Patents by Inventor Wen Lo

Wen Lo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20100035446
    Abstract: A pin layout of a golden finger for FPC is disclosed, which comprises: a substrate; a first conductive layer, having a plurality of first routings; a second conductive layer, having a plurality of second routings; and a plurality of conductive members; wherein the first and the second conductive layers are formed respectively on the two opposite sides of the substrate in a manner that each first routing is electrically connected to its corresponding first pin, while disposing a plurality of second pins, without contacting to the first pins and the first routings, on the side of the substrate where the first conductive layer is disposed for corresponding each of the second pins to the extensions of the plural second routings; and the plural conductive members are disposed forming electric connections between the second routings and the second pins in respective.
    Type: Application
    Filed: August 4, 2009
    Publication date: February 11, 2010
    Applicant: WINTEK CORPORATION
    Inventors: CHIN-WEN LO, YUEH-FANG WANG
  • Publication number: 20100032191
    Abstract: A flexible printed circuitboard structure is disclosed, which comprises: a flexible printed circuitboard (FPC), having at least a soldering pad and at least a solder pasted pad area formed thereon; wherein, by using the extending of a side of the at least one solder pasted pad area as the base line, a bending line is formed on the FPC in a manner that it is prevented from passing through the at least one soldering pad and is disposed at a specific distance away from the periphery of the same. By the configuration of the solder pasted pad area to defined the bending line on the FPC, the bending stress problems caused when the FPC is being bended, such as solder crack and broken circuit, etc., can be prevented.
    Type: Application
    Filed: August 4, 2009
    Publication date: February 11, 2010
    Applicant: WINTEK CORPORATION
    Inventors: Chin-Wen LO, Chia-Ning KAO, Chin-Mei HUANG
  • Publication number: 20100021680
    Abstract: An anti-dust apparatus for a liquid crystal display (LCD) panel, comprising: a protective film comprising a main portion, a foldable portion extending from the main portion, and a fold line between the main portion and the foldable portion, wherein the main portion has a first attachment surface and an exposed surface on both sides, the foldable portion has a second attachment surface adjacent to the first attachment surface, and the foldable portion is folded along the fold line to be parallel with the LCD panel; an adhesive layer disposed on the first attachment surface and the second attachment surface of the protective film, wherein the adhesive layer on the first attachment surface is attached onto the LCD panel; a twin adhesive layer disposed on the other surface different from the second attachment surface of the foldable portion, wherein the twin adhesive layer is attached onto the exposed surface of the protective film; and an anti-dust portion disposed on the adhesive layer on the second attachment
    Type: Application
    Filed: July 23, 2008
    Publication date: January 28, 2010
    Applicant: WINTEK CORPORATION
    Inventors: CHIN-WEN LO, YUEH-FANG WANG, CHIA-NING KAO
  • Patent number: 7642132
    Abstract: The present invention relates to a three-dimensional package and a method of making the same. The method comprises: (a) providing a semiconductor body; (b) forming at least one blind hole in the semiconductor body; (c) forming an isolation layer on the side wall of the blind hole; (d) forming a conductive layer on the isolation layer; (e) patterning the conductive layer; (f) removing a part of the lower surface of the semiconductor body and a part of the isolation layer, so as to expose a part of the conductive layer; (g) forming a solder on the lower end of the conductive layer; (h) stacking a plurality of the semiconductor bodies, and performing a reflow process; and (i) cutting the stacked semiconductor bodies, so as to form a plurality of three-dimensional packages.
    Type: Grant
    Filed: October 23, 2006
    Date of Patent: January 5, 2010
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Min-Lung Huang, Wei-Chung Wang, Po-Jen Cheng, Kuo-Chung Yee, Ching-Huei Su, Jian-Wen Lo, Chian-Chi Lin
  • Publication number: 20090277669
    Abstract: A flexible printed circuitboards (FPC) with anti-solder crack structure, adapted for a plurality of circuit components to mount thereon, is disclosed, which comprises: a vacant area, being a region of high aspect ratio formed on the FPC at a location where the FPC is more likely to be bended and is enclosed by the plural circuit components; a layout area, being a region formed on the FPC at a location beyond that of the vacant area so as to be provided for the plural circuit components to mount thereon. By the formation of the vacant area on the FPC at its stress concentration region when it is bended by an external force, stresses in solder bumps bonding the plural circuit components with the FPC can be prevented from happening so that the reliability of circuit component against solder crack is improved.
