Abstract: A method for synthesizing 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide or its derivatives has a step of introducing 6-chloro-6H-dibenz[c,e][1,2]oxaphosphorin or its derivative, an acid compound and water into a reacting chamber to form an organic layer having 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide or its derivative and an aqueous layer. Because the acid compound is from an external source and has a catalyzing effect, employing the method can prevent side reaction from occurring and increase yield of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide or its derivative. Furthermore, the method is a one-pot operation of hydrolysis, dehydration and cyclization, so the method does not require purification of intermediates. Therefore, the method is time- and cost-saving and requires less organic solvent, resulting in less pollution to the environment.

Abstract: A method for adjusting image is applied to an image output device. According to the method, the image output device firstly obtains a current image frame including plural pixels, and analyzes an intensity of an input image signal value of each pixel. The image output device defines each pixel having the input image signal value being smaller than a critical value as a dark pixel, and counts a number of the dark pixels to obtain a ratio of the dark pixels among all the pixels to serve as a dark pixel ratio. The image output device determines an image adjusting curve equation according to the dark pixel ratio, substitutes the input image signal values to the image adjusting curve equation, and obtains output image signal values of the pixels. Finally, the image output device combines all the output image signal values to obtain a final output image frame.

Abstract: At least one differential pressure sensing device has an active surface with an active region and a back surface with a recess. Next, a sacrificial layer is formed on a surface of the active region. Then, the differential pressure sensing device is bonded and electrically coupled with a surface of a carrier that has at least one through-hole corresponding to the recess of the differential pressure sensing device. Afterwards, at least one molding compound is formed to encapsulate the carrier and differential pressure sensing device while exposing the through-hole region and an upper surface of the sacrificial layer. Then, a solvent is used to naturally decompose the sacrificial layer, such that the active region of the differential pressure sensing device is exposed to atmosphere, thereby forming a differential pressure sensing device package with the through-hole.

Abstract: An engine waste gas treatment method and apparatus is disclosed to install an ozone generator in a motor vehicle and electrically connect the ozone generator to the power circuit of the motor vehicle and to connect a shunt pipe between the zone generator and the exhaust pipe of the motor vehicle so that when the motor vehicle is started, the ozone generator starts to generate ozone that is guided by the shunt pipe into the exhaust pipe of the motor vehicle to mix with exhausted engine waste gas, decomposing volatile organic compounds.

Abstract: The present invention relates to a semiconductor device. The semiconductor device includes a substrate and a chip. The chip is electrically connected to the substrate. The chip includes a chip body, at least one chip pad, a first passivation, an under ball metal layer and at least one metal pillar structure. The chip pad is disposed adjacent to an active surface of the chip body. The first passivation is disposed adjacent to the active surface, and exposes part of the chip pad. The under ball metal layer is disposed adjacent to the chip pad. The metal pillar structure contacts the under ball metal layer to form a first contact surface having a first diameter. The metal pillar structure is electrically connected to a substrate pad of the substrate to form a second contact surface having a second diameter. The ratio of the first diameter to the second diameter is between 0.7 and 1.0.

Abstract: The present invention relates to a chip having a metal pillar structure. The chip includes a chip body, at least one chip pad, a first passivation layer, an under ball metal layer and at least one metal pillar structure. The chip body has an active surface. The chip pad is disposed on the active surface. The first passivation layer is disposed on the active surface, and has at least one first opening so as to expose part of the chip pad. The under ball metal layer is disposed on the chip pad. The metal pillar structure is disposed on the under ball metal layer, and includes a metal pillar and a solder. The metal pillar is disposed on the under ball metal layer. The solder is disposed on the metal pillar, and the maximum diameter formed by the solder is shorter than or equal to the diameter of the metal pillar. Therefore, when the pitch between two adjacent metal pillar structures of the chip is a fine pitch, the defect of solder bridge can be avoided, so that the yield rate is improved.

Abstract: A method for synthesizing 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide or its derivatives has a step of introducing 6-chloro-6H-dibenz[c,e][1,2]oxaphosphorin or its derivative, an acid compound and water into a reacting chamber to form an organic layer having 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide or its derivative and an aqueous layer. Because the acid compound is from an external source and has a catalyzing effect, employing the method can prevent side reaction from occurring and increase yield of 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide or its derivative. Furthermore, the method is a one-pot operation of hydrolysis, dehydration and cyclization, so the method does not require purification of intermediates. Therefore, the method is time-and cost-saving and requires less organic solvent, resulting in less pollution to the environment.

