Patents by Inventor Wen Sung

Wen Sung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20170040292
    Abstract: A semiconductor package includes a substrate, a first electronic component, a first conductive layer, a first pillar layer and a first package body. The first electronic component is disposed on the substrate. The first pillar layer connects the first conductive layer and the substrate. The first package body encapsulates the first conductive layer, the first pillar layer and the first electronic component. The first conductive layer is embedded in the first package body.
    Type: Application
    Filed: May 24, 2016
    Publication date: February 9, 2017
    Inventors: Wen-Sung Hsu, Shih-Chin Lin, Tao Cheng
  • Publication number: 20170037448
    Abstract: The invention utilizes virtual screening strategy to seek for current market drugs as anti-schizophrenia therapy drug repurposing. Drug repurposing strategy finds new uses other than the original medical indications of existing drugs. Finding new indications for such drugs will benefit patients who are in needs for a potential new therapy sooner since known drugs are usually with acceptable safety and pharmacokinetic profiles. In this study, repurposing marketed drugs for DAAO inhibitor as new schizophrenia therapy was performed with virtual screening on marketed drugs and its metabolites. The identified and available drugs and compounds were further confirmed with in vitro DAAO enzymatic inhibitory assay.
    Type: Application
    Filed: April 30, 2015
    Publication date: February 9, 2017
    Inventors: Yufeng Jane TSENG, Yu-Li LIU, Chung-Ming SUN, Hai-Gwo HWU, Chih-Min LIU, Wen-Sung LAI
  • Publication number: 20170023222
    Abstract: A head lamp device for wearing on a head and emitting lights outwardly is disclosed and comprises a cover member, a main control member, a sensing member, and at least two lamps. The main control member is mounted on the cover member. A receiving unit and a control unit are embedded in the main control member and electrically connected with each other wirelessly or wiredly. The sensing member is electrically connected with the main control member and installed in the cover member. The sensing member is detecting an inclined angle of the head and generating a signal for being transmitted to the main control member and received by the receiving unit. The lamps are electrically connected with the control unit. The lamps are controlled to turn on/off, adjust brightness, and change light-on/off priority by the control unit. The sensing member detects the change of the angle via moving the head.
    Type: Application
    Filed: July 24, 2015
    Publication date: January 26, 2017
    Inventor: Wen-Sung Lee
  • Patent number: 9553040
    Abstract: The invention provides a semiconductor package. The semiconductor package includes a semiconductor package includes a substrate having a die attach surface. A die is mounted on die attach surface of the substrate via a conductive pillar bump. The die comprises a metal pad electrically coupling to the conductive pillar bump, wherein the metal pad has a first edge and a second edge substantially vertical to the first edge, wherein the length of the first edge is different from that of the second edge from a plan view.
    Type: Grant
    Filed: March 15, 2013
    Date of Patent: January 24, 2017
    Assignee: MEDIATEK INC.
    Inventors: Wen-Sung Hsu, Tzu-Hung Lin, Ta-Jen Yu
  • Patent number: 9539326
    Abstract: An (acid-substituted polyaniline)-grafted hydrogel copolymer is provided. The (acid-substituted polyaniline)-grafted hydrogel copolymer has a general formula as below: wherein A is a proton acid group, m and n are same or different integers greater than 0, x is an integer equal to or greater than 0, and y is an integer equal to or greater than 1, provided that x and y are the same or different at each occurrence, and at least an x is not 0. The (acid-substituted polyaniline)-grafted hydrogel copolymer is formed by the polymerization and substitution reaction between chitosan, polyaniline, and proton acid. The (acid-substituted polyaniline)-grafted hydrogel copolymer behaves as a pH-responsive hydrogel with photo-thermal properties and can be applied to photo-thermal therapy.
    Type: Grant
    Filed: June 1, 2016
    Date of Patent: January 10, 2017
    Assignee: NATIONAL TSING HUA UNIVERSITY
    Inventors: Hsing-Wen Sung, Chun-Wen Hsiao, Chieh-Cheng Huang, Min-Fan Chung, Zi-Xian Liao, Wei-Lun Chiang
  • Patent number: 9541273
    Abstract: A heat dissipation structure of an SMD LED includes a substrate, an SMD LED and at least one engaging member. A plurality of conductive copper foils is covered on an upper end face of the substrate. Two electrodes are provided on a lower surface of the SMD LED and are respectively connected to two copper foils on the upper end face. An engaging hole extends through one of the copper foils adjacent the SMD LED and through the substrate. The engaging member is made of high thermal conductive metal and is engaged in the engaging hole to combine the copper foil and the substrate. Accordingly, heat generated by the SMD LED can be directly transferred to an exposed lower end face of the substrate through the engaging member for more heat dissipation and less luminance decrease of the SMD LED.
