Abstract: A reading method and a reading device for a two-dimensional code. The method includes: capturing a two-dimensional code image through an image capturing device; detecting an outer frame and a position mark of a two-dimensional code in a skewed state in the two-dimensional code image; restoring the two-dimensional code in the skewed state to a default state; and performing a default operation according to the two-dimensional code in the default state.

Abstract: A filter medium contamination detection structure may comprise a filter element and a prompt assembly. The prompt assembly may comprise a first pressure sensor, which may comprise a signal output end, and a second pressure sensor, which may comprise a signal output end. The first pressure sensor may be connected to a water inlet of the filter element, and the second pressure sensor may be connected to a water outlet of the filter element or outside air. The signal output ends of the first pressure sensor and the second pressure sensor may be connected to a signal input end of a controller. When the filter element is dirty, a pressure at the water inlet end may increase or a pressure at the water outlet end may decrease, and the difference between the first sensor and the second pressure sensor may increase.

Abstract: Disclosed in a robotic arm with vibration detection and image recognition, of which a main structure includes a wafer transportation device, a robotic arm rotatably mounted on the wafer transportation device, an image acquiring device arranged on the robotic arm, at least one first vibration detector arranged on the robotic arm, a second vibration detector arranged in an interior of the wafer transportation device, and a monitoring device arranged at one side of the wafer transportation device. The monitoring device includes a status inspecting part in information connection with the image acquiring device and a vibration inspecting part in information connection with the first vibration detector and the second vibration detector. By means of the above structure, the robotic arm is additionally provided with functions of wafer storage status inspecting, impact sensing, and lifespan predicting, so as to prevent mutual influence between machine structure operation instability and inspection error.

Abstract: A device and a method for robotic arm automatic correction are disclosed. A main structure includes a robotic arm including an optical photographing mechanism, and a wafer storage mechanism at one side of the robotic arm and including a graphic data code. The optical photographing mechanism is in information connection with an optical recognition module that includes a data code analysis unit, an object distance analysis unit, and a wafer center analysis unit. A user uses the optical photographing mechanism to photograph the graphic data code for implementing a first round of position correction for the robotic arm. Then, the optical photographing mechanism photographs a wafer and performs an operation of focusing for calculation of a distance between the robotic arm and a center point of the wafer by means of the object distance analysis unit in combination with the wafer center analysis unit for a second round of correction.

Abstract: An image quality evaluation system includes an image calibration device, an image capturing device, and a processing device. The image calibration device is placed in a scene and used for displaying a calibration pattern. The capturing device captures a first comparison image of the scene and the calibration pattern. The processing device is configured to obtain the first comparison image and a reference image containing the calibration pattern and compare the calibration pattern in the first comparison image and the reference image to generate calibration information. After being calibrated according to the calibration information, the image capturing device captures a second comparison image of the scene and the calibration pattern, and the processing device compares the calibration pattern in the second comparison image and the reference image to generate an image quality evaluation result.

Abstract: An electronic device includes a conductive wire having a metal portion with openings. The openings include a first opening and a second opening arranged along a first direction, and the metal portion includes the first to fourth extending portions and the first to fourth joint portions. The first opening is surrounded by the first extending portion, the second extending portion, the first joint portion, and the second joint portion. The second opening is surrounded by the third extending portion, the fourth extending portion, the third joint portion, and the fourth joint portion. Along the first direction, a ratio of a first width sum of widths of the first extending portion, the second extending portion, the third extending portion, and the fourth extending portion to a second width sum of widths of the first joint portion and the third joint portion is in a range from 0.8 to 1.2.

Abstract: There is provided an auto detection system including a thermal detection device and a host. The host controls an indication device to indicate a prompt message or detection results according to a slope variation of voltage values or 2D distribution of temperature values detected by the thermal detection device, wherein the voltage values include the detected voltage of a single pixel or the sum of detected voltages of multiple pixels of a thermal sensor.

Abstract: A head-up display system including a polarizing optical engine and a first rotatable diffuser is provided. The polarizing optical engine is configured to provide a polarized image beam. The first rotatable diffuser is disposed on a path of the polarized image beam and configured to rotate when the polarized image beam passes through the first rotatable diffuser. The first rotatable diffuser is made of isotropic material, and the polarized image beam from the first rotatable diffuser obliquely strikes a windshield and is then reflected by the windshield to an eye of a user.

Abstract: Implementations of the present disclosure include an electronic system assembly including a first circuit board including a first set of electronic components. The electronic system assembly includes a first housing containing the first circuit board and a second circuit board including a second set of electronic components. The electronic system assembly further includes a first connector shield having first sidewalls defining a first cavity, the first sidewalls having a first end abutting a first surface of the first circuit board and a second end abutting a second surface of the second circuit board. A first electrical connection extends through the first cavity and electrically coupling the first set of electronic components with the second set of electronic components.

Abstract: Systems and methods of inspecting a sample using a charged-particle beam apparatus with enhanced probe current and high current density of the primary charged-particle beam are disclosed. The apparatus includes a charged-particle source, a first condenser lens configured to condense the primary charged-particle beam and operable in a first mode and a second mode, wherein: in the first mode, the first condenser lens is configured to condense the primary charged-particle beam, and in the second mode, the first condenser lens is configured to condense the primary charged-particle beam sufficiently to form a crossover along the primary optical axis. The apparatus further includes a second condenser lens configured to adjust a first beam current of the primary charged-particle beam in the first mode and adjust a second beam current of the primary charged-particle beam in the second mode, the second beam current being larger than the first beam current.

