Patents by Inventor Wen Sung

Wen Sung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10553526
    Abstract: A semiconductor package is provided. In one configuration, the semiconductor package includes a substrate having a die attach surface. A conductive trace is disposed on the substrate, wherein the conductive trace is elongated and carries a signal or a ground across at least a portion of the substrate. A die is mounted on the die attach surface of the substrate via a conductive pillar bump, the conductive pillar bump being rounded and elongated such that the conductive pillar bump extends along a length of the conductive trace and contacts the conductive trace at an end or at an intermediate portion thereof. The die further includes a metal pad electrically coupling to the conductive pillar bump, wherein the metal pad has a first edge and a second edge substantially vertical to the first edge, and wherein the first edge is not adjacent to the second edge.
    Type: Grant
    Filed: March 16, 2017
    Date of Patent: February 4, 2020
    Assignee: MediaTek Inc.
    Inventors: Wen-Sung Hsu, Tzu-Hung Lin, Ta-Jen Yu
  • Patent number: 10535582
    Abstract: A semiconductor thermal-conductive heat sink structure includes a substrate and a thermal-conductive heat sink device. The substrate includes opposed upper and lower planes. A top conductive copper foil is provided on the upper plane to carry a semiconductor device. The thermal-conductive heat sink device includes at least one cooling fin and a high thermal-conductive rivet. A clearance is formed between the cooling fin and a thermal-conductive heat sink device socket or between two adjacent cooling fins such that greater cooling areas are available to the thermal-conductive heat sink device. With the thermal-conductive rivet joining the top conductive copper foil and the cooling fins, heat generated by the activated semiconductor device is quickly conducted through the rivet and dissipated from the greater cooling areas of the cooling fins to prevent malfunction of the semiconductor device attributed to heat accumulation induced by poor heat dissipation.
    Type: Grant
    Filed: November 22, 2017
    Date of Patent: January 14, 2020
    Inventor: Wen-Sung Hu
  • Publication number: 20200013735
    Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a first redistribution layer (RDL) structure formed on a non-active surface of a semiconductor die. A second RDL structure is formed on and electrically coupled to an active surface of the semiconductor die. A ground layer is formed in the first RDL structure. A first molding compound layer is formed on the first RDL structure. A first antenna includes a first antenna element formed in the second RDL structure and a second antenna element formed on the first molding compound layer. Each of the first antenna element and the second antenna element has a first portion overlapping the semiconductor die as viewed from a top-view perspective.
    Type: Application
    Filed: June 25, 2019
    Publication date: January 9, 2020
    Applicant: MediaTek Inc.
    Inventors: Nai-Wei Liu, Yen-Yao Chi, Yeh-Chun Kao, Shih-Huang Yeh, Tzu-Hung Lin, Wen-Sung Hsu
  • Patent number: 10515887
    Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a first carrier substrate having a first surface and an opposing second surface. A second carrier substrate is stacked on the first carrier substrate and has a first surface and an opposing second surface that faces the first surface of the first carrier substrate. A semiconductor die is mounted on the first surface of the second carrier substrate. A heat spreader is disposed on the first surface of the first carrier substrate to cover and surround the second carrier substrate and the semiconductor die. A method for forming the semiconductor package structure is also provided.
    Type: Grant
    Filed: September 11, 2017
    Date of Patent: December 24, 2019
    Assignee: MediaTek Inc.
    Inventors: Shih-Yi Syu, Chia-Yu Jin, Che-Ya Chou, Wen-Sung Hsu, Nan-Cheng Chen
  • Publication number: 20190376813
    Abstract: A cloud metering and analyzing system is provided. The cloud metering and analyzing system of the present invention includes an automatic-meter-reading module, at least one gateway device, and a cloud server. The automatic-meter-reading module is directly connected to at least one terminal meter having no communication function to collect at least one measurement value from the at least one terminal meter. The at least one gateway device is connected to the automatic-meter-reading module to receive and transmit the at least one measurement value. The cloud server is connected to the at least one gateway device to receive and store the at least one measurement value from the at least one gateway device in real time and automatically produce an analysis report according to the at least one measurement value.
    Type: Application
    Filed: August 3, 2019
    Publication date: December 12, 2019
    Inventors: Chin-Lung Weng, Wen-Sung Chu
  • Publication number: 20190348748
    Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a semiconductor die surrounded by a first molding compound layer. A redistribution layer (RDL) structure is formed on a non-active surface of the semiconductor die and the first molding compound layer. A second molding compound layer is formed on the RDL structure. An insulating capping layer covers the second molding compound layer. An antenna is electrically coupled to the semiconductor die and includes a first antenna element formed in the RDL structure and a second antenna element formed between the second molding compound layer and the insulating capping layer.
    Type: Application
    Filed: April 17, 2019
    Publication date: November 14, 2019
    Applicant: MediaTek Inc.
