Patents by Inventor Wen (Phil) Shih CHEN

Wen (Phil) Shih CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250187473
    Abstract: A charging pile device and related self-examination method are provided. The charging pile device includes a control pilot, a control unit, a micro-controller. The control pilot is configured to indicate a charging state of the charging pile device. The control unit includes a control pile state checking circuit and an alternating current charging checking circuit. The micro-controller unit is configured to change an operation voltage of the control pilot via the control pile state checking circuit of the control unit in response to the charging pile being under a non-charging state, and to generate a first charging checking signal to conduct a relay according to a checking signal via the alternating current charging checking circuit of the control unit to form a current path of the relay, a current transformer, and the control unit in response to the charging pile being under the non-charging state.
    Type: Application
    Filed: March 7, 2024
    Publication date: June 12, 2025
    Applicant: Wistron Corporation
    Inventors: Tsung-Han Yu, Cheng-Wei Huang, Chih-Fong Huang, Wen-Ju Chen
  • Publication number: 20250191506
    Abstract: A display panel driving method and a display device are provided. The display panel driving method includes: receiving a refresh rate switching instruction, where the refresh rate switching instruction is configured to control a display panel to switch from a first refresh rate to a second refresh rate; causing an input first video signal with a first image resolution and a first frame rate to be generated into a second video signal with a second image resolution and a second frame rate according to the refresh rate switching instruction; and outputting a scan driving signal corresponding to the second refresh rate and the second video signal to a plurality of pixels of the display panel.
    Type: Application
    Filed: December 30, 2023
    Publication date: June 12, 2025
    Applicant: TCL CHINA STAR OPTOELECTRONICS TECHNOLOGY CO., LTD.
    Inventors: Shuming CHANG, Zhifu LI, Yu WU, Tao HE, Yating WEN, Weisheng ZHENG, Yuning ZHANG, Qian WANG, Shijie DENG, Zhaoming LIANG, Fan CHEN
  • Publication number: 20250189881
    Abstract: Methods, systems, and computer software are disclosed for determining a mask pattern for use with a lithographic process. One method includes assigning locations of two-dimensional elements based on a target pattern, associating the two-dimensional elements based on association criteria to form a cluster that represents a mask feature, and adjusting the two-dimensional elements of the cluster to vary the mask feature.
    Type: Application
    Filed: February 28, 2023
    Publication date: June 12, 2025
    Applicant: ASML NETHERLANDS B.V.
    Inventors: Ya LUO, Yen-Wen LU, Been-Der CHEN, Rafael C. HOWELL, Quan ZHANG, Zhangnan ZHU, Xiaoshuang CHEN
  • Publication number: 20250192273
    Abstract: Disclosed in the present disclosure is a multi-sealed composite box structure, including: a box frame, including a side beam profile; a bottom protection plate layer, assembled to the box frame, and a side of the box frame assembled to the bottom protection plate layer being an assembling surface; a liquid cooling plate layer, positioned between the box frame and the bottom protection plate layer; a buffer layer, clamped between the bottom protection plate layer and the liquid cooling plate layer; at least two first edge sealing layers, sealed between the box frame and edges of the liquid cooling plate layer; and at least one second edge sealing layer, sealed between edges of the liquid cooling plate layer and edges of the bottom protection plate layer.
    Type: Application
    Filed: October 11, 2024
    Publication date: June 12, 2025
    Inventors: Yongjie Che, Liliang Huang, Shengde Wen, Yi Qiu
  • Publication number: 20250192278
    Abstract: A flow guiding cover assembly is adapted to be disposed in a cabinet, and between an air conditioning device and a carrier tray. The carrier tray carries at least one battery pack. The flow guiding cover assembly includes an air intake cover and at least one air outlet cover. The air intake cover is adapted to be disposed at one side of the air conditioning device, and is provided for a cooling airflow outputted by the air conditioning device to flow therethrough. The at least one air outlet cover is connected to the air intake cover and is adapted for discharging the cooling airflow to a top portion of the at least one battery pack.
