Patents by Inventor Wen (Phil) Shih CHEN

Wen (Phil) Shih CHEN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12332368
    Abstract: The present disclosure discloses a position configuration method, a terminal device, and a network device. The position configuration method includes: determining position configuration information, where the position configuration information includes at least one of position shift information and position indication information; and determining a target position based on the position configuration information.
    Type: Grant
    Filed: June 20, 2022
    Date of Patent: June 17, 2025
    Assignee: VIVO MOBILE COMMUNICATION CO., LTD.
    Inventors: Siqi Liu, Zichao Ji, Kai Wu, Shuai Zhou, Wen Wang
  • Patent number: 12334625
    Abstract: A package structure includes a first die, an insulating material around the first die, a first antenna extending through the insulating material, wherein the first antenna includes a first conductive plate extending through the insulating material and a plurality of first conductive pillars extending through the insulating material, wherein the first conductive plate is disposed between the plurality of first conductive pillars and the first die, and a first high-k block embedded in the insulating material, wherein the first high-k block is disposed between the first conductive plate and the plurality of first conductive pillars, and wherein the first high-k block comprises a material having a dielectric constant that is different than a dielectric constant of the insulating material.
    Type: Grant
    Filed: July 14, 2022
    Date of Patent: June 17, 2025
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventor: Wen-Shiang Liao
  • Patent number: 12332537
    Abstract: An operation method of electronic device, comprising providing a first panel, wherein the first panel comprises first substrate, first medium layer disposed on the first substrate, a first electrode layer disposed between the first substrate and the first medium layer, and a second electrode layer disposed between the first electrode layer and the first medium layer; providing a second panel overlapped with the first panel, providing an adhesive layer, wherein the first panel is attached to the second panel through the adhesive layer, and the first panel and the second panel present a mirror-symmetrical structure with the adhesive layer as the axis of symmetry; applying a first voltage to the first electrode layer; applying a second voltage to the second electrode layer; applying a third voltage to the first electrode layer.
    Type: Grant
    Filed: June 6, 2024
    Date of Patent: June 17, 2025
    Assignee: Innolux Corporation
    Inventors: Mei-Wen Jao, Chang-Chiang Cheng, Yung-Hsun Wu, Rui-An Yu, Yi-Hsin Lin
  • Patent number: 12332038
    Abstract: An efficient cut blasting method for medium-length holes in deep high-stress rock roadway is disclosed. The method may comprise steps of carrying out a crustal stress blasting test on the free face of the in-situ rock roadway to be excavated, and obtaining a distribution state of cracks under a synergistic action of crustal stress, explosion stress waves and clamping force of surrounding rock of a rock mass in the stratum where the in-situ rock roadway to be excavated is located; arranging a cutting hole net on the free face of the rock roadway to be excavated according to a distribution state of the cracks; performing cut blasting based on the cutting hole net.
    Type: Grant
    Filed: June 27, 2023
    Date of Patent: June 17, 2025
    Assignee: UNIVERSITY OF SCIENCE AND TECHNOLOGY BEIJING
    Inventors: Renshu Yang, Chenxi Ding, Min Gong, Desheng Wang, Songlin He, Chenglong Xiao, Shuai You, Wen Chen
  • Patent number: 12332068
    Abstract: The embodiments of the present disclosure provide a method for planning a garbage cleaning route in a smart city and an Internet of Things (IoT) system. The method is implemented by the Internet of Things system for planning a garbage cleaning route in a smart city. The IoT system includes a user platform, a service platform, a management platform, a sensor network platform and an object platform. The method is performed by the management platform. The method includes obtaining monitoring information on at least one road in a road network area, and recognizing a garbage accumulation situation on the at least one road; determining at least one target garbage cleaning point based on the garbage accumulation situation; and determining a garbage cleaning route based on the at least one target garbage cleaning point.
    Type: Grant
    Filed: February 26, 2023
    Date of Patent: June 17, 2025
    Assignee: CHENGDU QINCHUAN IOT TECHNOLOGY CO., LTD.
    Inventors: Zehua Shao, Yaqiang Quan, Junyan Zhou, Xiaojun Wei, Zhihui Wen
  • Patent number: 12332472
    Abstract: An optical film comprises a light incident side and a light emitting side opposite to the light incident side. A plurality of light incident microstructures are formed on the light incident side, and the light incident microstructures are tapered structures. According to the structural design of the light incident microstructures of the optical film, the light field of a light source can be expanded to achieve the purpose of emitting light at a specific angle. The invention also provides a backlight module and a display device including the optical film.