    Type: Grant
    Filed: May 22, 2014
    Date of Patent: January 10, 2017
    Inventor: Wen-Sung Hu
  • Patent number: 9520349
    Abstract: A semiconductor package is provided. In one configuration, the semiconductor package includes a substrate. A conductive trace is disposed on the substrate. A conductive pillar bump is disposed on the conductive trace, wherein the conductive bump is coupled to a die. In another configuration, a first conductive trace is disposed on the substrate, and a second conductive trace is disposed on the substrate. In the second configuration, a conductive pillar bump disposed on the second conductive trace, connecting to a conductive bump or a metal pad of the semiconductor die. A first conductive structure is disposed between the second conductive trace and the conductive pillar bump or between the second conductive trace and the substrate, and a die is disposed over the first conductive trace.
    Type: Grant
    Filed: February 2, 2015
    Date of Patent: December 13, 2016
    Assignee: MEDIATEK INC.
    Inventors: Wen-Sung Hsu, Tzu-Hung Lin, Ta-Jen Yu
  • Publication number: 20160360593
    Abstract: A smart lighting device for vehicle is disclosed and comprises a light body, a light collection unit, a lightening unit, and light focusing glass. An output current of the pulse-width modulation unit is zero while the light collection unit is collecting the ambient light brightness, even the lightening unit is not lightened, so that there is not any light brightness in the light body and then the ambient light brightness of the light projection area is accurately detected while the light collection unit is collecting the ambient light brightness of the light projection area.
    Type: Application
    Filed: June 4, 2015
    Publication date: December 8, 2016
    Inventor: Wen-Sung Lee
  • Publication number: 20160358877
    Abstract: A semiconductor package is provided. The semiconductor package includes a semiconductor device bonded to a base through a first conductive structure. The semiconductor device includes a carrier substrate including a conductive trace. A portion of the conductive trace is elongated. The semiconductor device also includes a second conductive structure above the carrier substrate. A portion of the second conductive structure is in contact with the portion of the conductive trace. The semiconductor device further includes a semiconductor body mounted above the conductive trace. The semiconductor body is connected to the second conductive structure.
    Type: Application
    Filed: August 16, 2016
    Publication date: December 8, 2016
    Inventors: Che-Ya CHOU, Wen-Sung HSU, Nan-Cheng CHEN
  • Publication number: 20160350654
    Abstract: An intelligent home system installed in a house and interacted with appliances in the house comprises an identification device; a locating device; and an artificial neural device; the artificial neural device includes a recording unit, a learning unit, and a decision making unit, the recording unit, the learning unit, and the decision making unit are transmitted signals to one another, the recording unit records and stores the ID information, the coordinate information, and a control information of each appliance which is adjusted by the user, the learning unit reads the ID information, the coordinate information, and the control information so as to automatically learn and integrate to generate an integrated data, and the decision making unit reads the integrated data to adjust the appliances to an operational status which the user is used to.
    Type: Application
    Filed: August 10, 2016
    Publication date: December 1, 2016
    Inventor: WEN-SUNG LEE
  • Publication number: 20160343632
    Abstract: A chip package includes a patterned conducting plate having a plurality of conducting sections electrically separated from each other, a plurality of conducting pads disposed on an upper surface of the patterned conducting plate, wherein a recess extending from a surface of one of the conducting pads towards an inner portion of the corresponding one of the conducting pads, a chip disposed on the conducting pads, a plurality of conducting bumps disposed on a lower surface of the patterned conducting plate, wherein each of the conducting bumps is electrically connected to a corresponding one of the conducting sections of the patterned conducting plate, and an insulating support layer partially surrounding the conducting bumps.
    Type: Application
    Filed: August 2, 2016
    Publication date: November 24, 2016
    Inventors: Wen-Sung HSU, Ming-Chieh LIN, Ta-Jen YU
  • Publication number: 20160322240
    Abstract: A semiconductor apparatus is provided. The semiconductor apparatus includes a wafer carrier, and a cup surrounding the wafer carrier. The semiconductor apparatus also includes a bottom washing device located between the wafer carrier and the cup, and configured to spray washing liquid onto the cup. Therefore, the cup can be washed by the bottom washing device.
    Type: Application
    Filed: April 30, 2015
    Publication date: November 3, 2016
    Inventors: Chun-Yu LEE, Sheng-Hung LO, Wen-Lung HO, Wen-Sung TSENG
  • Publication number: 20160307863
    Abstract: The invention provides a semiconductor package. The semiconductor package includes a semiconductor die having a central area and a peripheral area surrounding the central area. A first conductive bump is disposed on the semiconductor die in the central area. A second conductive bump is disposed on the semiconductor die in the peripheral area. An area ratio of the first conductive bump to the second conductive bump from a top view is larger than 1, and less than or equal to 3.
    Type: Application
    Filed: June 22, 2016
    Publication date: October 20, 2016
    Applicant: MediaTek Inc.
    Inventors: Tzu-Hung Lin, Wen-Sung Hsu, Tai-Yu Chen
  • Publication number: 20160307861
    Abstract: The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a conductive trace embedded in a base. A semiconductor device is mounted on the conductive trace via a conductive structure.
