Patents by Inventor Wen Lin

Wen Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8584160
    Abstract: An object recognition and event representation system includes: a server and a broadcaster, coupled to the server. In response to a request from the broadcaster, the server sends an event metadata and a recognition data. Based on the event metadata and the recognition data, the broadcaster simultaneously performs a live video broadcasting and a real-time object recognition. If the broadcaster recognizes an object, the broadcaster sends a recognition result to the server.
    Type: Grant
    Filed: August 24, 2012
    Date of Patent: November 12, 2013
    Assignee: Quanta Computer Inc.
    Inventors: Ting-Han Huang, Kang-Wen Lin, Juin-Yi Huang, Chia-Yi Wu, Yu-Chen Huang, Ching-Fan Chu, Po-Chih Tsai, Tung-Jen Tsai
  • Patent number: 8573794
    Abstract: A backlight module includes a heat-dissipating element, at least one light-emitting element disposed on a first side of the heat-dissipating element, a back plate, and a heat-insulation element. The back plate has at least one opening and is disposed on the first side of the heat-dissipating element, and the back plate is not overlapped with the light-emitting element. The heat-insulation element is disposed between the back plate and the heat-dissipating element for reducing heat conduction between the back plate and the heat-dissipating element so as to prevent the heat generated by the light-emitting element from being conducted to the back plate.
    Type: Grant
    Filed: March 7, 2011
    Date of Patent: November 5, 2013
    Assignee: Young Lighting Technology Inc.
    Inventors: Hung-Chih Lin, Yi-Wen Lin
  • Patent number: 8573811
    Abstract: A backlight module includes a light guide plate, a back plate, a heat-dissipating element, a light-emitting element, and at least one high-performance heat sink. The heat-dissipating element is disposed adjacent to a light incident surface of the light guide plate, and the heat-dissipating element has a bottom portion and a side portion forming an angle with the bottom portion. The light-emitting element is disposed on one side of the heat-dissipating element facing the light guide plate. The high-performance heat sink is disposed on the back plate, one end of the high-performance heat sink overlaps the heat-dissipating element, and another end of the high-performance heat sink extends away from the light-emitting element.
    Type: Grant
    Filed: March 28, 2011
    Date of Patent: November 5, 2013
    Assignee: Young Lighting Technology Inc.
    Inventors: Hung-Chih Lin, Yi-Wen Lin
  • Publication number: 20130286682
    Abstract: A lighting device and a back light module therewith are disclosed. The back light module includes a light-guiding structure and a lighting device. The light-guiding structure includes two light-guiding parts and a reflection sheet disposed therebetween. The lighting device is disposed close to the light-guiding structure and includes an insulation carrier and two light sources disposed on the insulation carrier. The insulation carrier includes a positioning groove structure where an edge of the reflection sheet is disposed such that the two light sources correspond to the two light-guiding parts respectively and light emitted by the two light sources is capable of entering the corresponding light-guiding parts.
    Type: Application
    Filed: July 16, 2012
    Publication date: October 31, 2013
    Applicant: AU OPTRONICS CORP.
    Inventors: Chung-Wen Lin, Yu-Ling Hsiao, Shih-Ting Chen, Yuan-Yu Chien
  • Publication number: 20130285098
    Abstract: A patterned substrate includes a substrate and a plurality of protrusions. The protrusions are formed on the substrate. Each protrusion has a top face and a base. Each pair of immediately adjacent protrusions is minimally parted by 0 to 0.2 ?m. When the distance between the adjacent protrusions falls as 0 ?m, the bases thereof contact each other. A horizontal and a vertical light emitting diode structures using the patterned substrate are also discussed.
    Type: Application
    Filed: April 26, 2013
    Publication date: October 31, 2013
    Applicant: CRYSTALWISE TECHNOLOGY INC
    Inventors: BO-WEN LIN, SHIH-CHIEH HSU, CHUN-YEN PENG, WEN-CHING HSU
  • Publication number: 20130280876
    Abstract: A method of forming an integrated circuit includes providing a semiconductor wafer including a semiconductor fin dispatched on a surface of the semiconductor wafer; forming a dopant-rich layer having an impurity on a top surface and sidewalls of the semiconductor fin, wherein the impurity is of n-type or p-type; performing a knock-on implantation to drive the impurity into the semiconductor fin; and removing the dopant-rich layer.
    Type: Application
    Filed: June 14, 2013
    Publication date: October 24, 2013
    Inventors: Chun Hsiung Tsai, Chien-Tai Chan, Mao-Rong Yeh, Da-Wen Lin
  • Publication number: 20130277742
    Abstract: A semiconductor structure comprises a substrate having a first conductive type; a deep well having a second conductive type formed in the substrate and extending down from a surface of the substrate; a first well having the first conductive type and a second well having the second conductive type both formed in the deep well and extending down from the surface of the substrate, and the second well spaced apart from the first well; a gate electrode formed on the substrate and disposed between the first and second wells; an isolation extending down from the surface of the substrate and disposed between the gate electrode and the second well; a conductive plug including a first portion and a second portion electrically connected to each other, and the first portion electrically connected to the gate electrode, and the second portion penetrating into the isolation.
