, or both.

Abstract: The standby battery assembly for use on the portable electronic products is attached to their back or an adequate place. The battery assembly has a casing for housing a plurality of batteries ( two batteries or more). The batteries are exchangeable within the casing, with a selection switch to shift between two batteries, or two batteries are arranged in the 180° direction, reversed direction or same direction to couple with the flexible operation of the portable electronic products.

Abstract: The present invention provides a method of fabricating a wafer level package. A semiconductor wafer having a plurality of chips thereon is first provided. A substrate having an area smaller than that of the chip is installed on each chip. A plurality of wires are used to connect bonding pads of the chip to the substrate. An encapsulation is then used to sheathe all the wires. Finally, a plurality of solder balls are arranged on the surface of the substrate between the wires. A wafer level package is thus formed. A plurality of electronic package devices can be obtained after slicing the wafer level package. In the present invention, original manufacturing equipments still can be used. The packaged electronic package device has a size commensurate to the chip size so that it is compact and occupies less area. Moreover, it has good electronic properties.

Abstract: A method of configuring a computer system capable of being woken up on LAN is disclosed. The method firstly actuates a core power for an interval by performing a Pre-Advanced Configuration and Power Interface (Pre-ACPI) routine. Next, the method retrieves a PCI clock signal in the fixed interval and then loads an Ethernet ID using the PCI clock signal, so as to set a south bridge to a standby mode capable of receiving a wake-up event. The invention can reduce an oscillator used in the conventional methods, and be capable of being woken-up on LAN without requiring the start-up procedure. And the invention can further solve the problem associated with the conventional methods, wherein an abnormal shutdown renders the computer system incapable of being woken up on LAN.

Abstract: Disclosed is a MEMS sensor including a sense element and a single anchor that supports the sense element arranged in a central hub-like fashion that reduces the effects of thermal stress. Usually, two or more anchors are required to suitably constrain the sense element's motion. The anchor disclosed herein, however, supports the sense element with connection elements having a connection geometry that substantially limits the motion of the sense element to a single-degree-of-freedom. The connection elements may include, for example, converging flexures, an extender bar, or both.

Abstract: A method for manufacturing a thin film transistor panel includes the steps of forming a first metal pattern on an insulating substrate; depositing an insulating layer and a semiconductor layer including an impurity-doped layer over the insulating substrate having the first metal pattern sequentially; forming a photoresist pattern on the semiconductor layer, wherein the photoresist pattern includes a first portion facing the channel region of TFTs, a second portion that is thicker than the first portion, and a third portion having no photoresist; etching the semiconductor layer with the photoresist pattern as an etch mask; reducing the thickness of the photoresist pattern layer till the first portion of the photoresist pattern is removed; removing the impurity-doped layer exposed at the channel region; and forming a second metal pattern on the patterned semiconductor layer and the gate insulating layer.

Abstract: A method and system of testing a chip for testing a circuit module in the chip. The system is integrated into the chip. The reference clock and the test command are sent to the testing system serially. The testing system, in response to the test command, performs test actions on the circuit module, producing a test result. The test result is serially sent to the test machine.

Abstract: An optical switching system that switches the path of an optical signal by moving a microstructure onto which a light-guiding structure is mounted. The microstructure is formed by a MEMs and semiconductor process to be integral to the substrate. The light-guiding structure may include waveguides. The microstructure moves from one position to another position (e.g., laterally, vertically, rotationally) such that incoming optical signals align over a small air gap to different optical paths, depending on the position of the movable microstructure. As a result, the optical signal propagate along different optical paths (e.g., straight pass through or cross over) depending on the position of the movable microstructure. The optical paths have a large radii of curvature so as to change the direction of the optical signal gradually, thereby reducing insertion losses.

Abstract: A front panel for AC plasma display panel made by: using exposure and sand blast techniques to form horizontally spaced lines of induction layer above an inner side of a glass substrate, and then making X-electrodes and Y-electrodes on the glass substrate, enabling X-electrodes and Y-electrodes to be alternatively disposed and horizontally spaced between each two adjacent lines of induction layer, and then printing a protective layer over the electrodes, enabling a straight line of discharge path to be formed between each X-electrode and Y-electrode, so that the service life of the plasma display panel can be prolonged, the intensity of electric field and UV light can be greatly improved, and the value of driving voltage can be effectively reduced.

Abstract: A controller architecture optimized for processing audio and video information in playback systems used for reproducing information stored on optical discs such as CDs and DVDs. The controller uses a unique parallel interface to facilitate the transfer of CD data and DVD data from the controller to a MPEG decoder. The controller also performs servo control operations, data processing and error detection and correction operations for CD data and DVD data, and provides shared memory resources for internal operations of the controller. DVD/CD playback systems incorporating the present invention occupy less real estate, have smaller pin counts, are less complex, and are cheaper to manufacture than conventional playback systems.

Abstract: Numerous novel structures and methods are presented for their ability to correct angular and offset alignment errors caused by thermal distortion of a device formed out of dissimilar materials, such as a movable platform and waveguide coupled to a fixed platform and another waveguide. A flexure connected between two platforms corrects offset alignment errors along the centerline axis of the flexure. Thermal distortion is corrected also by varying the relative size of the two platforms and the addition of slots and/or extraneous waveguides. A waveguide may be sandwiched between two matching materials, with or without an extra thermal compensation layer portion. A method uses simple processes to build a substrate with matching waveguides on each side of the substrate. Another simple method creates a suspended structure by using simple semiconductor processes.