Abstract: A pixel define layer and manufacturing method thereof and the related light emitting display are disclosed. The pixel define layer is arranged on a conductive layer of a substrate and comprises a base film layer. The base film layer has a plurality of openings each of which corresponds to a light-emitting region of a sub-pixel unit. A spacing base body is formed between the adjacent openings. An upper surface of each spacing base body is coated with a hydrophobic quantum dot material and a side wall of each opening is coated with a hydrophilic quantum dot material. With the pixel define layer and manufacturing method thereof and the related light emitting display according to embodiments of the disclosure, the ink within the sub-pixel would not ooze to the outside of the sub-pixel to result in color mixture between the adjacent sub-pixels, and the light emitting region within the pixel would not be decreased. By selecting suitable quantum dot materials, the photochromic efficiency can be improved.

Abstract: A vertical MOS transistor includes a substrate having therein a first source/drain region and a first ILD layer. A nanowire is disposed in the first ILD layer. A lower end of the nanowire is in direct contact with the first source/drain region, and an upper end of the nanowire is coupled with a second source/drain region. The second source/drain region includes a conductive layer. A gate electrode is disposed in the first ILD layer. The gate electrode surrounds the nanowire. A contact hole is disposed in the first ILD layer. The contact hole exposes a portion of the first source/drain region. A contact plug is disposed in the contact hole. A second ILD layer covers the first ILD layer.

Abstract: Small size chip handling and electronic component integration are accomplished using handle fixturing to transfer die or other electronic components from a full area array to a targeted array. Area array dicing of a thinned device wafer on a handle wafer/panel may be followed by selective or non-selective de-bonding of targeted die or electronic components from the handle wafer and optional attachment to a carrier such as a transfer head or tape. Alignment fiducials may facilitate precision alignment of the transfer head or tape to the device wafer and subsequently to the targeted array. Alternatively, the dies or other electronic elements are transferred selectively from either a carrier or the device wafer to the targeted array.

Abstract: A semiconductor device includes a first dielectric layer on a substrate, a hard mask layer on the first dielectric layer, a trench in the hard mask layer and the first dielectric layer, a first source/drain electrode layer on a sidewall of the trench, a second dielectric layer on the first source/drain electrode layer in the trench, a second source/drain electrode layer on the second dielectric layer in the trench, a third dielectric layer on the second source/drain electrode layer in the trench, a 2D material layer overlying the hard mask layer, the first source/drain electrode layer, the second dielectric layer, the second source/drain electrode layer, and the third dielectric layer, a gate dielectric layer on the 2D material layer, and a gate electrode on the gate dielectric layer.

Abstract: A thermal tag for activity monitoring. The thermal tag includes a base layer having a plurality of metal lines to provide a conductive path, and a pattern layer having one or more infrared emitting features positioned over portions of the conductive path, wherein at least one infrared emitting feature couples to the conductive path to emit a predetermined infrared pattern in accordance with nearby activity.

Abstract: A bonded structure contains a substrate containing at least one feature, the substrate having a top surface; a first release layer overlying the top surface of the substrate, the first release layer being absorptive of light having a first wavelength for being decomposed by the light; an adhesive layer overlying the first release layer, and a second release layer overlying the adhesive layer. The second release layer is absorptive of light having a second wavelength for being decomposed by the light having the second wavelength. The bonded structure further contains a handle substrate that overlies the second release layer, where the handle substrate is substantially transparent to the light having the first wavelength and the second wavelength. Also disclosed is a debonding method to process the bonded structure to remove and reclaim the adhesive layer for re-use. In another embodiment a multi-step method optically cuts and debonds a bonded structure.

Abstract: A method of forming an electrical device is provided that includes forming microprocessor devices on a microprocessor die; forming memory devices on an memory device die; forming component devices on a component die; and forming a plurality of packing devices on a packaging die. Transferring a plurality of each of said microprocessor devices, memory devices, component devices and packaging components to a supporting substrate, wherein the packaging components electrically interconnect the memory devices, component devices and microprocessor devices in individualized groups. Sectioning the supporting substrate to provide said individualized groups of memory devices, component devices and microprocessor devices that are interconnected by a packaging component.