    Type: Application
    Filed: April 24, 2012
    Publication date: October 24, 2013
    Applicant: UNITED MICROELECTRONICS CORP.
    Inventors: Chiu-Te Lee, Ke-Feng Lin, Shu-Wen Lin, Kun-Huang Yu, Chih-Chung Wang, Te-Yuan Wu
  • Publication number: 20130281320
    Abstract: The present invention provides methods of screening an agent for an activity in an isolated organ, e.g., eye, from a teleost, e.g., zebrafish. Methods of isolating eyes from zebrafish are provided. Methods of screening an agent for an ocular activity in the isolated eye are provided. Methods of screening an agent for an ocular activity in a model of ocular disease or disorder are provided. Methods of screening an agent for an ocular activity in the isolated eye and for screening the agent for cell death and/or toxic activity in the eye or other organ or tissue are provided. The invention further provides high throughput methods of screening agents for an activity in isolated eyes of zebrafish in multi-well plates.
    Type: Application
    Filed: January 4, 2013
    Publication date: October 24, 2013
    Inventors: Patricia McGrath, Wen Lin Seng
  • Publication number: 20130283329
    Abstract: An object recognition and event representation system includes: a server and a broadcaster, coupled to the server. In response to a request from the broadcaster, the server sends an event metadata and a recognition data. Based on the event metadata and the recognition data, the broadcaster simultaneously performs a live video broadcasting and a real-time object recognition. If the broadcaster recognizes an object, the broadcaster sends a recognition result to the server.
    Type: Application
    Filed: August 24, 2012
    Publication date: October 24, 2013
    Applicant: Quanta Computer Inc.
    Inventors: Ting-Han Huang, Kang-Wen Lin, Juin-Yi Huang, Chia-Yi Wu, Yu-Chen Huang, Ching-Fan Chu, Po-Chih Tsai, Tung-Jen Tsai
  • Patent number: 8557659
    Abstract: The disclosure relates to spacer structures of a semiconductor device. An exemplary structure for a semiconductor device comprises a substrate having a first active region and a second active region; a plurality of first gate electrodes having a gate pitch over the first active region, wherein each first gate electrode has a first width; a plurality of first spacers adjoining the plurality of first gate electrodes, wherein each first spacer has a third width; a plurality of second gate electrodes having the same gate pitch as the plurality of first gate electrodes over the second active region, wherein each second gate electrode has a second width greater than the first width; and a plurality of second spacers adjoining the plurality of second gate electrodes, wherein each second spacer has a fourth width less than the third width.
    Type: Grant
    Filed: October 5, 2012
    Date of Patent: October 15, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Lee-Wee Teo, Ming Zhu, Hui-Wen Lin, Bao-Ru Young, Harry-Hak-Lay Chuang
  • Patent number: 8557692
    Abstract: A method of forming an integrated circuit includes providing a semiconductor wafer; and forming a fin field-effect transistor (FinFET) including implanting the semiconductor wafer using a hot-implantation to form an implanted region in the FinFET. The implanted region comprises a region selected from the group consisting essentially of a lightly doped source and drain region, a pocket region, and a deep source drain region.
    Type: Grant
    Filed: January 12, 2010
    Date of Patent: October 15, 2013
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chun Hsiung Tsai, Chien-Chang Su, Tsung-Hung Li, Da-Wen Lin, Wen-Sheh Huang
  • Patent number: 8558357
    Abstract: An image sensor package having at least one chip supporting bar secured to a top surface of an image sensor chip. The thickness of the chip supporting bar is absorbed within a vertical dimension of wire loops that connect bonding pads to leads so that the chip supporting bar does not contribute to the thickness of the image sensor package. An exposed back surface of the image sensor chip enhances thermal dissipation.
    Type: Grant
    Filed: March 13, 2009
    Date of Patent: October 15, 2013
    Assignee: Macronix International Co., Ltd.
    Inventors: Chen Jung Tsai, Chih-Wen Lin
  • Publication number: 20130258611
    Abstract: The fixing device includes a main body, at least two sliding location elements and at least one location element. The main body includes a bolting structure for bolting with a component element. The sliding location elements are disposed on one side of the main body opposite the bolting structure. Each sliding location element includes a connecting portion connected to the main body and an extending portion connected to the connecting portion. The extending portion is substantially parallel to the main body. A spacing is kept between the main body and the extending portion for clamping and fixing a printed circuit board. The at least one location element is extended from the main body and is substantially parallel to the extending portion. The at least one location element is disposed between the sliding location elements and the bolting structure for fixing the printed circuit board.