    Type: Application
    Filed: May 7, 2009
    Publication date: November 12, 2009
    Applicant: WINTEK CORPORATION
    Inventors: Yu-Chieh KUAN, Chin-Wen LO
  • Publication number: 20090218409
    Abstract: A heating system includes a heater installed in between the exhaust pipe and exhaust purifier of a diesel engine to heat the exhaust purifier in burning out cumulative carbon, a backpressure sensor for detecting the backpressure in the heater, a temperature sensor for detecting the temperature in the exhaust purifier, a fuel system for supplying a fuel mixture to the heater, an air compressor controllable to compress air into the fuel system to mix with a condensed fuel gas in the fuel system into a fuel mixture for delivery to the heater, and a computer controller electrically connected with the backpressure sensor and the temperature sensor for controlling the operation of the air compressor subject to the backpressure level detected by the backpressure sensor and the temperature detected by the temperature sensor.
    Type: Application
    Filed: February 29, 2008
    Publication date: September 3, 2009
    Inventor: WEN-LO CHEN
  • Publication number: 20090174281
    Abstract: An electret power generator having two output electrodes on a stator and a rotor positioned above the output electrodes with charged electret material between the electrodes and the rotor. Power is generated when the rotor moves laterally above the electrodes. The electret material is preferably parylene HT .
    Type: Application
    Filed: October 15, 2008
    Publication date: July 9, 2009
    Inventors: Hsi-wen LO, Yu-Chong Tai
  • Publication number: 20090169632
    Abstract: A sustained release composition comprising a polymer and manufacturing method thereof. The sustained release composition comprises a polymer, a bioactive agent, and a release rate determined agent, wherein the release rate determined agent is dispersed in the sustained release composition to control the release rate of the bioactive agent. The method comprises providing an oil phase comprising a bioactive agent, a polymer, and a release rate determined agent; providing an aqueous phase comprising a surfactant; mixing the oil phase with the aqueous phase to form the sustained release composition having a controlled release effect.
    Type: Application
    Filed: December 31, 2007
    Publication date: July 2, 2009
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Jui-Mei Lu, Chia-Wen Liu, Po Hong Lai, John Jiang Hann Lin, Chiao Pin Li, Sung En Chen, Yo Wen Lo, Ming-Thau Sheu, Min-Ying Lin
  • Publication number: 20090120670
    Abstract: A bendable area design for flexible printed circuitboard is disclosed. The flexible printed circuitboard (FPC) is comprised of: a flexible substrate; at least a circuit pattern; and a bendable area, being formed intersecting with the at least one circuit pattern and having at least a groove formed therein at a position corresponding to the intersection with the at least one circuit pattern; wherein the depth of the at least one groove is no larger than the thickness of the corresponding circuit pattern for preventing the circuit pattern from being cut off by the groove. By configuring the aforesaid bendable area in the FPC, stress generated by the bending of the FPC is restricted inside the bendable area effectively so that accurate control of the bending angle for bending FPC can be realized.
    Type: Application
    Filed: June 18, 2008
    Publication date: May 14, 2009
    Applicant: WINTEK CORPORATION
    Inventors: CHIN-WEN LO, CHIA-NING KAO
  • Patent number: 7528053
    Abstract: A three-dimensional package and a method of making the same including providing a wafer; forming at least one blind hole in the wafer; forming an isolation layer on the side wall of the blind hole; forming a conductive layer on the isolation layer; forming a dry film on the conductive layer; filling the blind hole with metal; removing the dry film, and patterning the conductive layer; removing a part of the metal in the blind hole to form a space; removing a part of the second surface of the wafer and a part of the isolation layer, to expose a part of the conductive layer; forming a solder on the lower end of the conductive layer, the melting point of the solder is lower than the metal; stacking a plurality of the wafers, and performing a reflow process; and cutting the stacked wafers, to form three-dimensional packages.
