Abstract: A light emitting device including a substrate, a first electrode, a light emitting layer, a second electrode, a heat shrinkable film and a first adhesive layer is provided. The first electrode is disposed on the substrate. The light emitting layer is disposed on the first electrode. The second electrode is disposed on the light emitting layer. The first electrode, the light emitting layer, and the second electrode are sequentially stacked on the substrate to form a light emitting cell. The heat shrinkable film is disposed on the light emitting cell. The first adhesive layer is disposed between the heat shrinkable film and the second electrode.

Abstract: A controlling system and a controlling method for virtual display are provided. The controlling system for virtual display includes a visual line tracking unit, a space forming unit, a hand information capturing unit, a transforming unit and a controlling unit. The visual line tracking unit is used for tracking a visual line of a user. The space forming unit is used for forming a virtual display space according to the visual line. The hand information capturing unit is used for obtaining a hand location of the user's one hand in a real operation space. The transforming unit is used for transforming the hand location to be a cursor location in the virtual display space. The controlling unit is used for controlling the virtual display according to the cursor location.

Abstract: A camera driving module includes a base, a casing, a lens unit, a magnetic element, a coil, a spring and a damper agent. The base includes an opening. The casing is disposed on the base and includes a through hole and a broadwise notch structure. The broadwise notch structure is located nearby a periphery of the through hole. The lens unit is movably disposed on the casing and includes a protruding structure. The protruding structure is located at a periphery of the lens unit. The magnetic element is fixed to the casing and located at an inside the casing. The coil is fixed to the lens unit and located at an outside of the lens unit. The coil faces toward the magnetic element. The spring is disposed on the lens unit. The damper agent is disposed between the broadwise notch structure and the protruding structure.

Abstract: A technique relates to a semiconductor device. First nanowires are formed on a first substrate, the first nanowires being electrically coupled to one or more first electrical sites on the first substrate. Second nanowires are formed on a second substrate, the second nanowires being electrically coupled to one or more second electrical sites on the second substrate. The first nanowires and the second nanowires are electrically coupled such that the one or more first electrical sites are electrically coupled to the one or more second electrical sites.

Abstract: A method of manufacturing a magnetoresistive random access memory cell includes the following steps. A first dielectric layer including a first metal line therein is formed on a substrate. A patterned second dielectric layer is formed over the first dielectric layer, wherein the patterned second dielectric layer includes a recess exposing the first metal line. A barrier layer conformally covers the recess and the patterned second dielectric layer. A metal fills up the recess and on the barrier layer. The metal is planarized until the barrier layer being exposed by serving the barrier layer as a stop layer. A magnetic tunneling junction and a top electrode over the metal are formed, thereby a magnetoresistive random access memory cell being formed.

Abstract: A method of forming an electrical device is provided that includes forming microprocessor devices on a microprocessor die; forming memory devices on an memory device die; forming component devices on a component die; and forming a plurality of packing devices on a packaging die. Transferring a plurality of each of said microprocessor devices, memory devices, component devices and packaging components to a supporting substrate, wherein the packaging components electrically interconnect the memory devices, component devices and microprocessor devices in individualized groups. Sectioning the supporting substrate to provide said individualized groups of memory devices, component devices and microprocessor devices that are interconnected by a packaging component.

Abstract: A method for virtual reality (VR) or augmented reality (AR) includes sensing a relative angle between a reference direction defined by a first tracking device and a navigate direction defined by a second tracking device, calculating a viewing angle according to the relative angle between the reference direction and the navigate direction, and displaying a VR or AR environment in the corresponding viewing angle.

Abstract: An electronic device, an iris recognition method and a non-volatile computer-readable medium are provided. A processor in the electronic device obtains a first and second iris images, and calculates a plurality of first and second feature mark boxes that are non-uniformly arranged according to the first and second iris images. The processor uses the first feature mark boxes to obtain a first and second image features from the first and second iris images respectively, and compares the first and second image features to obtain a first recognition result. The processor uses the second feature mark boxes to obtain a third and fourth image features from the second and first iris images respectively, and compares the third and fourth image features to obtain a second recognition result. The processor determines a similarity degree of the first and second iris images according to the first and second recognition results.

Abstract: A light emitting device including a substrate, a first electrode, a light emitting layer, a second electrode, a heat shrinkable film and a first adhesive layer is provided. The first electrode is disposed on the substrate. The light emitting layer is disposed on the first electrode. The second electrode is disposed on the light emitting layer. The first electrode, the light emitting layer, and the second electrode are sequentially stacked on the substrate to form a light emitting cell. The heat shrinkable film is disposed on the light emitting cell. The first adhesive layer is disposed between the heat shrinkable film and the second electrode.

Abstract: A camera driving module includes a base, a casing, a lens unit, a magnetic element, a coil, a spring and a damper agent. The base includes an opening. The casing is disposed on the base and includes a through hole and a broadwise notch structure. The broadwise notch structure is located nearby a periphery of the through hole. The lens unit is movably disposed on the casing and includes a protruding structure. The protruding structure is located at a periphery of the lens unit. The magnetic element is fixed to the casing and located at an inside the casing. The coil is fixed to the lens unit and located at an outside of the lens unit. The coil faces toward the magnetic element. The spring is disposed on the lens unit. The damper agent is disposed between the broadwise notch structure and the protruding structure.

