Abstract: The present invention relates to a semiconductor thermal-conductive heat sink structure including a substrate and a thermal-conductive heat sink device. The substrate includes opposed upper and lower planes. A top conductive copper foil is provided on the upper plane to carry a semiconductor device. The thermal-conductive heat sink device includes at least one cooling fin and a high thermal-conductive rivet. A clearance is formed between the cooling fin and a thermal-conductive heat sink device socket or between two adjacent cooling fins such that greater cooling areas are available to the thermal-conductive heat sink device. With the thermal-conductive rivet joining the top conductive copper foil and the cooling fins, heat generated by the activated semiconductor device is fast conducted through the rivet and dissipated from greater cooling areas of the cooling fins for no malfunction of the semiconductor device attributed to heat accumulation induced by poor heat dissipation.

Abstract: A semiconductor package includes a substrate, a first electronic component, a film and a package body. The first electronic component is disposed on the substrate and has an upper surface. The film is disposed on the upper surface of the first electronic component. The package body encapsulates the first electronic component and the film.

Abstract: A package substrate is provided. The package substrate includes a dielectric layer and a passive component embedded in the dielectric layer and contacting the dielectric layer. A circuit layer is embedded in the dielectric layer and has a first surface aligned with a second surface of the dielectric layer. A conductive structure is embedded in the dielectric layer and electrically connected to the passive component and the circuit layer. A chip package is also provided.

Abstract: The invention provides a semiconductor package and a method for fabricating a base for a semiconductor package. The semiconductor package includes a base. The base has a device-attach surface. A radio-frequency (RF) device is embedded in the base. The RF device is close to the device-attach surface.

Abstract: A pharmaceutical composition for oral delivery is provided with a poorly water-soluble drug; solvent with lipophilic tails and hydrophilic ends; an acid initiator; and a foaming agent generating carbon dioxide bubbles when the acid initiator is dissolved into the intestinal fluid to form an acidic environment. The poorly water-soluble drug is dissolved in the solvent to form a self-assembled monolayer carrier system with the bile salts surrounding the carbon dioxide bubbles in water when the pharmaceutical composition is dissolved in an intestinal tract, and lipid oil drops containing the poorly water-soluble drug form when the carbon dioxide bubbles burst at the air-liquid interface in the intestinal tract.

Abstract: A method for fabricating a semiconductor is disclosed. A carrier substrate is provided. A redistribution layer (RDL) structure is formed on the carrier substrate. The RDL structure comprises at least a bump pad. A semiconductor die is mounted on the RDL structure. A molding compound is formed on the semiconductor die and the RDL structure. The carrier substrate is removed to reveal a plurality of solder ball pads of the RDL structure. A plurality of conductive structures are formed on the solder ball pads.

Abstract: A semiconductor package includes a first substrate, a first layer structure, a second layer structure and a first antenna layer. The first antenna layer is formed on at least one of the first layer structure and the second layer structure. The first layer structure is formed between the first substrate and the second layer structure.

Abstract: A manufacturing method of a semiconductor package includes the follow steps. Firstly, a carrier is provided. Then, a package substrate is formed. Then, a first electronic component is disposed above the second conductive layer of the package substrate. Then, a second package body encapsulating the first electronic component and the second conductive layer is formed. Then, the carrier is carried. Wherein in the step of forming the package substrate includes a step of forming a first conductive layer on the carrier, a step of forming a first pillar layer on the first conductive layer, a step of forming a first package body encapsulating the first conductive layer and the first pillar layer and a step of forming a second conductive layer on the first pillar layer.

Abstract: A semiconductor package structure including an encapsulating layer, a package substrate, and a conductive shielding layer is provided. The package substrate has a device region covered by the encapsulating layer and an edge region surrounding the device region and exposed from the encapsulating layer. The package substrate includes an insulating layer and a patterned conductive layer in a level of the insulating layer. The patterned conductive layer includes conductors in and along the edge region. The edge region is partially exposed from the conductors, as viewed from a top-view perspective. The conductive shielding layer covers and surrounds the encapsulating layer and is electrically connected to the conductors.