    Type: Grant
    Filed: December 26, 2006
    Date of Patent: May 5, 2009
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Min-Lung Huang, Wei-Chung Wang, Po-Jen Cheng, Kuo-Chung Yee, Ching-Huei Su, Jian-Wen Lo, Chian-Chi Lin
  • Publication number: 20080283216
    Abstract: The present invention relates to a cooling structure for motor of fan, which includes a housing, an impeller and a circuit board. The housing has an air flow channel and a base; the base is located on one side of the air flow channel to support the circuit board, and the impeller is movably integrated on the base; the circuit board is bonded with a highly heat-conductive metal on at least one side thereof so as to provide good heat dissipation and heat transfer performance; at least one portion of the circuit board is extended beyond the hub of the impeller such that the extended portion is located at a downwind place of the blades of the impeller to facilitate fast heat dissipation.
    Type: Application
    Filed: June 19, 2007
    Publication date: November 20, 2008
    Applicant: Sunonwealth Electric Machine Industry Co., Ltd.
    Inventors: Alex Horng, Shih-Chang Hsu, Pen-Wen Lo
  • Patent number: 7446404
    Abstract: A three-dimensional package including a first wafer having at least one first pad and a first protection layer exposing the first pad. A first hole penetrates the first wafer. A first isolation layer is disposed on the side wall of the first hole. The lower end of a first conductive layer extends below the surface of the first wafer. A first metal is disposed in the first hole, and is electrically connected to the first pad via the first conductive layer. A first solder is disposed on the first metal in the first hole, wherein the melting point of the first solder is lower than that of the first metal. A second wafer is configured similarly as the first wafer. A lower end of a second conductive layer of the second wafer extends below the surface of the second wafer and contacts the upper end of the first solder.
    Type: Grant
    Filed: December 26, 2006
    Date of Patent: November 4, 2008
    Assignee: Advanced Semiconductor Engineering, Inc.
    Inventors: Min-Lung Huang, Wei-Chung Wang, Po-Jen Cheng, Kuo-Chung Yee, Ching-Huei Su, Jian-Wen Lo, Chian-Chi Lin
  • Publication number: 20080157236
    Abstract: At least one differential pressure sensing device has an active surface with an active region and a back surface with a recess. Next, a sacrificial layer is formed on a surface of the active region. Then, the differential pressure sensing device is bonded and electrically coupled with a surface of a carrier that has at least one through-hole corresponding to the recess of the differential pressure sensing device. Afterwards, at least one molding compound is formed to encapsulate the carrier and differential pressure sensing device while exposing the through-hole region and an upper surface of the sacrificial layer. Then, a solvent is used to naturally decompose the sacrificial layer, such that the active region of the differential pressure sensing device is exposed to atmosphere, thereby forming a differential pressure sensing device package with the through-hole.
    Type: Application
    Filed: August 21, 2007
    Publication date: July 3, 2008
    Inventors: Jung-Tai Chen, Chun-Hsun Chu, Wen-Lo Shieh
  • Patent number: 7348861
    Abstract: One embodiment of the present invention includes a frequency generation circuit including a control module, an oscillator circuit coupled to the control module, the oscillator circuit having a start-up time defined by the time required to reach a desired frequency. The oscillator circuit includes an amplifier having an input and an output and being programmably-alterable by the control module, a first capacitor coupled to the input of the amplifier and being programmably-alterable, in capacitance, by the control module, a second capacitor coupled to the output of the amplifier, a crystal resonator coupled to the first and second capacitors for generating an output signal having a desired frequency, wherein fast start-up time is achieved.
    Type: Grant
    Filed: March 31, 2005
    Date of Patent: March 25, 2008
    Assignee: Ralink Technology, Inc.
    Inventors: I-chang Wu, Chung Wen Lo, Keng Leong Fong
  • Patent number: 7314972
    Abstract: The invention relates to transformed plant cells and plants having a novel nucleic acid and protein sequences from the mung bean Vigna radiata. The nucleic acid sequence, isolated from a bruchid resistant mung bean line, encodes a thionin-like protein with biocidal properties.