Abstract: A light-emitting device comprises a semiconductor stack comprising a first semiconductor layer, a second semiconductor layer, and an active layer formed between the first semiconductor layer and the second semiconductor layer; a first pad on the semiconductor stack; a second pad on the semiconductor stack, wherein the first pad and the second pad are separated from each other with a distance, which define a region between the first pad and the second pad on the semiconductor stack; and multiple vias penetrating the active layer to expose the first semiconductor layer, wherein the first pad and the second pad are formed on regions other than the multiple vias.

Abstract: The present invention provides a socket wrench, including a main body and a control sleeve. The main body includes a socket end and a connection end. The socket end is configured to be connected with a fastener. The connection end is configured to be connected with the insertion portion. The connection end includes at least one first through hole. At least one positioning member is movably restricted within the at least one first through hole. The control sleeve is movably assembled to the connection end. The control sleeve includes a first portion and a second portion. The first portion has at least one receiving hole which is selectively correspondable to the at least one first through hole. The first portion is inserted into the second portion. The at least one receiving hole is disposed inside the second portion.

Abstract: Provided is a method for evaluating the risk of drug hypersensitivity reaction induced by antibiotics sulfamethoxazole and/or trimethoprim. The drug hypersensitivity reaction comprises: maculopapular eruption, fixed drug eruption, Stevens-Johnson Syndrome, toxic epidermal necrolysis, drug rash with eosinophilia and systemic symptoms. A specific HLA genotype is associated with the drug hypersensitivity reaction induced by the antibiotics sulfamethoxazole and/or trimethoprim.

Abstract: A method for monitoring paging messages in a mobile station with a subscriber identity card camping on a cell is provided. A paging message from the cell is monitored at a set of M predetermined time intervals. A first paging message with a first subscriber identity information being successively broadcasted in the paging channel at a Nth predetermined time interval and a (N+i)th predetermined time interval of the set of M predetermined time intervals is determined. A second paging message with a second subscriber identity information being successively broadcasted in the paging channel at the Nth predetermined time interval and a (N+j)th predetermined time interval of the set of M predetermined time intervals is determined, wherein j>i. The paging channel is monitored at a (N+i)th predetermined time interval and a (N+j)th predetermined time interval of following predetermined time intervals subsequent to the M predetermined time intervals.

Abstract: A voice coil motor includes a holder, a metal yoke, a carrier, a plurality of magnets, a coil and at least two spring plates. The holder includes a first opening and a cylindrical sidewall disposed around the first opening. The metal yoke coupled to the holder includes a second opening and a front end portion. The cylindrical sidewall extends from the first opening towards the second opening. The carrier movably disposed in the metal yoke includes a covering portion disposed on one side of the carrier towards the holder and correspondingly to the cylindrical sidewall, wherein the covering portion surrounds the cylindrical sidewall and farther from the first opening than the cylindrical sidewall. The magnets are disposed in the metal yoke. The coil is wound around the carrier and adjacent to the magnets. Each of the spring plates is flat sheet and coupled to the carrier.

Abstract: A light-emitting device comprises a semiconductor stack comprising a first semiconductor layer, a second semiconductor layer, and an active layer formed between the first semiconductor layer and the second semiconductor layer; a first pad electrically connected to the first semiconductor layer; a second pad comprising multiple sidewalls electrically connected to the second semiconductor layer; and a metal layer formed on the semiconductor stack, wherein the metal layer surrounds the multiple sidewalls of the second pad and the metal layer is separated from the second pad.

