Abstract: A heat dissipation module, configured for heat dissipation of at least one first heat source and at least one second heat source, and including a first heat sink, a second heat sink, a first pipe, and a second pipe, is provided. The first heat sink and the first heat source are connected to each other through the first pipe to form a first loop, so that a liquid medium flows through the first heat sink for heat exchange and then flows to the first heat source for circulating heat dissipation. The second heat sink and the second heat source are connected to each other through the second pipe to form a second loop, so that the liquid medium flows through the second heat sink for heat exchange and then flows to the second heat source for circulating heat dissipation. A projection device, including the heat dissipation module, is also provided.

Abstract: A method for retrieving information about similar medical devices is provided, which includes the following steps: obtaining a first technical context of a specific medical device; utilizing a first machine-learning model to extract one or more technical items of the specific medical device based on technical content of the first technical context; utilizing the first machine-learning model to generate candidate medical devices using the technical items; searching a database for device information about the candidate medical devices; retrieving summary files of the candidate medical devices from the database based on the device information; utilizing the first machine-learning model to infer a second technical context of each candidate medical device; and determining a most similar medical device for the specific medical device according to a similarity score for each candidate medical device calculated from the second technical context and the first technical context using a second machine-learning model.

Abstract: An electronic device includes a flexible substrate and a conductive wire structure. The conductive wire structure is disposed on the flexible substrate and includes a first segment, a second segment, a third segment, a fourth segment, a first joint portion, a second joint portion, a third joint portion and a fourth joint portion. A first opening is surrounded by the first segment, the second segment, the first joint portion and the second joint portion. A second opening is surrounded by the third segment, the fourth segment, the third joint portion and the fourth joint portion. Along a first direction, a ratio of a first width sum of widths of the first segment, the second segment, the third segment and the fourth segment to a second width sum of widths of the first joint portion and the third joint portion is in a range from 0.8 to 1.2.

Abstract: A controller device receives, from a plurality of assisted replication network devices, respective utilization information associated with the plurality of assisted replication network devices. The controller device generates, based on the respective utilization information associated with the plurality of assisted replication network devices, load balancing information for a network device associated with two or more assisted replication network devices of the plurality of assisted replication network devices, and sends, to the network device, the load balancing information. The network selects, based on the load balancing information, a particular assisted replication network device of the two or more assisted replication network devices.

Abstract: A food status recognition and display system and a food status recognition and display method are provided. The food status recognition and display system includes a camera and light source module, a processing module and a display interface. The camera and light source module faces a food storage environment. After the camera and light source module photographs at least one food item using the light beams in a visible light band, a near-infrared light band and a short-wave infrared light band, respective food photography results are obtained. The processing module receives the food photography results. After the food photography results are processed through an image recognition process, a vegetation index formula, a vegetation water content formula and a vegetation correlation analysis formula, at least one corresponding food status information is generated and then transmitted.

Abstract: A method, computer system, and a computer program product for improving debugging speed by rearranging debugging priority functions. In one embodiment, runtime input may be received about a program to be debugged. Feedback information is obtained about at least one similar program previously debugged. The compiling time information and runtime information are analyzed to determine a status of functions including one or more focused functions that will be used frequently and one or more unreachable functions that may never will be executed. A priority list of debugging functions is generated based on the feedback information, the runtime input and a function status. A plurality of debugging information are rearranged and parsed on the priority list prior to said program being debugged based on said debugging information.

Abstract: The present invention discloses a data access interface unit comprising: a physical storage device controller for receiving a first control signal from a first storage virtualization controller, and accordingly determining the first storage virtualization controller as the primary controller, and generating a first selection signal; a selector for receiving the first selection signal, and accordingly selecting data and signals from the first storage virtualization controller; and a clock generation circuit for providing a dedicated clock signal to the physical storage device, where when the physical storage device controller receives a re-set signal from a second storage virtualization controller, the physical storage device controller determines the second storage virtualization controller as the new primary controller, and accordingly generates a second selection signal so as to control the selector to select data and signals from the second storage virtualization controller.

Abstract: An air conditioning system includes: an air conditioner box, an upper deck main air duct, and two upper deck transition air ducts. The air conditioner box is disposed on a body of a double-deck vehicle, and includes two upper deck air outlets. The upper deck main air duct is disposed at a top of an upper deck of the body of the double-deck vehicle, and includes two upper deck air inlets. The two upper deck air outlets and the two upper deck air inlets are staggered in a horizontal direction. Each of the two upper deck transition air ducts is communicated with one of the two upper deck air outlets and one of the two upper deck air inlets. Inner walls of the two upper deck transition air ducts are in smooth transition with inner walls of the two upper deck air outlets and the two upper deck air inlets.

Abstract: A device, a method and a storage medium for accelerating activation function in relation to data processing by artificial neural network provides a register for storing a storage table, a matching unit including a plurality of comparators, a logic unit, and a selection unit. The comparators compare an input variable of the activation function with the variable intervals of the activation function to obtain a comparison output result, the logic unit performs a logical operation according to the comparison output result to obtain a logic output result and determines a variable interval to be calculated according to the logic output. The selection unit queries the storage table according to the variable interval to be calculated and obtains parameters of fitted quadratic function. A calculation unit performs calculations on the input variable according to the parameters.