    Type: Grant
    Filed: February 14, 2005
    Date of Patent: January 1, 2008
    Assignee: Academia Sinica
    Inventors: Ching-San Chen, Gan-Hong Chen, Li-Wen Lo
  • Publication number: 20070263998
    Abstract: The present invention provides a liquid crystal display module including housing, a flexible printed circuit board and a plurality of electric devices. The housing has at least a receiving notch. The flexible printed circuit board has a flexible substrate and at least an extension substrate projected from the flexible substrate to mount electric devices thereon. The extension substrate may be bent and received in the receiving notch of the housing to achieve the purpose of mounting more electric device on the flexible printed circuit board without having to increase the size of module.
    Type: Application
    Filed: May 11, 2007
    Publication date: November 15, 2007
    Applicant: WINTEK CORPORATION
    Inventors: Chih-Hsien Lien, Chin-Wen Lo, Yu-Jen Tsai
  • Publication number: 20070194990
    Abstract: An ultra wideband antenna includes a substrate, a transmission line coupled to the substrate, and a radiating element coupled to the transmission line at a distance from the substrate and being symmetric about the transmission line. An outer edge of the radiating element has a shape defined by a binomial function.
    Type: Application
    Filed: September 5, 2006
    Publication date: August 23, 2007
    Inventors: Ching-Wei Ling, Shyh-Jong Chung, Wen Lo
  • Publication number: 20070172982
    Abstract: The present invention relates to a three-dimensional package and a method of making the same. The method comprises: (a) providing a semiconductor body; (b) forming at least one blind hole in the semiconductor body; (c) forming an isolation layer on the side wall of the blind hole; (d) forming a conductive layer on the isolation layer; (e) patterning the conductive layer; (f) removing a part of the lower surface of the semiconductor body and a part of the isolation layer, so as to expose a part of the conductive layer; (g) forming a solder on the lower end of the conductive layer; (h) stacking a plurality of the semiconductor bodies, and performing a reflow process; and (i) cutting the stacked semiconductor bodies, so as to form a plurality of three-dimensional packages.
    Type: Application
    Filed: October 23, 2006
    Publication date: July 26, 2007
    Inventors: Min-Lung Huang, Wei-Chung Wang, Po-Jen Cheng, Kuo-Chung Yee, Ching-Huei Su, Jian-Wen Lo, Chian-Chi Lin
  • Publication number: 20070172983
    Abstract: The present invention relates to a three-dimensional package and a method of making the same. The three-dimensional package comprises a first wafer, at least one first hole, a first isolation layer, a first conductive layer, a first solder, a second wafer, at least one second hole, a second isolation layer, a second conductive layer, and a second solder. The first wafer has at least one first pad and a first protection layer exposing the first pad. The first hole penetrates the first wafer. The first isolation layer is disposed on the side wall of the first hole. The lower end of the first conductive layer extends below the surface of the first wafer. The first solder is disposed in the first hole, and is electrically connected to the first pad via the first conductive layer. The second wafer has at least one second pad and a second protection layer exposing the second pad. The second hole penetrates the second wafer. The second isolation layer is disposed on the side wall of the second hole.
    Type: Application
    Filed: December 26, 2006
    Publication date: July 26, 2007
    Inventors: Min-Lung Huang, Wei-Chung Wang, Po-Jen Cheng, Kuo-Chung Yee, Ching-Huei Su, Jian-Wen Lo, Chian-Chi Lin
  • Publication number: 20070172984
    Abstract: The present invention relates to a three-dimensional package and a method of making the same. The method comprises: (a) providing a wafer; (b) forming at least one blind hole in the wafer; (c) forming an isolation layer on the side wall of the blind hole; (d) forming a conductive layer on the isolation layer; (e) forming a dry film on the conductive layer; (f) filling the blind hole with a solder; (g) removing the dry film; (h) patterning the conductive layer; (i) removing a part of the lower surface of the wafer and a part of the isolation layer, so as to expose a part of the conductive layer; (j) stacking a plurality of the wafers, and performing a reflow process; and (k) cutting the stacked wafers, so as to form a plurality of three-dimensional packages.
    Type: Application
    Filed: December 26, 2006
    Publication date: July 26, 2007
    Inventors: Min-Lung Huang, Wei-Chung Wang, Po-Jen Cheng, Kuo-Chung Yee, Ching-Huei Su, Jian-Wen Lo, Chian-Chi Lin