Abstract: A compound and pharmaceutically acceptable salts thereof for treating cancer, having a structure represented by the following formula (I) or formula (II): in which X and Y each individually represent: R1, R2, R3, R4, and R5 individually represents hydrogen atom, acyl having 20 or less carbon atoms, alkyl having 20 or less carbon atoms, alkanoyl having 20 or less carbon atoms, aroyl having 20 or less carbon atoms, aryl having 20 or less carbon atoms, aralkyl having 20 or less carbon atoms, sulfonyl having 20 or less carbon atoms, phosphonyl having 20 or less carbon atoms, or haloacyl having 20 or less carbon atoms.

Abstract: A lens assembly driving module includes a holder, a metal yoke, a lens unit, a magnet set, a coil, at least one elastic element and at least one damper agent. The metal yoke is coupled with the holder and includes a through hole and at least one extending structure. The extending structure is disposed around the through hole and extends along a direction from the through hole to the holder. The lens unit is movably disposed in the metal yoke. The lens unit includes an optical axis and at least one notch structure. The notch structure is disposed in an outer peripheral area of the lens unit and is corresponding to the extending structure. The damper agent is disposed between the extending structure of the metal yoke and the notch structure of the lens unit. The damper agent is applied to damp a movement of the lens unit.

Abstract: A thermal tag for activity monitoring. The thermal tag includes a base layer having a plurality of metal lines to provide a conductive path, and a pattern layer having one or more infrared emitting features positioned over portions of the conductive path, wherein at least one infrared emitting feature couples to the conductive path to emit a predetermined infrared pattern in accordance with nearby activity.

Abstract: Apparatus, systems, and methods for determining a temperature excursion are provided. In one example, a system can comprise a temperature switch component that experiences a temperature excursion associated with a metal alloy of the temperature switch component and one or more electrodes, wherein the temperature excursion is based on a temperature of the metal alloy exceeding a defined threshold value. Additionally, the system can comprise a radio frequency identification tag component that receives a signal, from an external reader device, utilized to determine that the temperature excursion has occurred based on a parameter change, associated with the temperature excursion, from a first parameter to a second parameter different than the first parameter.

Abstract: A method for forming metal contacts within a semiconductor device includes forming a first-layer contact into a first dielectric layer that surrounds at least one gate electrode, the first-layer contact extending to a doped region of an underlying substrate. The method further includes forming a second dielectric layer over the first dielectric layer and forming a second-layer contact extending through the second dielectric layer to the first-layer contact.

Abstract: A semiconductor light-emitting device includes a semiconductor stack including a first semiconductor layer, a second semiconductor layer, and an active layer; a plurality of first trenches penetrating the second semiconductor layer and the active layer to expose the first semiconductor layer; a second trench penetrating the second semiconductor layer and the active layer to expose the first semiconductor layer, wherein the second trench is disposed near an outmost edge of the active layer, and surrounds the active layer and the plurality of first trenches; a patterned metal layer formed on the second semiconductor layer and formed in one of the plurality of first trenches or the second trench; and a first pad portion and a second pad portion both formed on the second semiconductor layer and electrically connecting the second semiconductor layer and the first semiconductor layer respectively.

Abstract: A light-emitting device comprises a semiconductor structure comprising a surface and a side wall inclined to the surface, wherein the semiconductor structure comprises a first semiconductor layer, a second semiconductor layer on the first semiconductor layer, and an active layer between the first semiconductor layer and the second semiconductor layer, and the second semiconductor layer comprises a first edge and a first area; a reflective layer located on the second semiconductor layer and comprising an outer edge and a second area, wherein a distance between the first edge and the outer edge is greater than 0 ?m and is not greater than 10 ?m; and a first contact part comprising a metal formed on the reflective layer and the first semiconductor layer, wherein the first contact part comprises a first periphery comprising a first periphery length larger than a periphery length of the active layer from a top-view of the light-emitting device.

Abstract: A semiconductor device and method of forming the same, the semiconductor device includes a substrate, first plug, a magnetoresistive random access memory (MRAM) structure, a spacer layer, a seal layer and a first conductive pattern. The substrate has a first region and a second region, and the first plug is disposed on a dielectric layer disposed on the substrate, within the first region. The MRAM structure is disposed in the dielectric layer and electrically connected to the first plug. The spacer layer is disposed both within the first region and the second region, to cover the MRAM structure. The seal layer is disposed on the MRAM structure and the first plug, only within the first region. The first conductive pattern penetrates through the seal layer to electrically connect the MRAM structure.

Abstract: A tool holder device includes a receptacle having two conduits perpendicular to each other, a spindle and a shaft are rotatably engaged in the conduits of the receptacle and have bevel gears meshed with each other for allowing the shaft to be rotated relative to the receptacle by the spindle, a housing is secured to the receptacle, a flexible shank is secured to the spindle, a stem is secured to the flexible shank, a flexible sheath is engaged onto the flexible shank and is secured to the receptacle, and a control ferrule is secured to the flexible sheath, and the stem is rotatably received and engaged in the control ferrule. The flexible shank and the flexible sheath allow the tool holder device to be easily operated by the user in a tiny working space.

Abstract: A lens driving apparatus includes a holder, a metal cover, a carrier, a sensing magnet, a printed circuit board, a position sensor, a coil and at least one driving magnet. The metal cover is coupled with the holder and has an opening. The carrier is assembled to a lens assembly having an optical axis, wherein the carrier is disposed in the metal cover and is movable along a direction parallel to the optical axis. The sensing magnet is coupled with the carrier. The printed circuit board is disposed near to one of the four lateral sides of the holder. The position sensor is disposed on the printed circuit board and corresponds to the sensing magnet. The coil is disposed on an outer surface of the carrier. One of the driving magnet is disposed in the metal cover and corresponds to the coil.