Patents by Inventor Wen Lin

Wen Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240139262
    Abstract: The present disclosure relates to a complex probiotic composition and a method for improving exercise performance of a subject with low intrinsic aerobic exercise capacity. The complex probiotic composition, which includes Lactobacillus rhamnosus GKLC1, Bifidobacterium lactis GKK24 and Clostridium butyricum GKB7, administered to the subject with the low intrinsic aerobic exercise capacity in a continuation period, can effectively reduce serum lactic acid and serum urea nitrogen after aerobic exercise, reduce proportion of offal fat and/or increase liver and muscle glycogen contents, thereby being as an effective ingredient for preparation of various compositions.
    Type: Application
    Filed: October 13, 2023
    Publication date: May 2, 2024
    Inventors: Chin-Chu CHEN, Yen-Lien CHEN, Shih-Wei LIN, Yen-Po CHEN, Ci-Sian WANG, Yu-Hsin HOU, Yang-Tzu SHIH, Ching-Wen LIN, Ya-Jyun CHEN, Jia-Lin JIANG, You-Shan TSAI, Zi-He WU
  • Publication number: 20240138326
    Abstract: A control method for preparing crop nutrient solution, applied in a regulating device, obtains growth data of crops, and determines a growth state of the crops according to the growth data of the crops. The proportion of the nutrient solution required by the crops is determined according to the growth states of the crops, and the culture solution is adjusted according to the proportion of the nutrient solution. After a preset time period, updated growth state of the crops is determined. When the culture solution does not meet the proportion of the nutrient solution corresponding to the updated growth state, the culture solution is adjusted again until the culture solution meet the proportion of the nutrient solution corresponding to the growth state of the crops.
    Type: Application
    Filed: March 28, 2023
    Publication date: May 2, 2024
    Inventors: YU-SHAN LIN, CHIEN-HAO SU, KAI-SIANG YOU, YAO-WEN TUNG
  • Publication number: 20240147376
    Abstract: Apparatus and methods are provided for thermal throttling for UE configured with multi-panel transceiving on FR2. In one novel aspect, the UE prioritizes throttling actions based on signal qualities of each transceiving panel. In one embodiment, the switching to the target panel from the active panel is selected as the highest priority throttling action when the signal quality of the target panel is similar to the active panel. In another embodiment, the UE further determines if the quality of the target panel is sufficient to support mmW transceiving before switching to the target panel. In one embodiment, the UE reduces one or more antennae of an active panel when the signal quality difference between the active panel and the target panel is bigger than a predefined gap threshold.
    Type: Application
    Filed: September 22, 2023
    Publication date: May 2, 2024
    Inventors: Chih-Chieh Lai, Feng-Wen Weng, Yu-Hung Huang, Chi-Hsiang Lin
  • Publication number: 20240145327
    Abstract: A semiconductor device includes a substrate, an interconnect structure, and conductive vias. The substrate has a first side, a second side and a sidewall connecting the first side and the second side, wherein the sidewall includes a first planar sidewall of a first portion of the substrate, a second planar sidewall of a second portion of the substrate and a curved sidewall of a third portion of the substrate, where the first planar sidewall is connected to the second planar sidewall through the curved sidewall. The interconnect structure is located on the first side of the substrate, where a sidewall of the interconnect structure is offset from the second planar sidewall. The conductive vias are located on the interconnect structure, where the interconnect structure is located between the conductive vias and the substrate.
    Type: Application
    Filed: December 27, 2023
    Publication date: May 2, 2024
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chang-Jung Hsueh, Cheng-Nan Lin, Wan-Yu Chiang, Wei-Hung Lin, Ching-Wen Hsiao, Ming-Da Cheng
  • Publication number: 20240143880
    Abstract: A method includes determining a first timing of a transition sequence of a signal on a first path of an integrated circuit (IC) design, the first timing being based on an IC design signoff voltage, determining a second timing of the transition sequence of the signal on the first path, the second timing being based on the signoff voltage and a first voltage drop along the first path, calculating a first path derating factor based on a timing gap between the first and second timings of the transition sequence, and using the first path derating factor to evaluate the IC design.