Abstract: A semiconductor package structure includes a first insulating layer, a first conductive layer, a multi-layered circuit structure, a protection layer, and a semiconductor chip electrically connected to the multi-layered circuit structure. The first insulating layer defines a first through hole extending through the first insulating layer. The first conductive layer includes a conductive pad disposed in the first through hole and a trace disposed on an upper surface of the first insulating layer. The multi-layered circuit structure is disposed on an upper surface of the first conductive layer. The multi-layered circuit structure includes a bonding region disposed on the conductive pad of the first conductive layer and an extending region disposed on the trace of the first conductive layer. The protection layer covers the upper surface of the first insulating layer and the extending region of the multi-layered circuit structure, and exposes the bonding region of the multi-layered circuit structure.

Abstract: A compound and pharmaceutically acceptable salts thereof for treating cancer, having a structure represented by the following formula (I) or formula (II): in which X and Y each individually represent: R1, R2, R3, R4, and R5 individually represents hydrogen atom, acyl having 20 or less carbon atoms, alkyl having 20 or less carbon atoms, alkanoyl having 20 or less carbon atoms, aroyl having 20 or less carbon atoms, aryl having 20 or less carbon atoms, aralkyl having 20 or less carbon atoms, sulfonyl having 20 or less carbon atoms, phosphonyl having 20 or less carbon atoms, or haloacyl having 20 or less carbon atoms.

Abstract: An electric nail gun structure is disclosed. A gun head seat body is formed into a structure with inner and outer cover layers, allowing a rotating rod and a slide piece moving a pull nail linearly to be configured inside it; the gun head seat body is formed completely by having a steel sleeve with equidistantly spaced slide chutes on the inside thereof covered with a plastic contact layer, where the slide chutes allows projecting ribs configured on the steel slide piece to be in engagement therewith so that a stable and safe nail pull operation can be obtained. Furthermore, a length extensible and width adjustable auxiliary handle rod is configured on the outside of the gun head seat body allowing nail gun seat bodies for all kinds of electric, pneumatic drills to be operated conveniently and safely with one single hand.

Abstract: A light-emitting device includes a semiconductor structure comprising a surface and a side wall inclined to the surface, wherein the semiconductor structure comprises a first semiconductor layer, a second semiconductor layer on the first semiconductor layer, and an active layer between the first semiconductor layer and the second semiconductor layer, and the second semiconductor layer comprises a first edge and a first area; and a reflective layer located on the semiconductor structure and comprising an outer edge and a second area; wherein a distance between the first edge and the outer edge is between 0 ?m and 10 ?m, and the second area of the reflective layer is not less than 80% of the first area of the second semiconductor layer.

Abstract: Provided is a barrier film which includes an organo-silicon polymeric composition having Si3—N4 bonds and Si—OH bonds. The peak height of Si4—N4 bonds in an infrared absorption spectrum is represented by A, and the peak height of Si—OH bonds in the infrared absorption spectrum is represented by B; and a ratio of A to B is greater than 2.

Abstract: A method of manufacturing a multi-layer wafer is provided. The method comprises applying at least one stress compensating polymer layer to at least one of two heterogeneous wafers and low temperature bonding the two heterogeneous wafers to bond the stress compensating polymer layer to the other of the two heterogeneous wafers to form a multi-layer wafer pair. The multi-layer wafer comprises two heterogeneous wafers, at least one of the heterogeneous wafers having a stress compensating polymer layer. The two heterogeneous wafers are low temperature bonded together to bond the stress compensating polymer layer to the other of the two heterogeneous wafers.

Abstract: A device wafer is bonded to a handle by a low temperature adhesive bond material that includes a suspended polymer with glass transition temperature greater than room temperature and a diluent polymer that is curable to provide a thermoset polymer upon exposure to ultraviolet radiation, x-ray radiation and/or thermal treatments at low temperature. The suspended polymer and the diluent polymer are mixed to a consistency such that before curing of the diluent polymer the low temperature adhesive bond material exhibits adhesion strength less than 10 Newtons per square centimeter (N/cm2), and after curing of the diluent polymer the low temperature adhesive bond material exhibits adhesion strength not less than about 40 N/cm2.