    Type: Grant
    Filed: September 5, 2023
    Date of Patent: June 17, 2025
    Assignee: Radiant Opto-Electronics Corporation
    Inventors: Wei-Hsuan Chen, Chung-Yung Tai, Wen-Hao Cai, Chun-Yi Wu
  • Patent number: 12333714
    Abstract: Methods and systems of estimating b-values. One system including an electronic processor configured to receive a set of medical images associated with a patient, where the set of medical images are diffusion-weighted images. The electronic processor is also configured to extract a set of patches from each medical image included in the set of medical images. The electronic processor is also configured to determine, via an estimation model trained using machine learning, a set of estimated b-values, where each estimated b-value is associated with a patch included in the set of patches. The electronic processor is also configured to determine a b-value for each of the medical images included in the set of medical images, where the b-value is based on the set of estimated b-values.
    Type: Grant
    Filed: December 9, 2021
    Date of Patent: June 17, 2025
    Assignee: Merative US L.P.
    Inventors: Wen Wei, Giovanni John Jacques Palma, Amin Katouzian
  • Patent number: 12336210
    Abstract: The present disclosure describes a semiconductor structure and a method for forming the same. The semiconductor structure can include a substrate, a fin structure over the substrate, a gate structure over the fin structure, an epitaxial region formed in the fin structure and adjacent to the gate structure. The epitaxial region can embed a plurality of clusters of dopants.
    Type: Grant
    Filed: February 6, 2023
    Date of Patent: June 17, 2025
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Chien-Wei Lee, Chii-Horng Li, Heng-Wen Ting, Yee-Chia Yeo, Yen-Ru Lee, Chih-Yun Chin, Chih-Hung Nien, Jing-Yi Yan
  • Patent number: 12336393
    Abstract: A fabrication method for a substrate of a light-emitting device comprises: fabricating an organic photoresist layer on the surface of a substrate provided with a protruding structure, so that the organic photoresist layer covers the protruding structure, wherein by means of semi-exposing, developing and removing a portion of the thickness of a specific region of the organic photoresist layer, the specific region is a region of the organic photoresist layer that covers the protruding structure; and post-bake curing the remaining portion of the organic photoresist layer to form a planarization layer.
    Type: Grant
    Filed: November 10, 2020
    Date of Patent: June 17, 2025
    Assignee: GUANGDONG JUHUA PRINTED DISPLAY TECHNOLOGY CO., LTD
    Inventors: Yawen Chen, Wen Shi
  • Patent number: 12332388
    Abstract: Disclosed is a method for determining 224Ra in a sediment by using a pulse ionization chamber emanometer, which belongs to the technical field of analysis and measurement. A pulse ionization chamber emanometer (PIC), a new emanometer, is used. Based on the half-life characteristics of different radon isotopes, one can separate the 220Rn activity from the total counts by dual counting. The resulting 220Rn measurement then can be used to determine the 224Ra activity in sediment according to the principle of secular radioactive equilibrium.
    Type: Grant
    Filed: July 20, 2022
    Date of Patent: June 17, 2025
    Assignees: First Institute of Oceanography, Ministry of Natural Resources, Ocean University of China, Shandong Marine Resource and Environment Research Institute
    Inventors: Guangquan Chen, Wen Liu, Shibin Zhao, Chunqian Li, Jinjia Guo, Yancheng Wang, Bochao Xu, Xiaofei Yin, Shan Sun
  • Patent number: 12334397
    Abstract: A method includes forming a first conductive feature, depositing a graphite layer over the first conductive feature, patterning the graphite layer to form a graphite conductive feature, depositing a dielectric spacer layer on the graphite layer, depositing a first dielectric layer over the dielectric spacer layer, planarizing the first dielectric layer, forming a second dielectric layer over the first dielectric layer, and forming a second conductive feature in the second dielectric layer. The second conductive feature is over and electrically connected to the graphite conductive feature.
    Type: Grant
    Filed: July 21, 2021
    Date of Patent: June 17, 2025
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Shu-Cheng Chin, Chih-Yi Chang, Wei Hsiang Chan, Chih-Chien Chi, Chi-Feng Lin, Hung-Wen Su
  • Patent number: 12331392
    Abstract: A deposition system is provided capable of cleaning itself by removing a target material deposited on a surface of a collimator. The deposition system in accordance with the present disclosure includes a substrate process chamber. The deposition includes a substrate pedestal in the substrate process chamber, the substrate pedestal configured to support a substrate, a target enclosing the substrate process chamber, and a collimator having a plurality of hollow structures disposed between the target and the substrate, a vibration generating unit, and cleaning gas outlet.