Abstract: The present invention provides a liquid crystal display module including housing, a flexible printed circuit board and a plurality of electric devices. The housing has at least a receiving notch. The flexible printed circuit board has a flexible substrate and at least an extension substrate projected from the flexible substrate to mount electric devices thereon. The extension substrate may be bent and received in the receiving notch of the housing to achieve the purpose of mounting more electric device on the flexible printed circuit board without having to increase the size of module.

Abstract: A soldering pad layout for flexible printed circuit board (PCB) is disclosed, which comprises: a top substrate; a middle substrate; and a bottom substrate, being arranged by stacking one over the other successively in parallel. In an exemplary embodiment, there are at least a top routing layer, being sandwiched between the top substrate and the middle substrate, and at least a bottom routing layer, being sandwiched between the middle substrate and the bottom substrate. With the aforesaid soldering pad layout, not only circuit breakage caused by stress concentration on a bended flexible printed circuit board can be prevented, but also the routing path required on the PCB can be shortened and the amount of space for laying out parts on the PCB can be reduced.

Abstract: A diesel engine exhaust purifier includes a burner system having a metal barrel mounted in the exhaust pipe of a diesel vehicle and a flame thrower mounted in the metal barrel, pressure sensors mounted in the front and rear ends of the metal barrel, a precious metal catalyzer converter type filter system mounted in the metal barrel for removing solid matters from engine exhaust gas and a microcontroller electrically connected to the power supply system of the diesel vehicle for driving the pump-operated fuel tank of the flame thrower to deliver forced fuel out of a fuel nozzle and an auto igniter to ignite the mist of fuel discharged out of the fuel nozzle for burning out cumulated carbon subject to the detection of the pressure sensors.

Abstract: A method of making a three-dimensional package, including: (a) providing a wafer; (b) forming at least one blind hole; (c) forming an isolation layer; (d) forming a conductive layer; (e) forming a dry film; (f) filling the blind hole with a solder; (g) removing the dry film; (h) patterning the conductive layer; (i) removing a part of the lower surface of the wafer and the isolation layer, so as to expose the conductive layer; (j) stacking a plurality of the wafers, and performing a reflow process; and (k) cutting the stacked wafers, so as to form a plurality of three-dimensional packages. As such, the lower end of the conductive layer is inserted into the solder of the lower wafer, so as to enhance the joint between the conductive layer and the solder, and effectively reduce the overall height of the three-dimensional packages after joining.

Abstract: A pin layout of a golden finger for FPC is disclosed, which comprises: a substrate; a first conductive layer, having a plurality of first routings; a second conductive layer, having a plurality of second routings; and a plurality of conductive members; wherein the first and the second conductive layers are formed respectively on the two opposite sides of the substrate in a manner that each first routing is electrically connected to its corresponding first pin, while disposing a plurality of second pins, without contacting to the first pins and the first routings, on the side of the substrate where the first conductive layer is disposed for corresponding each of the second pins to the extensions of the plural second routings; and the plural conductive members are disposed forming electric connections between the second routings and the second pins in respective.

Abstract: A golden finger for flexible printed circuitboard, comprises: a frame with a tail, being composed of a stiffening plate, a bottom substrate, a bottom copper layer, a cover layer, and a top copper layer while enabling the bottom copper layer to be formed with at least one first routing and at least one second routing, and enabling the top copper layer to be formed with at least one first pin and at least one second pin; at least one first via hole, each being filled with a conductive material and disposed at a position between its corresponding first pin and first routing for connecting the first pin to the first routing electrically; and at least one second via hole, each filled with a conductive material and being disposed at a position between the its corresponding second pin and second routing for connecting the second pin to the second routing electrically.

Abstract: A carbon deposition eliminating method includes the steps of: a) providing an exhaust pipe having a waste gas inlet and an air inlet at one end and an exhaust gas purifier at the other end and a combustion chamber on the middle, b) using a sensor to detect the pressure of the waste gas in the combustion chamber, c) enabling an automatic control system to open the air inlet for guiding outside fresh air into the combustion chamber when the waste gas pressure in the combustion chamber is high, d) starting a flamethrower to heat the combustion chamber to about 350° C.˜600° C., e) enabling the heated high temperature waste gas to pass through the exhaust gas purifier and to carry cumulated carbon away from the exhaust gas purifier, and f) enabling the automatic control system to close the air inlet and to open the waste gas inlet for letting engine exhaust gas to pass through the exhaust pipe when the waste gas pressure in the combustion chamber drops below the predetermined pressure level.