Abstract: A control system for an electric bike includes a controller which has a first Bluetooth transmitting unit connected to a mobile device by a wireless way. The mobile device includes a second Bluetooth transmitting unit, a detector and an operation application. The user calls a learning application which learns the operation application that currently operates the bike in different situations, and then the learning application takes over the control of the bike, Therefore, the user does not need a hand to operate the mobile device to control the bike.

Abstract: A semiconductor apparatus is provided. The semiconductor apparatus includes a wafer carrier, and a cup surrounding the wafer carrier. The semiconductor apparatus also includes a bottom washing device located between the wafer carrier and the cup, and configured to spray washing liquid onto the cup. Therefore, the cup can be washed by the bottom washing device.

Abstract: A control system for an electric hike includes control application which receives battery/motor output signals from other electric bikes from the cloud processing center to as to control the output of the battery to the motor to adjust the output of the battery and the motor at different travel routes. The adjusted output of the battery and the motor at different travel routes of the users' electric hike is transmitted to the transmitters of other electric bikes by a smart phone so as to reduce the burden of learning of the users of other electric bikes.

Abstract: A data protection method and associated apparatus are provided. The data protection method may include: running a data protection application on a host server system, the data protection application being configured to protect a data set stored in a tenant server system, wherein the host server system and the tenant server system are administered by different entities; receiving a plurality of versions of the data set from the tenant server system; and issuing at least one version request to get at least one specific version of the data set from the tenant server system, wherein the at least one specific version and the plurality of versions of the data set form a sequential version order of the data set.

Abstract: A cloud metering and analyzing system is provided. The cloud metering and analyzing system has at least one gateway device and a cloud server. The least one gateway device is connected to at least one terminal meter to receive and transmit at least one measurement value from the at least one terminal meter. The cloud server is connected to the at least one gateway device to receive and store the at least one measurement value from the at least one gateway device in real time and automatically produce an analysis report according to the at least one measurement value.

Abstract: A power generation device is installed to a bicycle crank to provide electric power to electronic products. The power generation device includes a sensor for sensing the speed of the bicycle and the crank, and generates a speed info. A micro-controller is electrically connected to the sensor and a power supply unit, and includes a transfer unit, a switch unit and an output unit. The speed info is transferred to the transfer unit and converted into transformed signals. The switch unit activates the power supply unit according to the transformed signals. When the sensor detect that the bicycle moves at inconstant speed and the crank rotates continuously, the output unit delivers electric power to the electronic products. When the sensor detects that the bicycle moves at constant speed and the crank rotates continuously, the output unit shuts off the power supply unit, and the power supply unit stores power.

Abstract: A sustained-release composition is provided in the present disclosure for producing a therapeutic gas, such as hydrogen sulfide or hydrogen. The sustained-release composition includes a precursor and a carrier. The precursor is diallyl trisulfide or magnesium, and the carrier includes a poly lactic-co-glycolic acid copolymer for carrying the precursor with an efficient amount.

Abstract: A control system includes a bicycle includes a crank, a motor and a battery which provides power to the motor. An acceleration detector is connected to the bicycle and detects the riding acceleration speed of the bicycle. A torque detector is connected to the bicycle and consistently detects treading of the crank and generates multiple instant treading torque values. A controller is connected to the bicycle and electrically connected to the motor, the battery, the acceleration detector and the torque detector, and receives the riding acceleration speed, the treading acceleration speed and the instant treading torque values so as to control output of the motor and the battery instantly.

Abstract: A method for fabricating a base for a semiconductor package is provided. The method operates by providing a carrier with conductive seed layers on the top surface and the bottom surface of the carrier, forming radio-frequency (RF) devices respectively on the conductive seed layers, laminating a first base material layer and a second base material layer respectively on the conductive seed layers, covering the RF devices, and separating the first base material layer the second base material layer, which contain the RF devices thereon, from the carrier to form a first base and a second base.

Abstract: The invention provides a semiconductor package. The semiconductor package includes a semiconductor die having a central area and a peripheral area surrounding the central area. A first conductive bump is disposed on the semiconductor die in the central area. A second conductive bump is disposed on the semiconductor die in the peripheral area. An area ratio of the first conductive bump to the second conductive bump from a top view is larger than 1, and less than or equal to 3.