Abstract: A beam angle adjustable LED lamp has a simicircular and tubular heat-dissipating body, a light source module mounted on the heat-dissipating body to constitute a thermal contact therewith, a contact module pivotally mounted on one end of the heat-dissipating body, and a power converter mounted inside the heat-dissipating body and respectively and electrically connected with the light source module and the contact module. With the foregoing structure, a lighting direction of the light source module is perpendicular to an electrical connection path of the contact module and a lamp socket. As the contact module is pivotable relative to the heat-dissipating body, a beam angle of the light source on the heat-dissipating body can be adequately adjusted based on a lighting requirement.

Abstract: A touch-sensitive display device has an active display area and a non-active area and includes a touch-sensitive unit, a display unit and a liquid optical adhesive. The touch-sensitive unit has a touch-sensitive region substantially overlapping the active display area, and the display unit is disposed on one side of the touch-sensitive unit. The liquid optical adhesive is disposed between the touch-sensitive unit and the display unit to combine the touch-sensitive unit with the display unit, and an outer edge of the liquid optical adhesive is located in the non-active area of the touch-sensitive display device.

Abstract: A bendable area design for flexible printed circuitboard is disclosed. The flexible printed circuitboard (FPC) is comprised of: a flexible substrate; at least a circuit pattern; and a bendable area, being formed intersecting with the at least one circuit pattern and having at least a groove formed therein at a position corresponding to the intersection with the at least one circuit pattern; wherein the depth of the at least one groove is no larger than the thickness of the corresponding circuit pattern for preventing the circuit pattern from being cut off by the groove. By configuring the aforesaid bendable area in the FPC, stress generated by the bending of the FPC is restricted inside the bendable area effectively so that accurate control of the bending angle for bending FPC can be realized.

Abstract: An organic eco-agricultural water system includes a water source, a water discharge device connected to the water source by a pipeline, and ozone generators installed in the pipeline between the water source and the water discharge device and controlled to generate ozone and to supply generated ozone to the water flowing through the pipeline proportionally subject to the flow rate of the water passing through the pipeline. The discharged water can be used for application on crops or for the purpose of irrigation to save consumption of agricultural chemicals.

Abstract: The present invention utilizes multiphoton microscopy for a quantitative analysis of a bio tissue or a skin. Multiphoton microscopy is characterized in low invasion, low photo damage and high penetration. Hence, scanning through multiphoton microscopy does not hurt the bio tissue. It is thus fit for scanning live bio tissues to know its aging status. In addition, the quantitative analysis provides a precise index for diagnosing a damage severity of the tissue, like cancer.

Abstract: A method for synthesizing 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide or its derivatives has a step of introducing 6-chloro-6H-dibenz[c,e][1,2]oxaphosphorin or its derivative, an acid compound and water into a reacting chamber to form an organic layer having 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide or its derivative and an aqueous layer. Because the acid compound is from an external source and has a catalyzing effect, employing the method can prevent side reaction from occurring and increase yield of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide or its derivative. Furthermore, the method is a one-pot operation of hydrolysis, dehydration and cyclization, so the method does not require purification of intermediates. Therefore, the method is time- and cost-saving and requires less organic solvent, resulting in less pollution to the environment.

Abstract: A method for adjusting image is applied to an image output device. According to the method, the image output device firstly obtains a current image frame including plural pixels, and analyzes an intensity of an input image signal value of each pixel. The image output device defines each pixel having the input image signal value being smaller than a critical value as a dark pixel, and counts a number of the dark pixels to obtain a ratio of the dark pixels among all the pixels to serve as a dark pixel ratio. The image output device determines an image adjusting curve equation according to the dark pixel ratio, substitutes the input image signal values to the image adjusting curve equation, and obtains output image signal values of the pixels. Finally, the image output device combines all the output image signal values to obtain a final output image frame.

