Patents by Inventor Wen Lin

Wen Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220050025
    Abstract: A field surveying and regulating method applied on at least one monitoring electronic device enables at least one manager to add at least one project and at least one specific location (spot) for obtaining soil samples and to edit the at least one project and the at least one spot on an online map. The method allows the manager to assign at least one soil drill and at least one drill operator for each project and each spot. The method enables the manager to view information as to position of each soil drill, depth for sampling by each soil drill, sampling time spent, actual work done by each soil drill, and photos of work by each soil drill in sampling. A related field surveying and regulating system is also disclosed.
    Type: Application
    Filed: July 7, 2021
    Publication date: February 17, 2022
    Inventors: CHING-WEN LIN, WEI-CHEN SU
  • Publication number: 20220037171
    Abstract: A wafer cleaning module and a method for cleaning a wafer with the wafer cleaning module are disclosed. For example, the wafer cleaning module includes a wafer chuck to hold a wafer, an ozone source to provide ozone gas towards the wafer, and an ultraviolet (UV) lamp module to provide UV light. The UV lamp module includes a UV light source and a rotatable reflector around the UV light source. The rotatable reflector is movable to adjust an amount of UV light directed towards a surface of the wafer.
    Type: Application
    Filed: July 30, 2020
    Publication date: February 3, 2022
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Chen-Yang LIN, Chung-Hsuan LIU, Ku-Hsiang SUNG, Kuan-Wen LIN, Chia-Jen CHEN, Hsin-Chang LEE
  • Publication number: 20220036780
    Abstract: An electrical conductivity test structure for testing an electrical conductivity of target traces in a display panel includes a controller, a first conductive layer, and a second conductive layer. The first conductive layer includes first and second traces. The at least one first trace and the at least one second trace are connected in parallel. Each first trace connects with the target trace and with the controller and each second trace connects with the target trace and with the controller. The second conductive layer connects with the first trace but is electrically insulated from the second trace. The second conductive layer transmits test signals to the first trace to test electrical conductivity between the controller and the target trace.
    Type: Application
    Filed: March 19, 2021
    Publication date: February 3, 2022
    Inventors: QI XU, RUI LI, YUAN XIONG, HUI WANG, WEN-LIN CHEN, CHIH-CHUNG LIU
  • Publication number: 20220034591
    Abstract: A liquid cooling device includes a first liquid cooling row having a first inflow end and a first outflow end for liquid to flow in a first direction, a second liquid cooling row having a second inflow end and a second outflow end, and a fan. The second liquid cooling row is disposed opposite to the first liquid cooling row. The second inflow end is connected to the first outflow end for the liquid flowing out from the first outflow end to flows in a second direction opposite to the first direction. Airflow generated by the fan sequentially flows through the second and first liquid cooling rows to cool the liquid. A projection device having the liquid cooling device is also provided.
    Type: Application
    Filed: July 26, 2021
    Publication date: February 3, 2022
    Inventors: SHI-WEN LIN, PEI-RONG WU
  • Patent number: 11238790
    Abstract: A method for driving a high-frequency display applied in a display apparatus with a border of reduced size selects one horizontal scan line for scanning during a selecting period. The signals of the selected horizontal scan line and two following horizontal lines adjacent to the selected horizontal scan line are made effective during a first sub-period. The signals of the selected horizontal scan line and a following horizontal scan line adjacent to the selected horizontal scan line are made effective during a second sub-period following. The signals of the selected horizontal scan line are made effective during a third sub-period following the second.
