Abstract: Disclosed in the present disclosure is a vehicle door opening and closing device, including an active arm, a guide rail seat, and a driven mechanism. The active arm vehicle body end of the active arm is rotatably connected to the vehicle body, and the active arm vehicle door end of the active arm is rotatably connected to the vehicle door. The guide rail seat is fixed on the vehicle door, and the guide rail seat is provided with a guide rail that matches the preset opening and closing trajectory of the vehicle door. One end of the driven mechanism is rotatably connected to the guide rail seat, and another end of the driven mechanism is rotatably connected to the vehicle body. The driven mechanism is provided with a first sliding part slidably connected to the guide rail.

Abstract: An antenna module is provided. The antenna module includes a conductive structure, a first dielectric layer, and a second dielectric layer. The conductive structure defines a first space and a second space over the first space. The first dielectric layer is at least partially within the first space and has a first dielectric constant. The second dielectric layer is at least partially within the second space and has a second dielectric constant different from the first dielectric constant.

Abstract: Reliable connector assembly and housing thereof. The housing may include a first portion having first spaces for receiving first connectors and a second portion having second spaces connected to the first spaces for receiving second connectors configured to mate with the first connectors. The first portion comprises a platform comprising a surface in a plane perpendicular to the mating direction at an interface of the first portion and the second portion. Such a configuration reduces the risk of exerting excessive force onto the connectors and increase the reliability of the connector assembly.

Abstract: A manufacturing method of an electronic device includes: forming a conductive material layer on a substrate, the conductive material layer continuously extends from a first surface of the substrate to a second surface while passing through a side surface, wherein the side surface connects the first surface and the second surface, forming a first protection layer on the conductive material layer and patterning the conductive material layer by using the first protection layer as a mask to form an edge wire, wherein the edge wire is retracted relative to the first protection layer and forms an undercut structure, and forming a second protection layer on the substrate, wherein the second protection layer fills the undercut structure.

Abstract: A method of estimating a distance in an endoscopic image is implemented by an endoscopic system. The method includes steps of: irradiating a lesion of a subject and obtaining an image of the lesion and a scale of the endoscopic system as a to-be-analyzed image while the lesion is being irradiated and the scale is placed adjacent to the lesion; using a lesion-contour prediction model to generate a prediction result that indicates a contour of the lesion; displaying the prediction result; generating two selected points on the contour of the lesion; and estimating, based on the scale in the to-be-analyzed image, an actual distance between the two selected points.

Abstract: A method including: obtaining data based an optical proximity correction for a spatially shifted version of a training design pattern; and training a machine learning model configured to predict optical proximity corrections for design patterns using data regarding the training design pattern and the data based on the optical proximity correction for the spatially shifted version of the training design pattern.

Abstract: A semiconductor device package includes a substrate, a first antenna pattern and a second antenna pattern. The substrate has a first surface and a second surface opposite to the first surface. The first antenna pattern is disposed over the first surface of the substrate. The first antenna pattern has a first bandwidth. The second antenna pattern is disposed over the first antenna pattern. The second antenna pattern has a second bandwidth different from the first bandwidth. The first antenna pattern and the second antenna pattern are at least partially overlapping in a direction perpendicular to the first surface of the substrate.

Abstract: An etch bias direction is determined based on a curvature of a contour in a substrate pattern. The etch bias direction is configured to be used to enhance an accuracy of a semiconductor patterning process relative to prior patterning processes. In some embodiments, a representation of the substrate pattern is received, which includes the contour in the substrate pattern. The curvature of the contour of the substrate pattern is determined, and an etch bias direction is determined based on the curvature by considering curvatures of adjacent contour portions. A simulation model is used to determine an etch effect based on the etch bias direction for an etching process on the substrate pattern.

Abstract: A reliable socket connector. The connector includes an insulative body having a slot recessed from a mating face and terminals disposed in the insulative body having mating ends curving into the slot and tail ends extend thereout. A shell is disposed outside the insulative body. The shell has a mating portion extend beyond the mating face of the insulative body. The shell has a side wall comprising a docking portion and a guiding portion. The docking portion has holes configured for receiving a latch of a mating plug connector. The guiding portion extends beyond the docking portion in a mating direction and is configured for guiding the mating plug connector into the shell where a mating portion of the plug connector may then be guided into the slot of the insulative body.

Abstract: A computer system receives a set of user-defined rules are that useable by a computer service to automate a decision flow. The computer system generates a graph model from the user-defined rules. From the graph model, the computer system determines an input dependency model that is indicative of a set of inputs referred to in the graph model. The input dependency model is useable by an orchestrator to coordinate accesses to the one or more data stores in which the set of inputs is stored. The computer system receives the set of inputs and determines one or more automated decisions by applying the set of inputs to the graph model.