Abstract: A package comprises a first unit including a semiconductor body, a hole, an isolation layer, a conductive layer and a solder. The semiconductor body has a first surface having a pad and a protection layer exposing the pad. The hole penetrates the semiconductor body. The isolation layer is disposed on the side wall of the hole. The conductive layer covers the pad, a part of the protection layer, and the isolation layer. The lower end of the conductive layer extends to below a second surface of the semiconductor body. The solder is disposed in the hole, and is electrically connected to the pad via the conductive layer. A second unit similar to the first unit and stacked thereon includes a lower end of a second conductive layer that extends to below a second surface of a second semiconductor body and contacts the upper end of the first solder.

Abstract: A flexible printed circuitboard structure is disclosed, which comprises: a flexible printed circuitboard (FPC), having at least a soldering pad and at least a solder pasted pad area formed thereon; wherein, by using the extending of a side of the at least one solder pasted pad area as the base line, a bending line is formed on the FPC in a manner that it is prevented from passing through the at least one soldering pad and is disposed at a specific distance away from the periphery of the same. By the configuration of the solder pasted pad area to defined the bending line on the FPC, the bending stress problems caused when the FPC is being bended, such as solder crack and broken circuit, etc., can be prevented.

Abstract: A pin layout of a golden finger for FPC is disclosed, which comprises: a substrate; a first conductive layer, having a plurality of first routings; a second conductive layer, having a plurality of second routings; and a plurality of conductive members; wherein the first and the second conductive layers are formed respectively on the two opposite sides of the substrate in a manner that each first routing is electrically connected to its corresponding first pin, while disposing a plurality of second pins, without contacting to the first pins and the first routings, on the side of the substrate where the first conductive layer is disposed for corresponding each of the second pins to the extensions of the plural second routings; and the plural conductive members are disposed forming electric connections between the second routings and the second pins in respective.

Abstract: An anti-dust apparatus for a liquid crystal display (LCD) panel, comprising: a protective film comprising a main portion, a foldable portion extending from the main portion, and a fold line between the main portion and the foldable portion, wherein the main portion has a first attachment surface and an exposed surface on both sides, the foldable portion has a second attachment surface adjacent to the first attachment surface, and the foldable portion is folded along the fold line to be parallel with the LCD panel; an adhesive layer disposed on the first attachment surface and the second attachment surface of the protective film, wherein the adhesive layer on the first attachment surface is attached onto the LCD panel; a twin adhesive layer disposed on the other surface different from the second attachment surface of the foldable portion, wherein the twin adhesive layer is attached onto the exposed surface of the protective film; and an anti-dust portion disposed on the adhesive layer on the second attachment

Abstract: The present invention relates to a three-dimensional package and a method of making the same. The method comprises: (a) providing a semiconductor body; (b) forming at least one blind hole in the semiconductor body; (c) forming an isolation layer on the side wall of the blind hole; (d) forming a conductive layer on the isolation layer; (e) patterning the conductive layer; (f) removing a part of the lower surface of the semiconductor body and a part of the isolation layer, so as to expose a part of the conductive layer; (g) forming a solder on the lower end of the conductive layer; (h) stacking a plurality of the semiconductor bodies, and performing a reflow process; and (i) cutting the stacked semiconductor bodies, so as to form a plurality of three-dimensional packages.

Abstract: A flexible printed circuitboards (FPC) with anti-solder crack structure, adapted for a plurality of circuit components to mount thereon, is disclosed, which comprises: a vacant area, being a region of high aspect ratio formed on the FPC at a location where the FPC is more likely to be bended and is enclosed by the plural circuit components; a layout area, being a region formed on the FPC at a location beyond that of the vacant area so as to be provided for the plural circuit components to mount thereon. By the formation of the vacant area on the FPC at its stress concentration region when it is bended by an external force, stresses in solder bumps bonding the plural circuit components with the FPC can be prevented from happening so that the reliability of circuit component against solder crack is improved.