Abstract: Present disclosure provides a semiconductor structure. The semiconductor structure includes a semiconductor fin and a metal gate. The semiconductor fin has a first portion and a second portion over the first portion. A height of the second portion is greater than a width of the second portion. The metal gate has a bottom portion, an upper portion, and a lateral portion connecting the bottom portion and the upper portion. The bottom portion is between the first portion and the second portion of the semiconductor fin, and the upper portion is over the second portion of the semiconductor fin.

Abstract: A light homogenizing module, including a light homogenizing element and a light shielding element, is provided. The light homogenizing element includes a light incident surface and an axis perpendicular to the light incident surface. The light shielding element is disposed on a side of the light incident surface. The light shielding element includes a first reflection portion, at least one second reflection portion, and a light entrance. The first reflection portion surrounds the light entrance. The second reflection portion has a first end portion and a second end portion opposite to each other. The first end portion is connected to the first reflection portion. The second end portion is farther away from the light homogenizing element than the first reflection portion. The light entrance exposes the light incident surface. An extension direction of the first reflection portion is parallel to the light incident surface.

Abstract: A method of forming an electronic device including: providing an assembly, wherein the assembly includes a substrate, an optical film, a plurality of color filters and a defect, wherein the plurality of color filters and the defect are disposed between the substrate and the optical film; and using a laser pulse to form a first processed area that corresponds to the defect in the optical film, wherein the first processed area at least partially overlaps at least two of the plurality of color filters.

Abstract: A method for forming a semiconductor structure is provided. The method includes forming a semiconductor fin structure including first semiconductor layers and second semiconductor layers alternatingly stacked, laterally recessing the first semiconductor layers of the semiconductor fin structure to form first notches in the first semiconductor layers, forming first passivation layers on first sidewalls of the first semiconductor layers exposed from the first notches, and forming first inner spacer layers in the first notches.

Abstract: A 3D image sensing device includes a first camera lens, a second camera lens and a light source. A 3D image processing method for the 3D image sensing device includes the following steps. Firstly, a target is photographed by the first camera lens and the second camera lens, and the obtained images are processed in a stereo vision mode. Consequently, a first depth map is obtained. After the light source emits plural feature points to the target, the target is photographed by the first camera lens and the second camera lens, and the obtained images are processed in an active stereo vision mode. Consequently, a second depth map is obtained. The first depth map and the second depth map are synthesized as a synthesized depth map according to a synthetization strategy.

Abstract: An example computing device includes a flexible display coupled to a housing that includes a support plate having a first joint coupled to a first end of the support plate and a second joint coupled to a second end of the support plate. A slide module has a slot that guides a slide movement of the second joint along a path of movement within the slot as the support plate pivots about the first joint, where the support plate moves according to the first joint and the second joint to support at least the portion of the flexible display when the flexible display is unfolded and moves according to the first joint and the second joint to create a gap between at least a portion of the support plate and at least the portion of the flexible display when the flexible display is folded.

Abstract: A network device may originate a route, and may designate the route as a first colored route having a first color. The network device may advertise the first colored route to a first intermediate network device to cause the first intermediate network device to propagate the first colored route to an ingress network device over a first colored border gateway protocol session. The network device may designate the route as a second colored route having a second color, and may advertise the second colored route to a second intermediate network device to cause the second intermediate network device to propagate the second colored route to the ingress network device over a second colored border gateway protocol session.

Abstract: A pixel package includes an electrode structure, a plurality of light-emitting units arranged on the electrode structure, and a light transmitting layer. The electrode structure has an upper layer with a first upper sheet, a lower layer with a first lower sheet, and a supporting layer arranged between the upper layer and the lower layer. The electrode structure and the plurality of light-emitting units are fully embedded in the light transmitting layer. In a top view of the pixel package, the first upper sheet is overlapped with and larger than the first lower sheet.

Abstract: A semiconductor package and a manufacturing method thereof are provided. The semiconductor package includes a first semiconductor die, a second semiconductor die, a molding compound, a heat dissipation module and an adhesive material. The first and second semiconductor dies are different types of dies and are disposed side by side. The molding compound encloses the first and second semiconductor dies. The heat dissipation module is located directly on and in contact with the back sides of the first and second semiconductor dies. The adhesive material is filled and contacted between the heat dissipation module and the molding compound. The semiconductor package has a central region and a peripheral region surrounding the central region. The first and second semiconductor dies are located within the central region. A sidewall of the heat dissipation module, a sidewall of the adhesive material and a sidewall of the molding compound are substantially coplanar.

Abstract: Semiconductor structures and methods of fabrication are provided. A method according to the present disclosure includes receiving a workpiece that includes an active region over a substrate and having first semiconductor layers interleaved by second semiconductor layers, and a dummy gate stack over a channel region of the active region, etching source/drain regions of the active region to form source/drain trenches that expose sidewalls of the active region, selectively and partially etching second semiconductor layers to form inner spacer recesses, forming inner spacer features in the inner spacer recesses, forming channel extension features on exposed sidewalls of the first semiconductor layers, forming source/drain features over the source/drain trenches, removing the dummy gate stack, selectively removing the second semiconductor layers to form nanostructures in the channel region, forming a gate structure to wrap around each of the nanostructures. The channel extension features include undoped silicon.