    Type: Grant
    Filed: August 10, 2023
    Date of Patent: June 17, 2025
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Wen-Hao Cheng, Hsuan-Chih Chu, Yen-Yu Chen
  • Patent number: 12330541
    Abstract: A child safety seat includes a seat shell and a buffering part. The seat shell includes a backrest portion having a front surface and at least one sidewall arranged at a side of the front surface, and an opening is formed in the sidewall. The buffering part is arranged at the sidewall, the buffering part being rotatable relative to the sidewall between a first position and a second position, wherein the buffering part is positioned at the sidewall such that during a sideways collision the buffering part urges the sidewall to bend inwardly.
    Type: Grant
    Filed: June 28, 2023
    Date of Patent: June 17, 2025
    Assignee: BAMBINO PREZIOSO SWITZERLAND AG
    Inventors: Xiao Long Mo, Da Liang Zhang, Zheng-Wen Guo, Ying-Zhong Chen
  • Patent number: 12334342
    Abstract: The present disclosure provides a method for semiconductor manufacturing in accordance with some embodiments. The method includes forming a hard mask layer over a substrate, the substrate having one or more regions to receive a treatment process, forming a resist layer over the hard mask layer, patterning the resist layer to form a plurality of openings in the resist layer, each of the openings free of concave corners, performing an opening expanding process to enlarge at least one of the openings in the resist layer, transferring the openings in the resist layer to the hard mask layer, and performing the treatment process to the one or more regions in the substrate through the openings in the hard mask layer.
    Type: Grant
    Filed: July 30, 2023
    Date of Patent: June 17, 2025
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yu-Tien Shen, Ya-Wen Yeh, Wei-Liang Lin, Ya Hui Chang, Yung-Sung Yen, Wei-Hao Wu, Li-Te Lin, Ru-Gun Liu, Kuei-Shun Chen
  • Patent number: 12332477
    Abstract: Methods and apparatus to reduce stress on lasers in optical transceivers are disclosed. An apparatus comprising a printed circuit board (PCB) having a first side and a second side opposite the first side; and a first stiffener attached to the first side of the PCB; and a photonic integrated circuit (PIC) attached to the first stiffener. The first stiffener is between the PIC and the PCB. The apparatus also includes a second stiffener attached to the second side of the PCB.
    Type: Grant
    Filed: September 14, 2021
    Date of Patent: June 17, 2025
    Assignee: Intel Corporation
    Inventors: Aditi Mallik, Pengyue Wen, Quan Tran, Wendai Wang, Xiaozhong Wang
  • Patent number: 12336104
    Abstract: A photosensitive assembly includes a circuit board and a photosensitive chip disposed on the circuit board. A first direction is defined as a direction from the circuit board to the photosensitive chip. The circuit board is convex in the first direction or an opposite direction of the first direction. The photosensitive chip is in the first direction or the opposite direction of the first direction. A bending direction of the circuit board is the same as a bending direction of the photosensitive chip.
    Type: Grant
    Filed: November 22, 2022
    Date of Patent: June 17, 2025
    Assignee: TRIPLE WIN TECHNOLOGY(SHENZHEN) CO.LTD.
    Inventors: Wen-Ching Lai, Wan-Li Zhang, Zhi-Wei Li, Ya-Jie Niu
  • Patent number: 12335264
    Abstract: Aspects of the invention include systems and methods configured to prevent masquerading service attacks. A non-limiting example computer-implemented method includes sending, from a first server in a cloud environment, a communication request comprising an application programming interface (API) key and a first server identifier to an identity and access management (IAM) server of the cloud environment. The API key can be uniquely assigned by the IAM server to a first component of the first server. The first server receives a credential that includes a token for the first component and sends the credential to a second server. The second server sends the credential, a second server identifier, and an identifier for a second component of the second server to the IAM server. The second server receives an acknowledgment from the IAM server and sends the acknowledgment to the first server.
    Type: Grant
    Filed: February 14, 2024
    Date of Patent: June 17, 2025
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Sen Wang, Mei Liu, Si Bo Niu, Wen Yi Gao, Zong Xiong ZX Wang, Guoxiang Zhang, Xiao Yi Tian, Xian Wei Zhang
  • Patent number: D1079281
    Type: Grant
    Filed: March 27, 2024
    Date of Patent: June 17, 2025
    Assignee: Colgate-Palmolive Company
    Inventors: Fan Gang Xie, Yanmei Ji, Wen Jin Xi
  • Patent number: D1079411
    Type: Grant
    Filed: March 2, 2025
    Date of Patent: June 17, 2025
    Inventors: Jiasheng Fu, Xiaomou Wen, Shui Wu
  • Patent number: D1079891
    Type: Grant
    Filed: December 28, 2023
    Date of Patent: June 17, 2025
    Assignee: SHENZHEN UAH TECHNOLOGY CO., LTD
    Inventors: Shengbo Lu, Qiang Geng, Shen Tian, Weixin Luo, Biting Wen