    Type: Grant
    Filed: December 10, 2020
    Date of Patent: February 1, 2022
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Yu-Fu Weng, Chien-Wen Lin, Tzu-Yu Cheng
  • Patent number: 11238770
    Abstract: Present disclosure discloses a display screen module and a display screen, which includes a front panel, a rear panel and a circuit module. The circuit module includes a driving device, a plurality of display assemblies and a substrate located between the front panel and the rear panel. The substrate includes a first mounting plate and second mounting plate which are integrated. The second mounting plate is formed by extension from one end of the first mounting plate along a horizontal direction. Each of the plurality of display assemblies includes a plurality of lamp beads provided at intervals on the substrate along an extension direction of the second mounting plate and facing the front panel. The driving device is arranged on the first mounting plate and partially protrudes from the rear panel. A size of the driving device is less than or equal to a size of the first mounting plate.
    Type: Grant
    Filed: October 24, 2019
    Date of Patent: February 1, 2022
    Assignee: LEYARD VTEAM (SHENZHEN) CO., LTD
    Inventors: Shenghe Wang, Wen Lin, Zhenlong Li, Dacheng An, Guoshi Yang, Azhen Chu, Wei Liu, Xiaohong Zou, Junfeng Yang
  • Publication number: 20220027128
    Abstract: Configurable specialized processing blocks, such as DSP blocks, are described that implement fixed and floating-point functionality in a single mixed architecture on a programmable device. The described architecture reduces the need to construct floating-point functions outside the configurable specialized processing block, thereby minimizing hardware cost and area. The disclosed architecture also introduces pipelining into the DSP block in order to ensure the floating-point multiplication and addition functions remain in synchronicity, thereby increasing the maximum frequency at which the DSP block can operate. Moreover, the disclosed architecture includes logic circuitry to support floating-point exception handling.
    Type: Application
    Filed: October 4, 2021
    Publication date: January 27, 2022
    Inventors: Keone Streicher, Martin Langhammer, Yi-Wen Lin, Hyun Yi
  • Publication number: 20220026787
    Abstract: A projector cooling system, including a casing, a first heat generating component, and a second heat generating component, is provided. The first heat generating component and the second heat generating component are sequentially disposed in the casing along an anti-gravity direction. A temperature of the first heat generating component is lower than a temperature of the second heat generating component. The projector cooling system of the invention is adapted to introduce more cooling airflow without using a moving part, thereby reducing the temperatures of the heat generating components.
    Type: Application
    Filed: May 11, 2021
    Publication date: January 27, 2022
    Applicant: Coretronic Corporation
    Inventors: Yi-Han Lai, Shi-Wen Lin, Tsung-Ching Lin
  • Patent number: 11226659
    Abstract: An electronic device includes a host, a display, a sliding plate, and a keyboard. The host has an operating surface. The display is pivoted to the host. The sliding plate is slidably disposed in the host, where the display is mechanically coupled to the sliding plate, and the sliding plate includes a plat portion and a recess portion that are arranged side by side. The keyboard is integrated to the host. The keyboard includes a key structure, where the key structure includes a key cap and a reciprocating element, and the key cap is exposed from the operating surface of the host. The reciprocating element is disposed between the key cap and the sliding plate and has a first end connected to the key cap and a second end contacting the sliding plate. The second end is located on a sliding path of the plat portion and the recess portion.
    Type: Grant
    Filed: October 16, 2020
    Date of Patent: January 18, 2022
    Assignee: Acer Incorporated
    Inventors: Hung-Chi Chen, Shun-Bin Chen, Huei-Ting Chuang, Yen-Chieh Chiu, Yu-Wen Lin, Yen-Chou Chueh, Po-Yi Lee
  • Publication number: 20220006531
    Abstract: The present application provides an optical network method and associated apparatus. The method includes: receiving uplink burst time assignment information; and enabling or disabling a laser module of a local end according to the uplink burst time assignment information.