Abstract: A manufacturing method of a semiconductor device includes the following steps. A first recess and a second recess are formed in a first region and a second region of a semiconductor substrate, respectively. A bottom surface of the first recess is lower than a bottom surface of the second recess in a vertical direction. A first gate oxide layer and a second gate oxide layer are formed concurrently. At least a portion of the first gate oxide layer is formed in the first recess, and at least a portion of the second gate oxide layer is formed in the second recess. A removing process is performed for removing a part of the second gate oxide layer. A thickness of the second gate oxide layer is less than a thickness of the first gate oxide layer after the removing process.

Abstract: A semiconductor device includes a gate structure on a substrate, a first spacer on sidewalls of gate structure, a second spacer on sidewalls of the first spacer, a polymer block adjacent to the first spacer and on a corner between the gate structure and the substrate, an interfacial layer under the polymer block, and a source/drain region adjacent to two sides of the first spacer. Preferably, the polymer block is surrounded by the first spacer, the interfacial layer, and the second spacer.

Abstract: Robust connectors and active connectors therewith are provided. A receptacle connector includes first and second terminal assemblies disposed in a same housing slot and separated from each other by a predetermined space. Such a configuration enables the first and second terminal assemblies to be configured according to physical dimensions of various interface standards while simultaneously satisfying respective electrical requirements. The receptacle connector is connected to an end of a cable directly or through a plug connector. The plug connector comprises a circuit board having first and second groups of contact pads aligned in a row and spaced from each other so as to respectively mate with the first and second terminal assemblies of the receptacle connector. The circuit board has a third group of contact pads configured more suitable for attaching the cable. The third group is electrically coupled to the first and second groups.

Abstract: A method of manufacturing a semiconductor structure with flush shallow trench isolation and gate oxide, including performing a first etching process to remove a pad oxide layer at one side of a STI and recess the substrate, the first etching process also forms a recess portion not covered by the first etching process and a protruding portion covered by the first etching process on the STI, forming a gate oxide layer on the recessed substrate, performing a second etching process to remove the protruding portion and the pad oxide layer and a first oxide layer on a drain region, performing a third etching process to remove a part of the STI and a second oxide layer, so that a top plane of the STI is flush with the gate oxide layer.

Abstract: Reliable connectors configured for easy locking/unlocking. A connector can include a first end configured to mate with a first mating component in a first direction, and a second end configured to mate with a second mating component in a second direction perpendicular to the first direction. The connector can include a locking member configured to move between locked and unlocked positions by a force applied in a third direction perpendicular to both the first and second directions. Such a configuration reduces the risk of interfering with connections between the mated components when applying the force and therefore provide more reliable connectors. The connectors can include a shell with a guiding structure to reduce the risk of damage to lightweight connectors that might otherwise be damaged due to misalignment during mating/unmating. Such a shell can be used with locking members configured for using within electronic systems with densely packed components.

Abstract: This disclosure is directed to a ball valve having an outer valve body, a valve core, a rotational assembly, and a functional assembly. The valve core is accommodated in the outer valve body, and the valve core has a flow channel defined therein. The rotational assembly is connected to the valve core for turning the valve core. A portion of the functional assembly is disposed in the flow channel.

Abstract: A semiconductor device including a substrate having a NMOS region and a PMOS region; a metal gate extending continuously along a first direction from the NMOS region to the PMOS region on the substrate; a first source/drain region extending along a second direction adjacent to two sides of the metal gate on the NMOS region; a second source/drain region extending along the second direction adjacent to two sides of the metal gate on the PMOS region; a first contact plug landing on the second source/drain region adjacent to one side of the metal gate; a second contact plug landing on the second source/drain region adjacent to another side of the metal gate; and a third contact plug landing directly on a portion of the metal gate on the PMOS region and between the first contact plug and the second contact plug.

Abstract: An electronic device is disclosed. The electronic device includes a first circuit structure, a second circuit structure having a surface facing the first circuit structure, and a first electronic component disposed over the first circuit structure and supporting the second circuit structure. The electronic device also includes a second electronic component disposed adjacent to the second circuit structure and having a top surface at an elevation higher than the surface of the second circuit structure with respect to the first circuit structure.

Abstract: A semiconductor structure includes a substrate having a first device region and a second device region in proximity to the first device region. A trench isolation structure is disposed in the substrate between the first device region and the second device region. The trench isolation structure includes a first bottom surface within the first device region and a second bottom surface within the second device region. The first bottom surface is coplanar with the second bottom surface.

Abstract: The present disclosure provides an antenna package structure, which includes antenna and a transmitting structure. The transmitting structure includes a first dielectric material and a second dielectric material of different dielectric constants, and a frequency selective surface unit. The first dielectric layer and the second dielectric layer are configured to focus the electromagnetic wave radiated between the antenna and the frequency selective surface unit.