    Type: Application
    Filed: January 27, 2023
    Publication date: May 2, 2024
    Inventors: Yu-Wen LIN, Bogdan TUTUIANU, Florentin DARTU, Wei-Chih HSIEH, Osamu TAKAHASHI
  • Publication number: 20240145398
    Abstract: A carrier structure is provided, in which at least one positioning area is defined on a chip-placement area of a package substrate, and at least one alignment portion is disposed on the positioning area. Therefore, the precision of manufacturing the alignment portion is improved by disposing the positioning area on the chip-placement area, such that the carrier structure can provide a better alignment mechanism for the chip placement operation.
    Type: Application
    Filed: December 8, 2022
    Publication date: May 2, 2024
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Cheng-Liang HSU, Wan-Rou CHEN, Hsin-Yin CHANG, Tsung-Li LIN, Hsiu-Jung LI, Chiu-Lien LI, Fu-Quan XU, Yi-Wen LIU, Chih-Chieh SUN
  • Publication number: 20240144575
    Abstract: A 3D image sensing device includes a first camera lens, a second camera lens and a light source. A 3D image processing method for the 3D image sensing device includes the following steps. Firstly, a target is photographed by the first camera lens and the second camera lens, and the obtained images are processed in a stereo vision mode. Consequently, a first depth map is obtained. After the light source emits plural feature points to the target, the target is photographed by the first camera lens and the second camera lens, and the obtained images are processed in an active stereo vision mode. Consequently, a second depth map is obtained. The first depth map and the second depth map are synthesized as a synthesized depth map according to a synthetization strategy.
    Type: Application
    Filed: January 17, 2023
    Publication date: May 2, 2024
    Inventors: HSIU-WEN WANG, CHIH-WEN LIN
  • Publication number: 20240144585
    Abstract: A computing device obtains an image depicting a face of a user. The computing device identifies facial features in the image and extracts characteristics of the facial features in the image. The computing device generates a two-dimensional (2D) face chart based on the facial feature characteristics. The computing device predicts a skin tone of the user's face depicted in the image of the user and changes color in a color map of a predefined three-dimensional (3D) model based on the predicted skin tone. The computing device selects a predefined environment map based on characteristics in the image depicting the face of the user and generates a target face image based on the predefined 3D model.
    Type: Application
    Filed: October 26, 2023
    Publication date: May 2, 2024
    Inventors: I-Ting SHEN, Yi-Wei LIN, Pei-Wen HUANG
  • Patent number: 11973050
    Abstract: Various embodiments of the present disclosure are directed towards an integrated chip. The integrated chip includes an interconnect structure overlying a semiconductor substrate and comprising a conductive wire. A passivation structure overlies the interconnect structure. An upper conductive structure overlies the passivation structure and comprises a first conductive layer, a dielectric layer, and a second conductive layer. The first conductive layer is disposed between the dielectric layer and the passivation structure. The second conductive layer extends along a top surface of the dielectric layer and penetrates through the first conductive layer and the passivation structure to the conductive wire.
    Type: Grant
    Filed: June 2, 2021
    Date of Patent: April 30, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tzu-Yu Lin, Yao-Wen Chang, Chia-Wen Zhong, Yen-Liang Lin
  • Publication number: 20240138098
    Abstract: A centrifugal heat dissipation fan of a portable electronic device. The centrifugal heat dissipation fan includes a hub, multiple metal blades, and at least one ring. The metal blades are disposed surrounding the hub. The metal blades include multiple radial dimensions, and the structure of the metal blade with a shorter radial dimension is a part of the structure of the metal blade with a longer radial dimension. The metal blades having different radial dimensions form at least two ring areas, and the distribution numbers of the metal blades in the at least two ring areas are different from each other. The ring surrounds the hub and connects the metal blades.
    Type: Application
    Filed: October 12, 2023
    Publication date: April 25, 2024
    Applicant: Acer Incorporated
    Inventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Kuang-Hua Lin, Wei-Chin Chen, Yu-Ming Lin
  • Publication number: 20240136481
    Abstract: A micro light-emitting diode display device includes a substrate, a first planarization layer, a first light-emitting element, and a second planarization layer. The first planarization layer is disposed on the substrate and has a first opening. The first opening has a first opening inner wall. The first light-emitting element is disposed on the substrate, in the first opening, and separated from the first opening inner wall. The second planarization layer is disposed on the substrate and between the first planarization layer and the first light-emitting element. The second planarization layer is in contact with the first light-emitting element.