    Type: Application
    Filed: May 25, 2021
    Publication date: January 6, 2022
    Inventors: HUNG-WEN LIN, MU-JUNG HSU
  • Patent number: 11211455
    Abstract: Embodiments of mechanisms for forming dislocations in source and drain regions of finFET devices are provided. The mechanisms involve recessing fins and removing the dielectric material in the isolation structures neighboring fins to increase epitaxial regions for dislocation formation. The mechanisms also involve performing a pre-amorphous implantation (PAI) process either before or after the epitaxial growth in the recessed source and drain regions. An anneal process after the PAI process enables consistent growth of the dislocations in the source and drain regions. The dislocations in the source and drain regions (or stressor regions) can form consistently to produce targeted strain in the source and drain regions to improve carrier mobility and device performance for NMOS devices.
    Type: Grant
    Filed: July 20, 2020
    Date of Patent: December 28, 2021
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun Hsiung Tsai, Wei-Yuan Lu, Chien-Tai Chan, Wei-Yang Lee, Da-Wen Lin
  • Publication number: 20210397928
    Abstract: A device, a method and a storage medium for accelerating activation function in relation to data processing by artificial neural network provides a register for storing a storage table, a matching unit including a plurality of comparators, a logic unit, and a selection unit. The comparators compare an input variable of the activation function with the variable intervals of the activation function to obtain a comparison output result, the logic unit performs a logical operation according to the comparison output result to obtain a logic output result and determines a variable interval to be calculated according to the logic output. The selection unit queries the storage table according to the variable interval to be calculated and obtains parameters of fitted quadratic function. A calculation unit performs calculations on the input variable according to the parameters.
    Type: Application
    Filed: June 22, 2021
    Publication date: December 23, 2021
    Inventors: TA-WEI CHAN, HUNG-WEN LIN
  • Patent number: 11206378
    Abstract: A camera module aligning method includes the following steps. Firstly, a reference chart having plural chart characteristic points is provided. Then, a camera module is used to shoot the reference chart, and an installation position and an installation posture of the camera module are acquired according to an internal parameter matrix and an external parameter matrix. When the camera module shoots the reference chart and an image is formed on an imaging plane of the camera module, a relationship between at least one image characteristic point of the image and the corresponding chart characteristic point complies with a standard relationship. The standard relationship is defined by the internal parameter matrix and the external parameter matrix.
    Type: Grant
    Filed: June 24, 2020
    Date of Patent: December 21, 2021
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Hsiu-Wen Wang, Chih-Wen Lin
  • Publication number: 20210391056
    Abstract: Big data health service method and system based on remote fundus screening are provided. The method includes steps of: acquiring information to be analyzed sent by remote terminal agency; pre-interpreting information to be analyzed, and judging whether information to be analyzed is qualified; extracting characteristic data from information to be analyzed if it is qualified, and forming structured quantitative index; sorting and analyzing characteristic data and quantitative index according to knowledge calculation model to obtain analysis conclusion; and storing information to be analyzed, characteristic data, quantitative index, and analysis conclusion into pre-designed database.
    Type: Application
    Filed: December 27, 2018
    Publication date: December 16, 2021
    Applicant: FUZHOU YIYING HEALTH TECHNOLOGY CO., LTD.
    Inventors: LUN YU, YING-QIANG QIU, JIA-WEN LIN, XIN-RONG CAO, LI-NA WANG, Lin-Jie OU, Lan-Yan XUE
  • Patent number: 11197853
    Abstract: Described herein are compounds and compositions for treating glaucoma and/or reducing intraocular pressure. Compositions may comprise an isoquinoline compound and a prostaglandin or a prostaglandin analog. Compounds described herein include those in which an isoquinoline compound is covalently linked to a prostaglandin or a prostaglandin analog, and those in which an isoquinoline compound and a prostaglandin free acid together form a salt.
    Type: Grant
    Filed: April 23, 2021
    Date of Patent: December 14, 2021
    Assignee: Aerie Pharmaceuticals, Inc.
    Inventors: Casey Kopczynski, Cheng-Wen Lin, Jill Marie Sturdivant, Mitchell A. deLong
  • Patent number: 11197901
    Abstract: The present invention provides an active substance of Lactic Acid Bacteria, a composition comprising thereof and its use for promoting longevity, especially for increasing Cisd2 gene expression, reducing mitochondrial damage and delaying aging conditions such as nerve degeneration and sarcopenia.