    Inventors: Nai-Wei Liu, Yen-Yao Chi, Tzu-Hung Lin, Wen-Sung Hsu
  • Publication number: 20190348747
    Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a redistribution layer (RDL) structure formed on a non-active surface of a semiconductor die. An antenna structure includes a first antenna element formed in the RDL structure, a first insulating layer covering the RDL structure, a second insulating layer formed on the first insulating layer, and a second antenna element formed on and in direct contact with the second insulating layer.
    Type: Application
    Filed: April 17, 2019
    Publication date: November 14, 2019
    Applicant: MediaTek Inc.
    Inventors: Nai-Wei Liu, Yen-Yao Chi, Yeh-Chun Kao, Shih-Huang Yeh, Tzu-Hung Lin, Wen-Sung Hsu
  • Publication number: 20190348756
    Abstract: A method of forming a semiconductor package structure includes providing a first wafer-level package structure having a die region surrounded by a scribe line region. The first wafer-level package structure includes a first encapsulating layer, a first redistribution layer (RDL) structure formed on the first encapsulating layer, a first antenna element formed in the first RDL structure and corresponding to the die region, and a semiconductor die in the first encapsulating layer and corresponding to the die region. A second wafer-level package structure is bonded onto the first RDL structure using a first adhesive layer. The second wafer-level package structure includes a second encapsulating layer attached to the first adhesive layer, and a second antenna element formed on the second encapsulating layer. The second antenna element and the first antenna element form a pitch antenna after the bonding of the second wafer-level package structure.
    Type: Application
    Filed: April 30, 2019
    Publication date: November 14, 2019
    Applicant: MediaTek Inc.
    Inventors: Nai-Wei Liu, Yen-Yao Chi, Tzu-Hung Lin, Wen-Sung Hsu
  • Patent number: 10462271
    Abstract: A fastening device is used to snap and carry an electronic device which includes a plurality of positioning holes on its bottom side. The fastening device has a sliding unit and a carrier unit. The sliding unit is used to connect with and carry the electronic device and includes two guiding rails, a pushing portion, and a plurality of positioning pins. The carrier unit is connected with the sliding unit and comprises a plate, a plurality of first limiting units, a plurality of second limiting units, and a link-handle. Through the fastening device, the assembly process for the electronic device is simplified.
    Type: Grant
    Filed: March 27, 2016
    Date of Patent: October 29, 2019
    Assignees: INVENTEC (PUDONG) TECHNOLOGY CORPORATION, INVENTEC CORPORATION
    Inventor: Tzu Wen Sung
  • Patent number: 10354974
    Abstract: A chip package structure and a method for forming a chip package are provided. The chip package structure includes a first package which includes at least a semiconductor die, a dielectric structure surrounding the semiconductor die, and a plurality of conductive structures penetrating through the dielectric structure and surrounding the semiconductor die. The package structure also includes an interposer substrate over the first package and a plurality of conductive features in or over the interposer substrate. The package structure further includes a second package over the interposer substrate, and the first package electrically couples the second package through the conductive structures and the conductive features.
    Type: Grant
    Filed: June 11, 2015
    Date of Patent: July 16, 2019
    Assignee: MediaTek Inc.
    Inventors: Wen-Sung Hsu, Shih-Chin Lin, Andrew C. Chang, Tao Cheng
  • Publication number: 20190201438
    Abstract: A sustained-release composition is provided in the present disclosure for producing a therapeutic gas, such as hydrogen. The sustained-release composition includes a precursor and a carrier. The precursor is magnesium, and the carrier is for carrying the precursor with an efficient amount, wherein the carrier includes a poly lactic-co-glycolic acid copolymer.
    Type: Application
    Filed: March 12, 2019
    Publication date: July 4, 2019
    Inventors: Hsing-Wen SUNG, Chieh-Cheng HUANG, Wei-Lin WAN, Meng-Hsuan HSIEH, Po-Chien SHIH, Hsin-Yi HU
  • Patent number: 10340199
    Abstract: A packaging substrate includes a core layer having a first surface and a second surface. A group of ground pads is disposed on the second surface within a central region. A group of first power pads is disposed on the second surface within the central region. A plurality of signal pads is disposed on the second surface within a peripheral region that encircles the central region on the second surface. A first block-type via is embedded in the core layer within the central region. The group of ground pads is electrically connected to the first block-type via. A second block-type via is embedded in the core layer within the central region. The group of first power pads is electrically connected to the second block-type via.
    Type: Grant
    Filed: October 29, 2015
    Date of Patent: July 2, 2019
    Assignee: MediaTek Inc.
    Inventors: Wen-Sung Hsu, Tai-Yu Chen
  • Patent number: 10340198
    Abstract: The invention provides a semiconductor package and a method for fabricating the same. The semiconductor package includes a redistribution layer (RDL) structure, a semiconductor die, a molding compound and a supporter. The RDL structure has a first surface and a second surface opposite to the first surface. The semiconductor die is disposed on the first surface of the RDL structure and electrically coupled to the RDL structure. The molding compound is positioned overlying the semiconductor die and the first surface of the RDL structure. The supporter is positioned beside the semiconductor die and in contact with the first surface of the RDL structure.
