Abstract: The present disclosure relates to methodologies, systems and apparatus for cooling pump heads and providing balanced cooling and heat transfer between multiple pump heads. Multi-pump systems that are used to pump fluids that vary greatly in density with minor changes in temperature, such as the mobile phase of a C02-based chromatography system, require highly stable temperature conditions. In order to achieve a substantially equal average heat transfer between multiple pump heads and a coolant fluid, coolant fluid may be flowed through coolant passageways within the pump heads in a recursive and/or parallel coolant flow patterns. Such recursive and/or parallel coolant fluid flow patterns provide increased stability in temperature, compressibility, and density of the fluids passing through a multi-pump system.

Abstract: A strap buckle has a base. The base has a bottom plate and two side plates each having one end formed with a pivot hole. The base has a retaining portion spaced from the bottom plate. An opening is defined between the bottom plate and the retaining portion. A swinging member has a pivot portion pivotally connected to the pivot hole. Two opposite sides of the pivot portion have two perforations, respectively. Two transverse rods pass through the perforations and are arranged in parallel. The swinging member is pivoted relative to the base to drive the two transverse rods to rotate together. A pressing assembly has a pressing member and an elastic member. The pressing member is disposed between the two side plates of the base. A first strap is inserted between the bottom plate and the pressing member and wound around the two transverse rods.

Abstract: The present disclosure provides an electronic module including a circuit including a transmitting part and a receiving part physically separated from the transmitting part. The electronic module also includes an element isolated from the circuit and configured to block electrical interference between the transmitting part and the receiving part.

Abstract: A manufacturing method of an electronic device includes: forming a conductive material layer on a substrate, the conductive material layer continuously extends from a first surface of the substrate to a second surface while passing through a side surface, wherein the side surface connects the first surface and the second surface, forming a first protection layer on the conductive material layer and patterning the conductive material layer by using the first protection layer as a mask to form an edge wire, wherein the edge wire is retracted relative to the first protection layer and forms an undercut structure, and forming a second protection layer on the substrate, wherein the second protection layer fills the undercut structure.

Abstract: A method for improving a process model for a patterning process, the method including obtaining a) a measured contour from an image capture device, and b) a simulated contour generated from a simulation of the process model. The method also includes aligning the measured contour with the simulated contour by determining an offset between the measured contour and the simulated contour. The process model is calibrated to reduce a difference, computed based on the determined offset, between the simulated contour and the measured contour.

Abstract: A strap buckle has a base. The base has a bottom plate and two side plates each having one end formed with a pivot hole. The base has a retaining portion spaced from the bottom plate. An opening is defined between the bottom plate and the retaining portion. A swinging member has a pivot portion pivotally connected to the pivot hole. Two opposite sides of the pivot portion have two perforations, respectively. Two transverse rods pass through the perforations and are arranged in parallel. The swinging member is pivoted relative to the base to drive the two transverse rods to rotate together. A pressing assembly has a pressing member and an elastic member. The pressing member is disposed between the two side plates of the base. A first strap is inserted between the bottom plate and the pressing member and wound around the two transverse rods.

Abstract: An electronic device includes a substrate, a side wiring, a protective film, and a first filler. The substrate has a first surface, a second surface, and a side surface connected between the first surface and the second surface. The side wiring is disposed on the substrate and extends from the first surface to the second surface through the side surface. The protective film is disposed on the side wiring. The side wiring is sandwiched between the substrate and the protective film. An edge of the protective film extends beyond a side wall of the side wiring, and the protective film, the side wall of the side wiring, and the substrate define a gap. The first filler is disposed on the protective film and in the gap, wherein the first filler includes a first material and a plurality of particles mixed within the first material.

Abstract: The present disclosure relates to an electronic device that includes a first radiating element configured to radiate a first electromagnetic wave and a second radiating element configured to radiate a second electromagnetic wave. A first radiation pattern of the first electromagnetic wave is configured to be adjusted, and a second radiation pattern of the second electromagnetic wave is configured to be fixed.

Abstract: A panel device including a substrate, a conductor pad, a turning wire, and a circuit board is provided. The substrate has a first surface and a second surface connected to the first surface while a normal direction of the second surface is different from a normal direction of the first surface. The conductor pad is disposed on the first surface of the substrate. The turning wire is disposed on the substrate and extends from the first surface to the second surface. The turning wire includes a wiring layer in contact with the conductor pad and a wire covering layer covering the wiring layer. The circuit board is bonded to and electrically connected to the wire covering layer. A manufacturing method of a panel device is also provided herein.