Abstract: At least one differential pressure sensing device has an active surface with an active region and a back surface with a recess. Next, a sacrificial layer is formed on a surface of the active region. Then, the differential pressure sensing device is bonded and electrically coupled with a surface of a carrier that has at least one through-hole corresponding to the recess of the differential pressure sensing device. Afterwards, at least one molding compound is formed to encapsulate the carrier and differential pressure sensing device while exposing the through-hole region and an upper surface of the sacrificial layer. Then, a solvent is used to naturally decompose the sacrificial layer, such that the active region of the differential pressure sensing device is exposed to atmosphere, thereby forming a differential pressure sensing device package with the through-hole.

Abstract: An engine waste gas treatment method and apparatus is disclosed to install an ozone generator in a motor vehicle and electrically connect the ozone generator to the power circuit of the motor vehicle and to connect a shunt pipe between the zone generator and the exhaust pipe of the motor vehicle so that when the motor vehicle is started, the ozone generator starts to generate ozone that is guided by the shunt pipe into the exhaust pipe of the motor vehicle to mix with exhausted engine waste gas, decomposing volatile organic compounds.

Abstract: The present invention relates to a semiconductor device. The semiconductor device includes a substrate and a chip. The chip is electrically connected to the substrate. The chip includes a chip body, at least one chip pad, a first passivation, an under ball metal layer and at least one metal pillar structure. The chip pad is disposed adjacent to an active surface of the chip body. The first passivation is disposed adjacent to the active surface, and exposes part of the chip pad. The under ball metal layer is disposed adjacent to the chip pad. The metal pillar structure contacts the under ball metal layer to form a first contact surface having a first diameter. The metal pillar structure is electrically connected to a substrate pad of the substrate to form a second contact surface having a second diameter. The ratio of the first diameter to the second diameter is between 0.7 and 1.0.

Abstract: The present invention relates to a chip having a metal pillar structure. The chip includes a chip body, at least one chip pad, a first passivation layer, an under ball metal layer and at least one metal pillar structure. The chip body has an active surface. The chip pad is disposed on the active surface. The first passivation layer is disposed on the active surface, and has at least one first opening so as to expose part of the chip pad. The under ball metal layer is disposed on the chip pad. The metal pillar structure is disposed on the under ball metal layer, and includes a metal pillar and a solder. The metal pillar is disposed on the under ball metal layer. The solder is disposed on the metal pillar, and the maximum diameter formed by the solder is shorter than or equal to the diameter of the metal pillar. Therefore, when the pitch between two adjacent metal pillar structures of the chip is a fine pitch, the defect of solder bridge can be avoided, so that the yield rate is improved.

Abstract: A method for synthesizing 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide or its derivatives has a step of introducing 6-chloro-6H-dibenz[c,e][1,2]oxaphosphorin or its derivative, an acid compound and water into a reacting chamber to form an organic layer having 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide or its derivative and an aqueous layer. Because the acid compound is from an external source and has a catalyzing effect, employing the method can prevent side reaction from occurring and increase yield of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide or its derivative. Furthermore, the method is a one-pot operation of hydrolysis, dehydration and cyclization, so the method does not require purification of intermediates. Therefore, the method is time-and cost-saving and requires less organic solvent, resulting in less pollution to the environment.

Abstract: The present invention provides a liquid crystal display module including housing, a flexible printed circuit board and a plurality of electric devices. The housing has at least a receiving notch. The flexible printed circuit board has a flexible substrate and at least an extension substrate projected from the flexible substrate to mount electric devices thereon. The extension substrate may be bent and received in the receiving notch of the housing to achieve the purpose of mounting more electric device on the flexible printed circuit board without having to increase the size of module.

Abstract: A soldering pad layout for flexible printed circuit board (PCB) is disclosed, which comprises: a top substrate; a middle substrate; and a bottom substrate, being arranged by stacking one over the other successively in parallel. In an exemplary embodiment, there are at least a top routing layer, being sandwiched between the top substrate and the middle substrate, and at least a bottom routing layer, being sandwiched between the middle substrate and the bottom substrate. With the aforesaid soldering pad layout, not only circuit breakage caused by stress concentration on a bended flexible printed circuit board can be prevented, but also the routing path required on the PCB can be shortened and the amount of space for laying out parts on the PCB can be reduced.