    Type: Application
    Filed: November 12, 2024
    Publication date: June 12, 2025
    Inventors: Hao-Jhang Huang, Ying-Chi Chen, Wen-Chuan Chang, Chuan-Tse Lin
  • Publication number: 20250193601
    Abstract: A sound system includes a receiver and an amplifier. The receiver is configured to simultaneously receive a plurality of signals from a plurality of external devices. The amplifier is configured to amplify each of the plurality of signals, transform the plurality of signals into a plurality of amplified signals, and simultaneously transmit the plurality of amplified signals to a plurality of speakers. The sound system may be used in or on a mobile structure (e.g., recreational vehicles, boats, buses, etc.).
    Type: Application
    Filed: November 8, 2024
    Publication date: June 12, 2025
    Inventors: Ryan Matthew MURRAY, Wen-Tsan YEH
  • Publication number: 20250191988
    Abstract: An integrated chip (IC) device according to the present disclosure includes a device region, an interconnect structure disposed over the device region, and a seal ring surrounding the device region and the interconnect structure. The device region includes a transistor having a gate structure. The seal ring includes a metal structure. The gate structure is thermally coupled to the metal structure by way of a diode.
    Type: Application
    Filed: December 6, 2023
    Publication date: June 12, 2025
    Inventors: Yung-Shih Cheng, Wen-Sheh Huang
  • Publication number: 20250190187
    Abstract: According to embodiments, a computer-implemented method may include the steps of receiving, by a processor set and through a back-end user interface, input data including at least one prompt type and at least one associated answer type, wherein the at least one prompt type and at least one associated answer type define aspects of a front-end user interface; generating, by the processor set, rendering instructions based on the at least one prompt type and at least one associated answer type; receiving, by the processor set and from a front-end platform, a request to view the front-end user interface; and in response to receiving the request to view the front-end user interface, communicating, by the processor set, the rendering instructions to the front-end platform, wherein the rendering instructions cause the front-end platform to dynamically render the front-end user interface.
    Type: Application
    Filed: December 11, 2023
    Publication date: June 12, 2025
    Inventors: Kuan Yu Hsieh, Bo Wen, VINCE SIU, Chen Wang
  • Publication number: 20250193705
    Abstract: In a method, a first node receives first information from a second node, where the first information indicates a first model. The first node processes a second model based on the first model to obtain a third model. The third and first models have a same structure, and the second and first models are heterogeneous. The first node sends the second model to the second node. The third model meets a preset condition.
    Type: Application
    Filed: February 14, 2025
    Publication date: June 12, 2025
    Inventors: Yunfei Qiao, Gongzheng Zhang, Jian Wang, Rong Li, Wen Tong, Jianglei Ma
  • Publication number: 20250192081
    Abstract: A wire bonding structure and a manufacturing method thereof are provided. The wire bonding structure is suitable for chip packaging devices. The wire bonding structure includes a wire bonding pad layer, a metal layer and a buffer layer. The metal layer contacts and is underneath the wire bonding pad layer. The buffer layer contacts and is underneath the metal layer. The buffer layer has plural through holes spaced apart from each other. The through holes penetrate the buffer layer from top to bottom and correspondingly define plural low dielectric constant material blocks and plural air gaps that are laterally interleaved with each other in the cross-sectional direction.
    Type: Application
    Filed: September 10, 2024
    Publication date: June 12, 2025
    Inventor: Wen Cheng YANG
  • Publication number: 20250191621
    Abstract: A page buffer circuit adapted for a page-read device which including a memory array having several pages and several bit lines. The page buffer circuit comprises the following elements. First latches, receive a weight-vector from a corresponding one of the pages through the bit lines, and import an input-vector through a data input/output path. The weight-vector has a plurality of weight bit-data, and the input-vector has a plurality of input bit-data. Second latches, store the input bit-data of the input-vector. Logic operation units, coupled to the first latches to receive the weight bit-data, and coupled to the second latches to receive the input bit-data, perform a logic operation of the input bit-data and the weight bit-data to generate a logic operation result. The logic operation result is sent to one the first latches. A control circuit, selectively enables the logic operation units to perform the logic operation.
