Patents by Inventor Wen Lo

Wen Lo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 6358834
    Abstract: A method of forming metal bumps on a wafer includes the steps of adhering a heat-resistant and steady synthetic tape on the top of the wafer, punching holes through the synthetic tape to form a blind hole on the synthetic tape above the under-bump-metallurgy layer (UBM), filling solder paste into the blind hole by a pusher, melting and then cooling the solder paste into a solder block removing the synthetic tape to expose the solder block, and melting the solder block to form a ball-shaped solder bump.
    Type: Grant
    Filed: October 16, 2000
    Date of Patent: March 19, 2002
    Assignee: Orient Semiconductor Electronics Limited
    Inventors: Wen Lo Shieh, Fu Yu Huang, Yung-Cheng Chuang, Hsuan Jui Chang, Hui-Pin Chen, Ning Huang, Feng-Chang Tu, Chung-Ming Chang, Hua Wen Chiang, Chia-Chieh Hu
  • Patent number: 6033934
    Abstract: A semiconductor chip fabrication method, including the steps of: (a) attaching dies to a chip carrier and then bonding lead wires to the dies, (b) adhering heat-resisting plastic strips to the chip carrier and connecting them to each die at one corner for guiding a molten resin to the dies, (c) pouring a molten resin out of nozzles of a molding apparatus, permitting the molten resin to be guided by the heat-resisting plastic strips to the dies and then molded on the dies, and (d) marking the molded dies with marks and placing them with balls, and then separating the individually molded dies from one other.
    Type: Grant
    Filed: December 9, 1997
    Date of Patent: March 7, 2000
    Assignee: Orient Semiconductor Electronics Ltd.
    Inventor: Wen-Lo Hsieh
  • Patent number: 5968737
    Abstract: Complementary DNA and genomic clones for three variants of GST-.pi. are disclosed. It is demonstrated that certain of these variants are overexpressed in gliomas, thereby indicating an involvement with that form of cancer. This permits the detection and treatment of certain classes of tumors using new compositions such as GST-.pi. genes, oligonucleotides, peptides and antibodies.
    Type: Grant
    Filed: November 12, 1996
    Date of Patent: October 19, 1999
    Assignees: The University of Mississippi, The Board of Regents, The University of Texas System
    Inventors: Francis Ali-Osman, Gabriel Lopez-Berestein, John K. Buolamwini, Gamil Antoun, Hui-Wen Lo, Charles Keller, Olanike Akande
  • Patent number: 5821607
    Abstract: A reusable metal frame for manufacturing of encapsulated semiconductor devices includes a metal sheet having a plurality of openings disposed in compliance with topology of semiconductor devices carried by a supporting structure. During the molding operation, the frame is superposed over the supporting structure with each semiconductor device to be encapsulated, positioned centrally within one of the openings. The encapsulating material (resin, plastic, or the like) is supplied to each semiconductor device and stays within each opening, held in place by continuous uninterrupted contour of each opening. After the encapsulating material has been cooled, the metal frame is readily removed, and may be used in other molding operations.
    Type: Grant
    Filed: January 8, 1997
    Date of Patent: October 13, 1998
    Assignee: Orient Semiconductor Electronics, Ltd.
    Inventor: Wen-Lo Hsieh