Abstract: Gate spacer that improves performance and methods for fabricating such are disclosed herein. An exemplary device includes a gate stack disposed over a semiconductor layer and a gate spacer disposed on a sidewall of the gate stack. A source/drain feature is disposed in the semiconductor layer and adjacent the gate spacer. A low-k contact etch stop layer is disposed on a top surface and a sidewall of the gate spacer and a portion of the gate spacer is disposed between the low-k contact etch stop layer and the semiconductor layer. A source/drain contact is disposed on the source/drain feature and adjacent the low-k contact etch stop layer.

Abstract: A light-emitting module including a substrate, a plurality of light-emitting elements, a window plate, and an encapsulant is provided. The light-emitting elements are disposed on the substrate and have a plurality of light colors. The window plate is disposed on light-emitting surfaces of the light emitting elements. The encapsulant wraps the light-emitting elements and surrounds the window plate. A front-lit liquid-crystal-on-silicon module is also provided.

Abstract: The disclosure provides a method for querying data across a plurality of distributed databases. The method includes receiving a query at a local coordinator of a local database cluster. The method further includes sending the query to a remote coordinator of a remote database cluster. The method further includes retrieving, by each local segment of a plurality of local segments of the local database cluster, data responsive to the query from corresponding one or more remote segments of the remote database cluster associated with the local segment. The method further includes sending a response to the query based on the data responsive to the query from each of the corresponding one or more remote segments.

Abstract: An imaging lens assembly module includes an imaging lens element set, a light folding element and a plate-shaped light blocking element. The imaging lens element set has an optical axis, and includes a lens element. The light folding element is configured to fold the optical axis at least once, and includes an incident surface, an exit surface and an optical reflecting surface. The plate-shaped light blocking element keeps an air distance between the plate-shaped light blocking element and the light folding element, and includes two layered structures and columnar air structures. The layered structures are corresponding to the light folding element. The columnar air structures are farther away from the light folding element than a surface of the plate-shaped light blocking element from the light folding element, and the surface of the plate-shaped light blocking element faces toward the light folding element.

Abstract: Present disclosure provides a method including: forming a semiconductor stack having at least one SiGe layer; forming a plurality of fins from the semiconductor stack by a first etching operation, each of the plurality of fins comprising a first portion and a second portion over the first portion, the first portion being separated from the second portion by a SiGe portion; forming a poly gate stripe orthogonally over the plurality of fins; forming a recess on each of the plurality of fins abutting the poly gate; recessing the SiGe portion by a second etching operation through the recess; forming a first spacer and a second spacer to surround the SiGe portion; and removing the SiGe portion.

Abstract: A heat dissipation module, including a fan and a heat dissipation fin set, is provided. The fan has an air outlet side and an air inlet side opposite to each other. The heat dissipation fin set is configured at the air outlet side and includes a base, first heat dissipation fins, and second heat dissipation fins. The base is divided into a first area and a second area along a direction of a rotation axis of the fan. The first area is located between the air outlet side and the second area. The first heat dissipation fins are connected to the base and located in the first area, and arranged at equal intervals in a configuration direction perpendicular to the direction of the rotation axis. The second heat dissipation fins are connected to the base and located in the second area, and arranged at equal intervals in the configuration direction.

Abstract: A contamination prompt structure for a filter medium may comprise a filter element and a prompt assembly. The prompt assembly may have a movable part. One end of the movable part may be in communication with one of a water inlet of the filter element, or a water outlet of the filter element, and the other end of the movable part may be in communication with the other one of the water inlet of the filter element, the water outlet of the filter element, or outside air. When the filter element is in a contaminated state, a rise of pressure at the water inlet or a drop of pressure at the water outlet may drive the movable part to move to send a prompt for a user to replace the filter element.

Abstract: Different services through Virtual Routing and Forwarding instances (VRFs) are identified without needing a Multiprotocol Label Switching (MPLS) label or a Virtual Extensible Local Area Network (VXLAN) Network Identifier (VNI) by using, for example, different UDP port numbers to identify different connectivity services (e.g., customers, VRFs) when IP-in-IP (also referred to as IP over UDP) is used as a tunneling mechanism (e.g., in the data center).

Abstract: A foldable device may include a foldable layer and a hinge mechanism. The hinge mechanism may include at least one gear module that provides for synchronized movement of the hinge mechanism about a central plane of the hinge mechanism. A lock module may be coupled the hinge mechanism. The lock module may include a cam and a plate including a plurality of recesses. The lock module may selectively lock the hinge mechanism, and the foldable device, in one of a plurality of positions, based on a position of the cam in one of the recesses.

Abstract: A projection device includes a light source module, an optical engine module, a projection lens, a housing, and at least one first heat dissipating element. The housing comprises a first end and a second end opposite to each other. The at least one first heat dissipating element is disposed in the housing, and each of the at least one first heat dissipating element includes a first plate portion, a second plate portion, and a first fin portion. The first plate portion is connected to the light source module. The second plate portion is connected to the first plate portion. The first fin portion is connected to the second plate portion and includes a plurality of first fins arranged at intervals. These first fins are arranged between the first end and the second end.