    Type: Application
    Filed: December 11, 2023
    Publication date: June 12, 2025
    Inventors: Bo-Rong LIN, Han-Wen HU, Yung-Chun LI, Huai-Mu WANG
  • Publication number: 20250194269
    Abstract: Various embodiments of the present disclosure are directed towards an integrated chip comprising a first photodetector arranged in a first substrate. The first photodetector absorbs light in a first wavelength range. A second substrate underlies the first substrate. A second photodetector is arranged on the second substrate. The second photodetector absorbs light in a second wavelength range different from the first wavelength range. A dielectric structure is arranged between a first surface of the first substrate and a first surface of the second substrate.
    Type: Application
    Filed: February 14, 2025
    Publication date: June 12, 2025
    Inventors: Hsiang-Lin Chen, Yi-Shin Chu, Yin-Kai Liao, Sin-Yi Jiang, Sung-Wen Huang Chen
  • Publication number: 20250193076
    Abstract: This disclosure describes systems, methods, and devices related to activating services and devices in a telecommunications network. A method may include receiving a user request for a service facilitated by a telecommunications network; identifying, based on the service, a device or port to which the user connects to access the telecommunications network; sending, based on the device or port, discovery commands to retrieve information from one or more additional devices in the telecommunications network; retrieving, based on the discovery commands, the information from the one or more additional devices; identifying, based on the information, a second device to which the device or port may connect to generate a path to an endpoint of the telecommunications network; generating, based on the device or port and the second device, a path from a location of the user to the endpoint; and provisioning the service for the user based on the path.
    Type: Application
    Filed: December 6, 2024
    Publication date: June 12, 2025
    Applicant: Level 3 Communications, LLC
    Inventors: Syed HAIDER, Christopher MAHAN, Boris ABRAMOVICH, Brett DWYER, Michael L. NYHUS, James C. DWYER, Liong ONG, Wen WANG
  • Publication number: 20250188001
    Abstract: Provided are systems and methods for synthesis of metastable intermolecular composites, specifically energetic nanocomposites. The method may include dispersing a reductive fuel within a first aqueous solution and combining the reductive fuel solution with a second aqueous solution comprising a metal oxide and base to create a reductive fuel-metal oxide/base solution. The reductive fuel-metal oxide/base solution is mixed and solid material is filtered and collected from the mixture. The solid material is heated to obtain reductive fuel-metal oxide energetic nanocomposites. The ratio of base to metal oxide can be varied to achieve different structures of including core-shell or well-mixed nanocomposites. The reductive fuel may be aluminum nanoparticles, the metal oxide may be copper oxide, and the base may be ammonia.
    Type: Application
    Filed: February 27, 2023
    Publication date: June 12, 2025
    Inventors: Haroon B. Oqab, George B. Dietrich, John Z. Wen, Jean-pierre Hickey, Anqi Wang, Shina Maini
  • Publication number: 20250194234
    Abstract: A semiconductor device includes a plurality of first stack structures formed in a first area of a substrate, wherein the plurality of first stack structures are configured to form a plurality of first transistors that operate under a first voltage level. The semiconductor device includes a plurality of second stack structures formed in a second area of the substrate, wherein the plurality of second stack structures are configured to form a plurality of second transistors that operate under a second voltage level greater than the first voltage level. The semiconductor device includes a first isolation structure disposed between neighboring ones of the plurality of first stack structures and has a first height. The semiconductor device includes a second isolation structure disposed between neighboring ones of the plurality of second stack structures and has a second height. The first height is greater than the second height.