    Type: Grant
    Filed: January 26, 2018
    Date of Patent: July 2, 2019
    Assignee: MEDIATEK INC.
    Inventors: Ta-Jen Yu, Wen-Sung Hsu
  • Publication number: 20190192253
    Abstract: Ultrasound imaging is a non-invasive, non-radioactive, and low cost technology for diagnosis and identification of implantable medical devices in real time. Developing new ultrasound activated coatings is important to broaden the utility of in vivo marking by ultrasound imaging. Ultrasound responsive macro-phase segregated micro-composite thin films were developed to be coated on medical devices composed of multiple materials and with multiple shapes and varying surface area. The macro-phase segregated in films having silica micro-shells in polycyanoacrylate produces strong color Doppler signals with the use of a standard clinical ultrasound transducer. Electron microscopy showed a macro-phase separation during slow curing of the cyanoacrylate adhesive, as air-filled silica micro-shells were driven to the surface of the film. The air sealed in the hollow space of the silica shells acted as an ultrasound contrast agent and echo decorrelation of air exposed to ultrasound waves produces color Doppler signals.
    Type: Application
    Filed: August 31, 2017
    Publication date: June 27, 2019
    Applicant: The Regents of the University of California
    Inventors: Jian Yang, Alexander Liberman, James Wang, Christopher Barback, Natalie Mendez, Erin Ward, Sarah Blair, Andrew C. Kummel, Tsai-Wen Sung, William C. Trogler
  • Patent number: 10322088
    Abstract: The present disclosure provides a sustained-release composition including a sodium hydrosulfide and a carrier. The carrier is provided for carrying the sodium hydrosulfide with an effective amount and includes a first component and a second component. The first component includes a paraffin wax, and the second component includes a fatty alcohol, a fatty acid or a phospholipid. The present disclosure also provides a method for fabricating the sustained-release composition. The method includes providing a first solution, providing the carrier, providing a second solution, performing an oil-in-water emulsification, and cooling the emulsion. In addition, the present disclosure provides a method for treating the chronic wounds. The method includes administering an effective amount of the aforementioned sustained-release composition to a subject suffered from the chronic wounds.
    Type: Grant
    Filed: September 21, 2017
    Date of Patent: June 18, 2019
    Assignee: NATIONAL TSING HUA UNIVERSITY
    Inventors: Hsing-Wen Sung, Wei-Chih Lin, Shu-Jyuan Lin
  • Patent number: 10312222
    Abstract: A semiconductor package includes a substrate, a first electronic component, a first conductive layer, a first pillar layer and a first package body. The first electronic component is disposed on the substrate. The first pillar layer connects the first conductive layer and the substrate. The first package body encapsulates the first conductive layer, the first pillar layer and the first electronic component. The first conductive layer is embedded in the first package body.
    Type: Grant
    Filed: December 20, 2017
    Date of Patent: June 4, 2019
    Assignee: MEDIATEK INC.
    Inventors: Wen-Sung Hsu, Shih-Chin Lin, Tao Cheng
  • Publication number: 20190164780
    Abstract: The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a base. The base has a device-attach surface. A radio-frequency (RF) device is embedded in the base. The RF device is close to the device-attach surface.
    Type: Application
    Filed: January 31, 2019
    Publication date: May 30, 2019
    Applicant: Media Tek Inc.
    Inventors: Wen-Sung Hsu, Ta-Jen Yu
  • Patent number: 10300809
    Abstract: A control system includes a bicycle includes a crank, a motor and a battery which provides power to the motor. An acceleration detector is connected to the bicycle and detects the riding acceleration of the bicycle. A torque detector is connected to the bicycle and consistently detects treading of the crank and generates multiple instant treading torque values. A controller is connected to the bicycle and electrically connected to the motor, the battery, the acceleration detector and the torque detector, and receives the riding acceleration, the treading acceleration and the instant treading torque values so as to control output of the motor and the battery instantly.
    Type: Grant
    Filed: May 10, 2017
    Date of Patent: May 28, 2019
    Assignee: GUAN HUNG TECHNOLOGY CO., LTD.
    Inventor: Wen-Sung Lee
  • Patent number: 10265342
    Abstract: A sustained-release composition is provided in the present disclosure for producing a therapeutic gas, such as hydrogen sulfide or hydrogen. The sustained-release composition includes a precursor and a carrier. The precursor is diallyl trisulfide or magnesium, and the carrier includes a poly lactic-co-glycolic acid copolymer for carrying the precursor with an efficient amount.
    Type: Grant
    Filed: August 8, 2017
    Date of Patent: April 23, 2019
    Assignee: NATIONAL TSING HUA UNIVERSITY
    Inventors: Hsing-Wen Sung, Chieh-Cheng Huang, Wei-Lin Wan, Meng-Hsuan Hsieh, Po-Chien Shih, Hsin-Yi Hu
  • Patent number: D874043
    Type: Grant
    Filed: May 7, 2018
    Date of Patent: January 28, 2020
    Inventor: Wen-Sung Lee