Abstract: This invention provides a method of preparing microsphere composite of collagen and bioceramic powder. This method first mixes a collagen solution with bioceramic powder and alginate, and squeezes the mixture solution to spherical droplets being discharged into a divalent cation solution undergoing gelling to form microspheres. Next, the microsphere is coated with a chitosan solution. Then, interior alginate and surface chitosan of the microsphere are liquefied and washed out with an aqueous buffer solution such as phosphate based buffer, and collagen in the microsphere is reconstituted to fiber network at the same time. The prepared microsphere composite has similar composition components of bone tissue, and the collagen thereof has a network of reconstituted fibers. The microsphere composite of this invention provides a similar growth environment of bone tissue cells, is used as a carrier to carry cells, coat and fix bone growth factors, and is applied in bone repair.

Abstract: A carrier dispatch and transfer method is disclosed, which actuates an optimal carrier dispatch and transfer table for generating elements with a kernel of genetic algorithm by a multi-thread method to search setting confinement conditions and object. A plurality of samples are generated randomly, each including a two dimensional carrier dispatch encoding table. The carrier dispatch encoding table and its transportation duties correspond to chromosomes and genes in a genetic algorithm. The samples are utilized as parent generations for being estimated according to a defined object function and a confinement formula. By rule of roulette wheel, selection possibilities of chromosomes with relative superior fitness values are enhanced. After performing processes of chromosome crossover and mutation, a process of sample update is performed by local gene exchange to select superior samples based on the fitness values.

Abstract: A bond pad structure and a method of fabricating such structure are disclosed in the invention. The bond pad structure is formed over a predetermined area defined on a semiconductor substrate. The bond pad structure includes at least two metal layers formed over the predetermined area and at least one sub-structure combination layer which each is formed over the predetermined area and formed between two corresponding first metal layers. Each sub-structure combination layer includes a dielectric layer formed over the predetermined area, formed-through via openings with special disposition on the dielectric layer, a first diffusion barrier layer formed over the dielectric layer and the sidewalls and bottom of the via openings, a metal material filled into the via openings to form via plugs, and a second diffusion barrier layer formed over the first diffusion barrier layer and via plugs.

Abstract: An illuminating apparatus includes a plurality of light sources that generate a plurality of primary color light components, a reflector unit for receiving the primary color light components from the light sources, and an integrator having an input side to receive the primary color light components reflected by the reflector unit.

Abstract: A high efficiency heat sink includes a first chamber, a second chamber and at least one cooling fin. The first chamber contains coolant and absorbs heat from a heat source, vaporizing the coolant. The second chamber receives the vaporized coolant from the first chamber, transmits the heat from the vaporized coolant to the cooling fin so that the vaporized coolant is condensed, and forces the condensed coolant back to the first chamber via capillary pressure.

Abstract: An apparatus for reducing an electrical noise inside a ball grid array package is disclosed. The apparatus mainly comprises a substrate, a plurality of solder balls and a plurality of inside-connected capacitors. The substrate includes a contact layer, a power plane and a ground plane. The plurality of solder balls are fixed on the contact layer. The plurality of inside-connected capacitors are fixed on the contact layer, and a conductive glue is used to electrically connect the capacitors to the power plane and ground plane to reduce the electrical noise between the power plane and ground plane.

Abstract: A projection display includes a transmissive first light valve and a reflective second light valve that are disposed adjacent to a polarization beam splitter prism and that are used to modulate first, second and third color components. The modulated first, second and third color components are then obtained from one side of the polarization beam splitter prism.

Abstract: A testing jig for semiconductor components, mainly comprising a main jig body, wherein on its bottom is provided with a retrieving head. While on the center of the bottom of the retrieving head is provided with a concave space, around which is arranged a plurality of air holes which are connected with the internal airways and also connected with the air inlet on the top of the main body. Furthermore, on the bottom of the main jig body is provided with two buffer blocks on opposite sides, which can prevent the chip on the center of the base board from being contacted with external force or foreign objects in the process of retrieving the base board during testing.

Abstract: A projection display includes a transmissive first light valve and a reflective second light valve that are disposed adjacent to a polarization beam splitter prism and that are used to modulate first, second and third color components. The modulated first, second and third color components are then obtained from one side of the polarization beam splitter prism.