    Type: Application
    Filed: February 18, 2025
    Publication date: June 12, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: Shih-Yao Lin, Hsiao Wen Lee, Yu-Shan Cheng, Ming-Ching Chang
  • Publication number: 20250189838
    Abstract: A display panel includes a first substrate, a second substrate, a sealant configured to mount the first substrate and the second substrate at a frame area; a display array disposed at a display area of the first substrate and the second substrate, in which the display area is surrounded by the frame area, a planarization layer disposed on an outer surface of the first substrate and including a plurality of reflective cavities, and a micro-LED array disposed at the frame area and including a plurality of micro-LEDs. The micro-LEDs are disposed in the reflective cavities.
    Type: Application
    Filed: November 14, 2024
    Publication date: June 12, 2025
    Inventors: Shang-Wei HSIEH, Jia-Hong Wang, Yi-Wen Lin, Wang-Shuo Kao, Ya-Ling Hsu, Chen-Hsien Liao
  • Publication number: 20250188411
    Abstract: The present disclosure provides a method for selective removal of undifferentiated pluripotent stem cells including inducing stem cells differentiation, and then administering an effective amount of phthalide for the removal of undifferentiated pluripotent stem cells.
    Type: Application
    Filed: December 6, 2024
    Publication date: June 12, 2025
    Inventors: Chia-Yu Chang, Hsiao-Chien Ting, Shinn-Zong Lin, Horng-Jyh Harn, Ching-Ann Liu, Hong-Lin Su, Tzyy-Wen Chiou, Yu-Shuan Chen
  • Publication number: 20250192437
    Abstract: An inverted F-shaped single-band antenna structure includes a ground terminal, an impedance-matching terminal, a radiation terminal, and a signal feed-in terminal. The ground terminal includes a body. The impedance-matching terminal is bent and extended from the body, and is connected perpendicularly to the body. The radiation terminal is bent and extended from the impedance-matching terminal, and is connected perpendicularly to the impedance-matching terminal, and is arranged correspondingly with the body. The signal feed-in terminal is bent and extended from the radiation terminal, and connected perpendicularly to the radiation terminal, and arranged correspondingly with the impedance-matching terminal, and not connected to the body.
    Type: Application
    Filed: December 7, 2023
    Publication date: June 12, 2025
    Inventors: Kai-Hsiung HSU, Chien-Wen HUNG, Jia-Jiu SONG
  • Publication number: 20250191403
    Abstract: In implementations of the subject matter as described herein, there is provided a method for forgery detection of a face image. Subsequent to inputting a face image, it is detected whether a blending boundary due to the blend of different images exists in the face image, and then a corresponding grayscale image is generated based on a result of the detection, where the generated grayscale image can reveal whether the input face image is formed by blending different images. If a visible boundary corresponding to the blending boundary exists in the generated grayscale image, it indicates that the face image is a forged image; on the contrary, if the visible boundary does not exist in the generated grayscale image, it indicates that the face image is a real image.
    Type: Application
    Filed: February 18, 2025
    Publication date: June 12, 2025
    Inventors: Jianmin Bao, Dong Chen, Hao Yang, Ting Zhang, Fang WEN, Baining Guo, Lingzhi Li
  • Publication number: 20250191971
    Abstract: The present disclosure relates to an integrated chip. The integrated chip comprises a dielectric layer over a substrate. A first metal feature is over the dielectric layer. A second metal feature is over the dielectric layer and is laterally adjacent to the first metal feature. A first dielectric liner segment extends laterally between the first metal feature and the second metal feature along an upper surface of the dielectric layer. The first dielectric liner segment extends continuously from along the upper surface of the dielectric layer, to along a sidewall of the first metal feature that faces the second metal feature, and to along a sidewall of the second metal feature that faces the first metal feature. A first cavity is laterally between sidewalls of the first dielectric liner segment and is above an upper surface of the first dielectric liner segment.
    Type: Application
    Filed: February 19, 2025
    Publication date: June 12, 2025
    Inventors: Hsi-Wen Tien, Chung-Ju Lee, Chih Wei Lu, Hsin-Chieh Yao, Shau-Lin Shue, Yu-Teng Dai, Wei-Hao Liao