    Type: Application
    Filed: October 18, 2023
    Publication date: April 25, 2024
    Inventors: Bin-Cheng LIN, Chieh-Ming Chen, Bo-Ru Jian, Chi-Sheng Liao, Ta-Wen Liao
  • Patent number: 11966133
    Abstract: An electronic device is disclosed. The electronic device includes a substrate, a plurality of color filters disposed on the substrate, an optical film disposed on the plurality of color filter, and a defect disposed between the substrate and the optical film. The optical film has a first base, a protective layer on the first base, and a second base between the first base and the protective layer and having a first processed area. In a top view of the electronic device, the first processed area corresponds to the defect and at least partially overlaps at least two color filters.
    Type: Grant
    Filed: May 18, 2023
    Date of Patent: April 23, 2024
    Assignee: INNOLUX CORPORATION
    Inventors: Tai-Chi Pan, Chin-Lung Ting, I-Chang Liang, Chih-Chiang Chang Chien, Po-Wen Lin, Kuang-Ming Fan, Sheng-Nan Chen
  • Patent number: 11966077
    Abstract: A light emission apparatus includes a laser diode configured to emit a light; a laser driver electrically coupled to the laser diode, the laser driver being configured to drive the laser diode to generate the light; and an optical module arranged to receive the light emitted by the laser diode, the optical module comprising at least one optical element and being configured to adjust the light and emits a transmitting light; wherein the transmitting light emits from the optical module with an illumination angle and the optical module adjusts the light to vary the illumination angle.
    Type: Grant
    Filed: July 8, 2019
    Date of Patent: April 23, 2024
    Assignee: Artilux, Inc.
    Inventors: Yun-Chung Na, Chien-Lung Chen, Chieh-Ting Lin, Yu-Yi Hsu, Hui-Wen Chen, Bo-Jiun Chen, Shih-Tai Chuang
  • Patent number: 11968800
    Abstract: A centrifugal heat dissipation fan including a housing and an impeller is provided. The housing has at least one inlet disposed along an axis and at least one first outlet and a second outlet located in different radial directions, wherein the first outlet and the second outlet are opposite to and separated from each other. The impeller is disposed in the housing along the axis. A heat dissipation system of an electronic device is also provided.
    Type: Grant
    Filed: May 23, 2023
    Date of Patent: April 23, 2024
    Assignee: Acer Incorporated
    Inventors: Tsung-Ting Chen, Wen-Neng Liao, Cheng-Wen Hsieh, Yu-Ming Lin, Wei-Chin Chen, Kuang-Hua Lin, Sheng-Yan Chen
  • Patent number: 11968869
    Abstract: An electronic device includes a flexible substrate and a conductive wire. The conductive wire is disposed on the flexible substrate and includes a metal portion and a plurality of openings disposed in the metal portion. The metal portion includes a plurality of extending portions and a plurality of joint portions, and each of the openings is surrounded by two of the plurality of extending portions and two of the plurality of joint portions. A ratio of a sum of widths of the plurality of extending portions to a sum of widths of the plurality of joint portions is in a range from 0.8 to 1.2.
    Type: Grant
    Filed: April 28, 2022
    Date of Patent: April 23, 2024
    Assignee: InnoLux Corporation
    Inventors: Ya-Wen Lin, Chien-Chih Chen, Yen-Hsi Tu, Cheng-Wei Chang, Shu-Hui Yang
  • Patent number: 11963969
    Abstract: Provided is a pharmaceutical composition including gastrodin and a use thereof for the prevention or the treatment of amyotrophic lateral sclerosis. The pharmaceutical composition is effective in reducing neuronal axon degeneration and neurofibromin accumulation, improving symptoms of amyotrophic lateral sclerosis and extending life of patients of amyotrophic lateral sclerosis.