    Type: Grant
    Filed: August 15, 2019
    Date of Patent: December 14, 2021
    Assignee: GRAPE KING BIO LTD.
    Inventors: Chin-Chu Chen, Yen-Lien Chen, Shin-Wei Lin, Yen-Po Chen, Ci-Sian Wang, Yu-Hsin Hou, Yang-Tzu Shih, Ching-Wen Lin, Ya-Jyun Chen, Jia-Lin Jiang
  • Patent number: 11194238
    Abstract: A heat dissipation module includes a housing, at least one inlet, at least one outlet and at least one heat dissipation set. The housing includes a partition dividing the housing, such that a first accommodation space and a second accommodation space are formed inside the housing. At least one opening is disposed in the partition, penetrates through the partition and communicates the first accommodation space with the second accommodation space. The inlet is connected to the housing and communicates with the first accommodation space. The outlet is connected to the housing and communicates with the second accommodation space. The heat dissipation set is located in the second accommodation space. A projection apparatus is also provided. The heat dissipation module and the projection apparatus may effectively exhaust the heat accumulated on the at least one heat dissipation set, which facilitates reducing a temperature of a heat source with high heat-density.
    Type: Grant
    Filed: March 27, 2020
    Date of Patent: December 7, 2021
    Assignee: Coretronic Corporation
    Inventors: Wei-Chi Liu, Tsung-Ching Lin, Shi-Wen Lin
  • Publication number: 20210373628
    Abstract: An electronic device that includes a first device portion, a second device portion coupled to the first device portion, and a uni-directional thermally conductive connector coupled to the first device portion and the second device portion. The first device portion comprises a region that includes a component configured to generate heat. The uni-directional thermally conductive connector is configured to dissipate heat away from the first device portion and towards the second device portion. The uni-directional thermally conductive connector includes a thermally conductive material that primarily dissipates heat along a first direction of the thermally conductive material.
    Type: Application
    Filed: November 10, 2020
    Publication date: December 2, 2021
    Inventors: Hung-Wen LIN, Sin-Shong WANG, Keith WANG, Ajit Kumar VALLABHANENI, Jen-Chun CHANG
  • Publication number: 20210375724
    Abstract: A package structure is provided. The package structure includes a first interconnect structure formed over a first substrate. The package structure also includes a second interconnect structure formed below a second substrate. The package structure further includes a bonding structure between the first interconnect structure and the second interconnect structure. In addition, the bonding structure includes a first intermetallic compound (IMC) and a second intermetallic compound (IMC). The bonding structure also includes an underfill layer surrounding the bonding structure. A width of the first IMC is greater than a width of the second IMC, and the underfill layer covers a sidewall of the first IMC and a sidewall of the second IMC.
    Type: Application
    Filed: August 16, 2021
    Publication date: December 2, 2021
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Tung-Liang SHAO, Wen-Lin SHIH, Su-Chun YANG, Chih-Hang TUNG, Chen-Hua YU
  • Publication number: 20210375766
    Abstract: A semiconductor device includes a semiconductor substrate, a dielectric structure, an electrical insulating and thermal conductive layer and a circuit layer. The electrical insulating and thermal conductive layer is disposed over the semiconductor substrate. The dielectric structure is disposed over the electrical insulating and thermal conductive layer, wherein a thermal conductivity of the electrical insulating and thermal conductive layer is substantially greater than a thermal conductivity of the dielectric structure. The circuit layer is disposed in the dielectric structure.
    Type: Application
    Filed: May 28, 2020
    Publication date: December 2, 2021
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chih-Hang Tung, Chen-Hua Yu, Tung-Liang Shao, Su-Chun Yang, Wen-Lin Shih