    Type: Application
    Filed: September 12, 2012
    Publication date: October 3, 2013
    Inventors: Jen-Kung LI, Wen-Lin WU
  • Publication number: 20130256805
    Abstract: A method of semiconductor fabrication including forming a first work function metal layer on a first region of the substrate and forming a metal layer on the first work function metal layer and on a second region of the substrate. A dummy layer is formed on the metal layer. The layers are then patterned to form a first gate structure in the first region and a second gate structure in the second region of the substrate. The dummy layer is then removed to expose the metal layer, which is treated. The treatment may be an oxygen treatment that allows the metal layer to function as a second work function layer.
    Type: Application
    Filed: March 30, 2012
    Publication date: October 3, 2013
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.,
    Inventors: Hak-Lay Chuang, Ming Zhu, Hui-Wen Lin, Bao-Ru Young
  • Publication number: 20130258586
    Abstract: The invention relates to a portable apparatus for storing and selectively positioning a portable electronic device in one of a plurality of viewing or operational positions. The apparatus has front and back covers and a connection member hingedly attached to each of the front and back covers. The front cover of the apparatus is preferably provided with bendable structures along first and second diagonals and a midline to provide a plurality of cover segments that can be arranged in different positions to form three-dimensional structures for supporting the device by folding or bending the front cover along the first and second diagonals and the midline. The back cover is adapted for removable interconnection with the electronic device.
    Type: Application
    Filed: February 20, 2013
    Publication date: October 3, 2013
    Applicant: AEVOE INTERNATIONAL LTD.
    Inventors: Tzu-Ching Shao, Li-Wen Lin
  • Patent number: 8544155
    Abstract: A safety hook includes a main body defining an inner space and an opening, a latch unit pivoted to the main body, an operable unit pivoted to the main body, and a safety lock unit. The latch unit is normally at a closed position for blocking the opening. When the operable unit is pressed, the safety lock unit is co-rotatable with the operable unit with respect to the main body from a locked position, where the safety lock unit abuts against the latch unit to retain the latch unit at the closed position, to an unlocked position, where the safety lock unit is removed from the latch unit to allow the latch unit to rotate from the closed position to an opened position allowing access into the inner space through the opening.
    Type: Grant
    Filed: December 19, 2012
    Date of Patent: October 1, 2013
    Assignee: Usang Industrial Co., Ltd.
    Inventor: Yu-Wen Lin
  • Patent number: 8549055
    Abstract: Digital signal processing (“DSP”) circuit blocks are provided that can more easily work together to perform larger (e.g., more complex and/or more arithmetically precise) DSP operations if desired. These DSP blocks may also include redundancy circuitry that facilitates stitching together multiple such blocks despite an inability to use some block (e.g., because of a circuit defect). Systolic registers may be included at various points in the DSP blocks to facilitate use of the blocks to implement systolic form, finite-impulse-response (“FIR”), digital filters.
    Type: Grant
    Filed: March 3, 2010
    Date of Patent: October 1, 2013
    Assignee: Altera Corporation
    Inventors: Keone Streicher, Martin Langhammer, Yi-Wen Lin, Wai-Bor Leung, David Lewis, Volker Mauer, Henry Y. Lui, Suleyman Sirri Demirsoy, Hyun Yi
  • Patent number: 8546046
    Abstract: A method for fabricating a bi-polar plate of a fuel cell and the bi-polar plate thereof are presented. A graphite film is formed first. Next, a polymeric material added with electrically conductive powder is coated on a surface of a metal substrate. The graphite film is disposed on the polymeric material and the polymeric material is hardened to form an adhesive layer, such that the graphite film is attached on the surface of the metal substrate.
    Type: Grant
    Filed: February 18, 2010
    Date of Patent: October 1, 2013
    Assignee: Industrial Technology Research Institute
    Inventors: Wen-Lin Wang, Chun-Hsing Wu, Kan-Lin Hsueh, Huan-Ruei Shiu, Wen-Chen Chang, Fang-Hei Tsau, Lung-Yu Sung
  • Publication number: 20130242376
    Abstract: A driving substrate is disclosed. The driving substrate includes a first substrate. The first substrate has a display zone and a border zone surrounding the display zone. The border zone includes at least one active area and at least one non-active area. The active area includes a first conductive layer disposed on the first substrate. The non-active area connects the active area to form the border zone. A display using the driving substrate is also disclosed.
    Type: Application
    Filed: December 16, 2012
    Publication date: September 19, 2013
    Applicant: E Ink Holdings Inc.
    Inventors: Chin-Wen LIN, Po-Hsin LIN, Chi-Liang WU, Ted-Hong SHINN
  • Publication number: 20130236116
    Abstract: A method and an apparatus for single-image-based rain streak removal are introduced herein. In this method and apparatus, an original image is decomposed into a high frequency part and a low frequency part, and the high frequency image is then decomposed into a rain part and a non-rain part. The non-rain high frequency image and the original low frequency image are used to produce a non-rain image.
    Type: Application
    Filed: July 18, 2012
    Publication date: September 12, 2013
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Li-Wei Kang, Chia-Wen Lin, Che-Tsung Lin, Yu-Chen Lin