    Type: Grant
    Filed: September 16, 2022
    Date of Patent: April 23, 2024
    Assignee: BUDDHIST TZU CHI MEDICAL FOUNDATION
    Inventors: Chia-Yu Chang, Shinn-Zong Lin, Hsiao-Chien Ting, Hui-I Yang, Horng-Jyh Harn, Hong-Lin Su, Ching-Ann Liu, Yu-Shuan Chen, Tzyy-Wen Chiou, Tsung-Jung Ho
  • Patent number: 11966544
    Abstract: An electronic device may have a display with touch sensors. One or more shielding layers may be interposed between the display and the touch sensors. The display may include transistors with gate conductors, a first planarization layer formed over the gate conductors, one or more contacts formed in a first source-drain layer within the first planarization layer, a second planarization layer formed on the first planarization layer, one or more data lines formed in a second source-drain layer within the second planarization layer, a third planarization layer formed on the second planarization layer, and a data line shielding structure formed at least partly in a third source-drain layer within the third planarization layer. The data line shielding structure may be a routing line, a blanket layer, a mesh layer formed in one or more metal layers, and/or a data line covering another data line.
    Type: Grant
    Filed: May 25, 2023
    Date of Patent: April 23, 2024
    Assignee: Apple Inc.
    Inventors: Shinya Ono, Suhwan Moon, Dong-Gwang Ha, Jiaxi Hu, Hao-Lin Chiu, Kwang Soon Park, Hassan Edrees, Wen-I Hsieh, Jiun-Jye Chang, Chin-Wei Lin, Kyung Wook Kim
  • Patent number: 11966153
    Abstract: A wavelength conversion module includes a driving element, a wavelength conversion wheel, and at least one flow guide. The wavelength conversion wheel includes a rotary disc and at least one wavelength conversion layer. The driving element is connected to the rotary disc to drive the wavelength conversion wheel to rotate along an axis of the driving element as a central axis. The flow guide is disposed beside the wavelength conversion wheel at intervals along the axis, and at least one airflow channel is formed between the flow guide and the wavelength conversion wheel. The flow guide and the driving element are disposed at intervals, and the flow guide does not contact the rotary disc and the driving element. An orthographic projection of the flow guide on the rotary disc overlaps the wavelength conversion layer. When the wavelength conversion wheel rotates, the wavelength conversion wheel and the flow guide move relatively.
    Type: Grant
    Filed: April 14, 2022
    Date of Patent: April 23, 2024
    Assignee: Coretronic Corporation
    Inventors: Ming-Feng Hou, Shi-Wen Lin, Shih-Hang Lin
  • Publication number: 20240125849
    Abstract: An RF testing method is applied between a testing instrument and multiple devices under test at least including a first DUT and a second DUT. The testing instrument includes a signal generator and a signal analyzer. A sync signal is sent to the testing instrument and the first DUT, so that the first DUT occupies the signal generator to receive a testing signal from the signal generator. The first DUT sends an uplink signal to the signal analyzer based on the testing signal to occupy the signal analyzer for signal analysis at a first point in time. The sync signal is sent to the testing instrument and the second DUT, so that the second DUT occupies the signal generator to receive the testing signal from the signal generator at a second point in time. The first point in time is parallel to the second point in time.
    Type: Application
    Filed: March 8, 2023
    Publication date: April 18, 2024
    Inventors: Jung-Yin CHIEN, Po-Yen TSENG, Pin-Lin HUANG, Wen-Chih CHEN
  • Patent number: 11961769
    Abstract: A method of forming an integrated circuit, including forming a n-type doped well (N-well) and a p-type doped well (P-well) disposed side by side on a semiconductor substrate, forming a first fin active region extruded from the N-well and a second fin active region extruded from the P-well, forming a first isolation feature inserted between and vertically extending through the N-well and the P-well, and forming a second isolation feature over the N-well and the P-well and laterally contacting the first and the second fin active regions.
    Type: Grant
    Filed: November 7, 2022
    Date of Patent: April 16, 2024
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
    Inventors: Kuo-Hsiu Hsu, Yu-Kuan Lin, Feng-Ming Chang, Hsin-Wen Su, Lien Jung Hung, Ping-Wei Wang