Abstract: A diesel engine exhaust purifier includes a burner system having a metal barrel mounted in the exhaust pipe of a diesel vehicle and a flame thrower mounted in the metal barrel, pressure sensors mounted in the front and rear ends of the metal barrel, a precious metal catalyzer converter type filter system mounted in the metal barrel for removing solid matters from engine exhaust gas and a microcontroller electrically connected to the power supply system of the diesel vehicle for driving the pump-operated fuel tank of the flame thrower to deliver forced fuel out of a fuel nozzle and an auto igniter to ignite the mist of fuel discharged out of the fuel nozzle for burning out cumulated carbon subject to the detection of the pressure sensors.

Abstract: A method of making a three-dimensional package, including: (a) providing a wafer; (b) forming at least one blind hole; (c) forming an isolation layer; (d) forming a conductive layer; (e) forming a dry film; (f) filling the blind hole with a solder; (g) removing the dry film; (h) patterning the conductive layer; (i) removing a part of the lower surface of the wafer and the isolation layer, so as to expose the conductive layer; (j) stacking a plurality of the wafers, and performing a reflow process; and (k) cutting the stacked wafers, so as to form a plurality of three-dimensional packages. As such, the lower end of the conductive layer is inserted into the solder of the lower wafer, so as to enhance the joint between the conductive layer and the solder, and effectively reduce the overall height of the three-dimensional packages after joining.

Abstract: A pin layout of a golden finger for FPC is disclosed, which comprises: a substrate; a first conductive layer, having a plurality of first routings; a second conductive layer, having a plurality of second routings; and a plurality of conductive members; wherein the first and the second conductive layers are formed respectively on the two opposite sides of the substrate in a manner that each first routing is electrically connected to its corresponding first pin, while disposing a plurality of second pins, without contacting to the first pins and the first routings, on the side of the substrate where the first conductive layer is disposed for corresponding each of the second pins to the extensions of the plural second routings; and the plural conductive members are disposed forming electric connections between the second routings and the second pins in respective.

Abstract: A golden finger for flexible printed circuitboard, comprises: a frame with a tail, being composed of a stiffening plate, a bottom substrate, a bottom copper layer, a cover layer, and a top copper layer while enabling the bottom copper layer to be formed with at least one first routing and at least one second routing, and enabling the top copper layer to be formed with at least one first pin and at least one second pin; at least one first via hole, each being filled with a conductive material and disposed at a position between its corresponding first pin and first routing for connecting the first pin to the first routing electrically; and at least one second via hole, each filled with a conductive material and being disposed at a position between the its corresponding second pin and second routing for connecting the second pin to the second routing electrically.

Abstract: A carbon deposition eliminating method includes the steps of: a) providing an exhaust pipe having a waste gas inlet and an air inlet at one end and an exhaust gas purifier at the other end and a combustion chamber on the middle, b) using a sensor to detect the pressure of the waste gas in the combustion chamber, c) enabling an automatic control system to open the air inlet for guiding outside fresh air into the combustion chamber when the waste gas pressure in the combustion chamber is high, d) starting a flamethrower to heat the combustion chamber to about 350° C.˜600° C., e) enabling the heated high temperature waste gas to pass through the exhaust gas purifier and to carry cumulated carbon away from the exhaust gas purifier, and f) enabling the automatic control system to close the air inlet and to open the waste gas inlet for letting engine exhaust gas to pass through the exhaust pipe when the waste gas pressure in the combustion chamber drops below the predetermined pressure level.

Abstract: A package comprises a first unit including a semiconductor body, a hole, an isolation layer, a conductive layer and a solder. The semiconductor body has a first surface having a pad and a protection layer exposing the pad. The hole penetrates the semiconductor body. The isolation layer is disposed on the side wall of the hole. The conductive layer covers the pad, a part of the protection layer, and the isolation layer. The lower end of the conductive layer extends to below a second surface of the semiconductor body. The solder is disposed in the hole, and is electrically connected to the pad via the conductive layer. A second unit similar to the first unit and stacked thereon includes a lower end of a second conductive layer that extends to below a second surface of a second semiconductor body and contacts the upper end of the first solder.