    Type: Application
    Filed: June 28, 2016
    Publication date: October 20, 2016
    Applicant: Media Tek Inc.
    Inventors: Tzu-Hung Lin, Wen-Sung Hsu, Ta-Jen Yu, Andrew C. Chang
  • Publication number: 20160279463
    Abstract: A method for fabricating a slip-proof pattern on a sport instrument comprises steps: providing a sport instrument with at least one slip-proof surface; preparing a coating material comprising a paint and a foaming agent evenly mixed thereinside; using the coating material to draw a slip-proof pattern on the slip-proof surface, and keeping the sport instrument still until the slip-proof pattern is dried and fixed; and heating the slip-proof pattern to make the foaming agent of the coating material generate gas and make the slip-proof pattern expand and protrude from the slip-proof surface. The conventional technology fabricates slip-proof strips and a sport instrument into a one-piece component. The present invention replaces the conventional technology with a method of directly forming a slip-proof pattern in a drawing or spraying way to simplify the complicated process and reduce the cost.
    Type: Application
    Filed: May 6, 2015
    Publication date: September 29, 2016
    Inventor: Wen-Sung CHANG
  • Publication number: 20160286018
    Abstract: A smartwatch includes a display device connected to the thereof, and a communication device and a circuit board are respectively located in the body. The communication device has a speaking unit and a receiving unit. A watchband is connected to the body and a scrolling unit is located in the body. The scrolling unit has a mandrel and a wire which is wrapped to the mandrel. Two ends of the wire are respectively connected to the speaking unit and the circuit board. A clip member is connected to the speaking unit so that the user clips the clip member and pulls the wire out to move the speaking unit close to the user's ear.
    Type: Application
    Filed: March 23, 2015
    Publication date: September 29, 2016
    Inventor: Wen-Sung Lee
  • Patent number: 9452130
    Abstract: The pharmaceutical composition includes a drug layer comprising an active ingredient, a surfactant, an acidic component and an effervescent ingredient. The active ingredient comprises a nucleic acid, a peptide or a protein. The acidic component and effervescent ingredient of the drug layer are dissolved in the water to react for generating carbon dioxide and bubbles thereof. The surfactants surround the carbon dioxide gas core and form a double-layer structure having an inner layer and outer layer. The active ingredient is embedded in a gap formed between the inner layer and the outer layer of the double-layer structure.
    Type: Grant
    Filed: December 1, 2014
    Date of Patent: September 27, 2016
    Assignee: NATIONAL TSING HUA UNIVERSITY
    Inventors: Hsing-Wen Sung, Er-Yuan Chuang, Po-Yen Lin
  • Publication number: 20160271250
    Abstract: An (acid-substituted polyaniline)-grafted hydrogel copolymer is provided. The (acid-substituted polyaniline)-grafted hydrogel copolymer has a general formula as below: wherein A is a proton acid group, m and n are same or different integers greater than 0, x is an integer equal to or greater than 0, and y is an integer equal to or greater than 1, provided that x and y are the same or different at each occurrence, and at least an x is not 0. The (acid-substituted polyaniline)-grafted hydrogel copolymer is formed by the polymerization and substitution reaction between chitosan, polyaniline, and proton acid. The (acid-substituted polyaniline)-grafted hydrogel copolymer behaves as a pH-responsive hydrogel with photo-thermal properties and can be applied to photo-thermal therapy.
    Type: Application
    Filed: June 1, 2016
    Publication date: September 22, 2016
    Inventors: Hsing-Wen Sung, Chun-Wen Hsiao, Chieh-Cheng Huang, Min-Fan Chung, Zi-Xian Liao, Wei-Lun Chiang
  • Publication number: 20160263709
    Abstract: A semiconductor package includes a first substrate, a second substrate, a composite solder ball and a first semiconductor component. The composite solder ball includes a core, an encapsulating layer and a barrier layer. The composite solder ball is disposed between the first substrate and the second substrate for electrically connecting the first substrate and the second substrate. The barrier layer is disposed between the core and the encapsulating layer. Wherein a melting point of the barrier layer is higher than a melting point of the core, the melting point of the core is higher than a melting point of the encapsulating layer. The first semiconductor component is disposed between the first substrate and the second substrate.
    Type: Application
    Filed: October 21, 2015
    Publication date: September 15, 2016
    Inventors: Tao Cheng, Wen-Sung Hsu, Shih-Chin Lin
  • Patent number: 9437577
    Abstract: A package on package (POP) structure includes at least a first package and a second package. The first package has a plurality of pillar bump pins. The second package has a plurality of pads connected to the pillar bump pins, respectively. A method of forming a package on package (POP) structure includes at least the following steps: providing a first package with a plurality of pillar bump pins; providing a second package with a plurality of pads; and forming the POP structure by connecting the pillar bump pins to the pads.
    Type: Grant
    Filed: May 9, 2014
    Date of Patent: September 6, 2016
    Assignee: MEDIATEK INC.
    Inventors: Wen-Sung Hsu, Shih-Chin Lin