Abstract: An electrical connector may include an insulating body, metal terminals exposed in a mating port of the insulating body, and a metal housing that includes walls. The walls may encircle the insulating body such that a first space is located between a first side of the insulating body and a first wall of the metal housing, a second space is located between a second side of the insulating body and a second wall of the metal housing, and a length of the first space is different from a length of the second space. The first and second walls may face in opposite directions. The mating port may receive a portion of a mating connector. The first wall may include first latching portions in communication with the first space, and the second wall may include second latching portions in communication with the second space.

Abstract: An electronic device, including a substrate, an edge wire, a first protection layer, and a second protection layer, is provided. The substrate has a first surface, a second surface, and a side surface connecting the first surface and the second surface. A normal vector of the side surface is different from the first surface and the second surface. The edge wire is configured on the substrate, extending from the first surface to the second surface while passing through the side surface. The first protection layer is configured on the edge wire. The edge wire is sandwiched between the substrate and the first protection layer. The edge wire and the first protection layer form an undercut structure. The second protection layer is configured on the substrate and fills the undercut structure. A manufacturing method of an electronic device is also provided.

Abstract: A semiconductor device package includes a substrate and a conductive lid. The conductive lid is disposed within the substrate. The conductive lid defines a waveguide having a cavity. The waveguide is configured to transmit a signal from a first electronic component to a second electronic component through the cavity.

Abstract: A cooling distribution unit includes a main body, a removable unit and an adjustment mechanism. The main body includes a first guiding structure. The removable unit includes a casing, a pump and a second guiding structure. The first guiding structure and the second guiding structure are coupled with each other. The adjustment mechanism includes a guiding slot and a fulcrum part. The guiding slot has a front end and a rear end. A distance between a center of the front end of the guiding slot and the fulcrum part is greater than a distance between a center of the rear end of the guiding slot and the fulcrum part. While the removable unit is locked on the main body or detached from the main body, the first guiding structure or the second guiding structure is disposed within the guiding slot.

Abstract: The present disclosure provides an electronic device. The electronic device includes a first interposer, a first interconnection array, a first shielding wall, and a second interconnection array. The first interconnection array is disposed in the first interposer and electrically connected to ground. The first shielding wall continuously extends at a side of the first interconnection array. The second interconnection array is disposed between the first shielding wall and the first interconnection array. The second interconnection array is configured to transmit a signal.

Abstract: The present disclosure provides a semiconductor device and a method of fabricating the same, the semiconductor device includes a substrate, an insulating layer, a plurality of bit lines, and a bit line contact. The insulating layer is disposed on the substrate, the bit lines are disposed on the insulating layer, and the bit line contact is disposed between the bit lines and the substrate, to electrically connect the bit lines, wherein the bit line contact comprises a first conductive layer and a first oxidized interface layer, and a bottommost surface of the first oxidized interface layer is lower than a top surface of the insulating layer. Through these arrangements, the semiconductor device includes the bit line contact having a composite semiconductor layer, which is allowable to improve the structural reliability of the bit lines and the bit line contacts, thereby achieve better performance.

Abstract: A memory device and a manufacturing method thereof are disclosed in the present invention. The memory device includes a substrate, trenches, an oxide semiconductor layer, a gate dielectric layer, and word line structures. The substrate includes active regions and an isolation structure located between the active regions. The active regions contain silicon. The trenches are disposed in the active regions and the isolation structure. The oxide semiconductor layer is disposed in each trench. The gate dielectric layer is disposed on the oxide semiconductor layer and located in each trench. The word line structures are disposed on the gate dielectric layer and located in the trenches, respectively. At least a portion of the gate dielectric layer is disposed between the oxide semiconductor layer and each word line structure.

Abstract: The present invention provides a semiconductor memory device including a substrate, a plurality of capacitors and a supporting layer disposed on the substrate, wherein each of the capacitors is connected with at least one of the adjacent capacitors through the supporting layer. Each of the capacitors includes first electrodes, a high-k dielectric layer and a second electrode, and the high-k dielectric layer is disposed between the first electrodes and the second electrode. Due to the supporting layer directly contacts the high-k dielectric layer through a surface thereof, and the high-k dielectric layer completely covers the surface, the second electrode may be formed directly within openings with an enlarged dimension. Accordingly, the process difficulty of performing the deposition and etching processes within the openings may be reduced, and the capacitance of the capacitors is further increased.

Abstract: A fan includes a motor base, a bearing, an impeller, a stator and a magnetic element. The motor base has a bearing stand in a center portion thereof. The impeller includes a metallic case, plural blades and a rotating shaft. A top surface of a top wall of the metallic case continuous with curved surface that defines part of a central opening, and a depth of the central opening is equal to a thickness of the top wall. The blades are disposed around an outer periphery of said metallic case. The rotating shaft is inserted into the central opening and penetrated through the bearing stand, wherein no raised ring structure is formed in the top wall, and the rotating shaft and the metallic case are jointed together by a laser welding process. The magnetic element is disposed on an inner wall of the metallic case and aligned with the stator.