Abstract: The present disclosure provides a sustained-release composition including a sodium hydrosulfide and a carrier. The carrier is provided for carrying the sodium hydrosulfide with an effective amount and includes a first component and a second component. The first component includes a paraffin wax, and the second component includes a fatty alcohol, a fatty acid or a phospholipid. The present disclosure also provides a method for fabricating the sustained-release composition. The method includes providing a first solution, providing the carrier, providing a second solution, performing an oil-in-water emulsification, and cooling the emulsion. In addition, the present disclosure provides a method for treating the chronic wounds. The method includes administering an effective amount of the aforementioned sustained-release composition to a subject suffered from the chronic wounds.

Abstract: A semiconductor package includes a package substrate having a top surface and a bottom surface, an interposer mounted on the top surface of the package substrate, a first semiconductor die and a second semiconductor die mounted on the interposer in a side-by-side manner, and a stiffener ring secured to the top surface of the package substrate. The stiffener ring encircles the first semiconductor die and the second semiconductor die. The stiffener ring comprises a reinforcement rib striding across the interposer.

Abstract: A speed control system for electric bicycles includes a bicycle having pedals, a motor and a battery which provides electric power to the motor. The bicycle includes a speed detector to detect speed of the bicycle to create a current speed value. A controller is electrically connected to the motor, the battery and the speed detector. The controller has a preset constant-speed setting value. The controller receives the current speed value from the speed detector, and compares the current speed value with the preset constant-speed setting value to adjust output or the motor and the battery. The controller changes the output of the motor and the battery according to the current speed so that the motor assists the rider to operate the bicycle instantly.

Abstract: A chip package includes a patterned conducting plate having a plurality of conducting sections electrically separated from each other, a plurality of conducting pads disposed on an upper surface of the patterned conducting plate, wherein a recess extending from a surface of one of the conducting pads towards an inner portion of the corresponding one of the conducting pads, a chip disposed on the conducting pads, a plurality of conducting bumps disposed on a lower surface of the patterned conducting plate, wherein each of the conducting bumps is electrically connected to a corresponding one of the conducting sections of the patterned conducting plate, and an insulating support layer partially surrounding the conducting bumps.

Abstract: A speed control system for electric bicycles includes a bicycle having pedals, a motor and a battery which provides electric power to the motor. The bicycle includes a speed detector to detect speed of the bicycle to create a current speed value. A controller is electrically connected to the motor, the battery and the speed detector. The controller has a preset constant-speed setting value. The controller receives the current speed value from the speed detector, and compares the current speed value with the preset constant-speed setting value to adjust output of the motor and the battery. The controller changes the output of the motor and the battery according to the current speed so that the motor assists the rider to operate the bicycle instantly.

Abstract: A bicycle lighting device includes a reflection cup in which a light collection unit and a light source and are respectively located therein. A speed detector is connected to the bicycle lighting device and a controller so as to detecting the speed of a vehicle moving toward the bicycle. The light collection unit collects brightness of the headlight of the vehicle. A pulse width modulation unit is electrically connected to the light collection unit and the light source. The pulse width modulation unit adjusts the flashing frequency of the light source according to the speed of the vehicle moving toward the bicycle lighting device.

Abstract: The invention provides a semiconductor package and a method for fabricating the same. The semiconductor package includes a redistribution layer (RDL) structure, a semiconductor die, a molding compound and a supporter. The RDL structure has a first surface and a second surface opposite to the first surface. The semiconductor die is disposed on the first surface of the RDL structure and electrically coupled to the RDL structure. The molding compound is positioned overlying the semiconductor die and the first surface of the RDL structure. The supporter is positioned beside the semiconductor die and in contact with the first surface of the RDL structure.

Abstract: The invention provides a semiconductor package. The semiconductor package includes a semiconductor die and a conductive pillar bump structure and a conductive plug. The semiconductor die has a die pad thereon. The conductive pillar bump structure is positioned overlying the die pad. The conductive pillar bump structure includes an under bump metallurgy (UBM) stack having a first diameter and a conductive plug on the UBM stack. The conductive plug has a second diameter that is different than the first diameter.

Abstract: An electric bicycle includes two pedals, a motor, a battery providing power to the motor, a first detection member for detecting acceleration of the electric bicycle and trading acceleration of the pedals, and a controller. The controller receives the acceleration of the electric bicycle and the treading acceleration of the pedals from the first detection member, and then controls output of the motor and the battery. When the treading acceleration of the pedals is larger than the acceleration of the electric bicycle, the controller concludes that the resistance from outside to the electric bicycle increases, the controller increases output of the motor and the battery. When the treading acceleration of the pedals is smaller than the acceleration of the electric bicycle, the controller concludes that the resistance from outside to the electric bicycle decreases, the output of the motor and the battery is reduced.