Abstract: In a three-prism projection display, input light is separated by a polarization beam splitter prism into a first color component, which is received by a first dichroic beam splitter prism and processed by a first light modulator, and second and third color components, which are received by a second dichroic beam splitter prism and processed by second and third light modulators, respectively.

Abstract: A multi-layer substrate for an IC chip having a plurality of pads comprises a first layer having a plurality of conducting lines electrically connected to the pads of the IC chip, whereby a first current is generated in the conducting lines, and a second layer has a ground plane electrically connected to a ground, and a plurality of via holes penetrating the second layer and the conducting plane, wherein the via holes are arranged to make a second current in the conducting plane induced by the first current flowing to the ground.

Abstract: The present invention relates to a testing jig for semiconductor components, mainly comprising a main jig body, wherein on its bottom is provided with a retrieving head. While on the center of the bottom of the retrieving head is provided with a concave space, around which is arranged a plurality of air holes which are connected with the internal airways and also connected with the air inlet on the top of the main body. Furthermore, on the bottom of the main jig body is provided with two buffer blocks on opposite sides, which can prevent the chip on the center of the base board from being contacted with external force or foreign objects in the process of retrieving the base board during testing.

Abstract: An illuminating apparatus includes a plurality of light sources that generate a plurality of primary color light components, a reflector unit for receiving the primary color light components from the light sources, and an integrator having an input side to receive the primary color light components reflected by the reflector unit.

Abstract: A method for reducing electrical noise inside a ball grid array package for installing capacitors between a plurality of power pads and ground pads on a top side of a substrate of the ball grid array package coats solder paste on the plurality of power pads and ground pads, coats adhesive glue beneath the plurality of capacitors, fixes the plurality of capacitors on the power pads and ground pads with the adhesive glue and solder paste, and solidifies the adhesive glue in a reflow soldering stove.

Abstract: A projection screen includes a lens base having a front side, a rear side, and an array of bores that extend from the rear side to the front side. Each of the bores tapers in a direction from the rear side to the front side. The front side is formed with a plurality of windows, each of which is aligned and communicated with a respective one of the bores. Light that enters the bores from the rear side of the lens base is subjected to multiple total internal reflections as the light propagates along the bores prior to exiting the lens base at the windows.

Abstract: A bond pad structure and a method of fabricating such structure are disclosed in the invention. The bond pad structure is formed over a predetermined area defined on a semiconductor substrate. The bond pad structure includes at least two metal layers formed over the predetermined area and at least one sub-structure combination layer which each is formed over the predetermined area and formed between two corresponding first metal layers. Each sub-structure combination layer includes a dielectric layer formed over the predetermined area, formed-through via openings with special disposition on the dielectric layer, a first diffusion barrier layer formed over the dielectric layer and the sidewalls and bottom of the via openings, a metal material filled into the via openings to form via plugs, and a second diffusion barrier layer formed over the first diffusion barrier layer and via plugs.

Abstract: A multi-layered substrate having built-in capacitors is used to decouple high frequency noise generated by voltage fluctuations between a power plane and a ground plane of a multi-layered substrate. At least one kind of dielectric material, which is filled in through holes between the power plane and the ground plane, with high dielectric constant is used to form the built-in capacitors.

Abstract: This invention discloses a flame retarding thermoplastic resin composition, which is comprised of (i) a thermoplastic resin and (ii) a phenolic resin compound as a flame retardant, wherein the phenolic resin compound contains a nitrogen-containing heterocycle and phosphorus. Since the flame retarding thermoplastic resin composition of this invention does not contain halogen, and has excellent flame retardant properties and high heat resistance, it is useful in producing parts and products in the fields of electronics, electricity and automobile.

Abstract: Multiple characteristics of an signal are measured to determine the presence of an alert tone on an incoming signal to a customer premises equipment (CPE) in preparation for receipt of FSK modem signals. The apparatus, method, and article of manufacture discern the presence of an alert tone by measuring characteristics of the incoming signal. The alert tone is able to be discerned even under crosstalk conditions and over a wide dynamic range with the digital signal processing (DSP) method and apparatus described. Multiple characteristics of the signal are measured to determine the presence of the alert tone.