Abstract: An electric bicycle includes two pedals, a motor, a battery providing power to the motor, a first detection member for detecting acceleration of the electric bicycle and trading acceleration of the pedals, and a controller. The controller receives the acceleration of the electric bicycle and the treading acceleration of the pedals from the first detection member, and then controls output of the motor and the battery. When the treading acceleration of the pedals is larger than the acceleration of the electric bicycle, the controller concludes that the resistance from outside to the electric bicycle increases, the controller increases output of the motor and the battery. When the treading acceleration of the pedals is smaller than the acceleration of the electric bicycle, the controller concludes that the resistance from outside to the electric bicycle decreases, the output of the motor and the battery is reduced.

Abstract: The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a base. The base has a device-attach surface. A radio-frequency (RF) device is embedded in the base. The RF device is close to the device-attach surface.

Abstract: The present disclosure provides a temperature-responsive composition including a nitric oxide donor and a carrier. The nitric oxide donor is a pH-dependent material, and the carrier is provided for carrying the nitric oxide donor with an effective amount. The carrier includes a protective agent and an organic protic acid. A transition temperature of the temperature-responsive composition is larger than or equal to 28° C. and less than or equal to 37° C.

Abstract: A control device for an electric bicycle includes a motor, a battery, a micro controller, an acceleration detector and a transmitter electrically connected to each other. A physical-condition monitor detects the rider's heart rate signal. A computer calculates an electric power consumption value from the micro controller, an acceleration value from the acceleration detector, and the heart rate signal to create a motor output adjustment signal which is created according to the practical conditions of the rider. The motor output adjustment signal is sent to the micro controller to adjust the output of the battery to the motor and the assistance force to the bicycle.

Abstract: The present invention provides a pharmaceutical composition, comprising a hydrophobic active ingredient; a surfactant having hydrophobic end and hydrophilic end; an acidic component; and an effervescent ingredient. The acidic component reacts with the effervescent ingredient in water to generate carbon dioxide. The hydrophobic ends of the surfactant surround carbon dioxide. The hydrophobic active ingredient attaches to the hydrophobic ends of the surfactant.

Abstract: A semiconductor package includes a substrate, a first electronic component, a first conductive layer, a first pillar layer and a first package body. The first electronic component is disposed on the substrate. The first pillar layer connects the first conductive layer and the substrate. The first package body encapsulates the first conductive layer, the first pillar layer and the first electronic component. The first conductive layer is embedded in the first package body.

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a first carrier substrate having a first surface and an opposing second surface. A second carrier substrate is stacked on the first carrier substrate and has a first surface and an opposing second surface that faces the first surface of the first carrier substrate. A semiconductor die is mounted on the first surface of the second carrier substrate. A heat spreader is disposed on the first surface of the first carrier substrate to cover and surround the second carrier substrate and the semiconductor die. A method for forming the semiconductor package structure is also provided.

Abstract: The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a base. The base has a device-attach surface. A radio-frequency (RF) device is embedded in the base. The RF device is close to the device-attach surface.

Abstract: A package substrate is provided. The package substrate includes a dielectric layer and a passive component embedded in the dielectric layer and contacting the dielectric layer. A circuit layer is embedded in the dielectric layer and has a first surface aligned with a second surface of the dielectric layer. A conductive structure is embedded in the dielectric layer and electrically connected to the passive component and the circuit layer. A chip package is also provided.

Abstract: A method for fabricating a semiconductor is disclosed. A carrier substrate is provided. A redistribution layer (RDL) structure is formed on the carrier substrate. The RDL structure comprises at least a bump pad. A semiconductor die is mounted on the RDL structure. A molding compound is formed on the semiconductor die and the RDL structure. The carrier substrate is removed to reveal a plurality of solder ball pads of the RDL structure. A plurality of conductive structures are formed on the solder ball pads.

Abstract: A semiconductor package includes a first substrate, a second substrate, a composite solder ball and a first semiconductor component. The composite solder ball includes a core, an encapsulating layer and a barrier layer. The composite solder ball is disposed between the first substrate and the second substrate for electrically connecting the first substrate and the second substrate. The barrier layer is disposed between the core and the encapsulating layer. Wherein a melting point of the barrier layer is higher than a melting point of the core, the melting point of the core is higher than a melting point of the encapsulating layer. The first semiconductor component is disposed between the first substrate and the second substrate.