Patents by Inventor Wen Tsay

Wen Tsay has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20040103764
    Abstract: The invention relates to a T-handle ratchet wrench including a lateral bar and a ratchet set. The lateral bar has a hollow connection part located in the center of the lateral bar and used for installing the ratchet set. Two flanks of the lateral bar make up a handgrip, respectively. The top of ratchet set is provided with a rotation button while a vertical bar extends downwardly from the rotation button. At least one of the handgrips includes a pivotal ear with a through hole, and the pivotal ear can be fitted into an insertion slot with a through hole at the free end of the lateral bar. A pivotal pin then passes through the through hole in the pivotal ear and the through hole in the insertion slot. This permits a pivotal movement of the handgrip on the pivotal pin. Accordingly, this configuration will considerably minimize the occupied space in packing, transport, storage and carrying. Particularly, the operators can more easily apply his force on the driver under special operation environments.
    Type: Application
    Filed: September 22, 2003
    Publication date: June 3, 2004
    Inventor: Wen-Tsai Shyu
  • Patent number: 6732446
    Abstract: A device for rapidly cooling a semiconductor wafer test/transfer machine and which includes a body which is provided with an interior gas passage one end of which is connected to a source of clean, dry air or other gas by a tubing. In typical application, the body is rested on the cover of a semiconductor wafer test or transfer machine, typically above or adjacent to the chuck or other wafer holder of the machine, with the other end of the gas passage in contact with the cover. The air or gas flowing through the gas passage impinges against the machine cover and rapidly cools the chuck or other wafer holder.
    Type: Grant
    Filed: April 25, 2002
    Date of Patent: May 11, 2004
    Assignee: Taiwan Semiconductor Manufacturing Co. Ltd
    Inventors: Pao-Kun Liao, Wen-Tsai Su
  • Patent number: 6732442
    Abstract: An apparatus and method for adjusting the position of a load port utilized in a semiconductor wafer processing system. Generally, a door opener can be configured for opening a door through which a semiconductor wafer may enter for subsequent positioning and processing thereof by a semiconductor wafer processing system. A load port is associated with the door opener. A calibration mechanism can then be utilized for calibrating the load port for leveling and height positioning, such that a plurality of directional axis associated with the load port do not interfere with one another, thereby conserving calibration time while permitting a single individual to perform calibration operations thereof.
    Type: Grant
    Filed: July 15, 2002
    Date of Patent: May 11, 2004
    Assignee: Taiwan Semiconductor Manufacturing Co., Ltd
    Inventors: Yaw-Wen Wu, Tung-Gan Cheng, Tung-Liang Wua, Cheng-Chao Lin, Hsueh-Cheng Lin, Chia-Fu Tsai, Chih-Jung Yeh, Hung-Tse Huang, Ray-Wen Tsai
  • Publication number: 20040006883
    Abstract: An apparatus and method for adjusting the position of a load port utilized in a semiconductor wafer processing system. Generally, a door opener can be configured for opening a door through which a semiconductor wafer may enter for subsequent positioning and processing thereof by a semiconductor wafer processing system. A load port is associated with the door opener. A calibration mechanism can then be utilized for calibrating the load port for leveling and height positioning, such that a plurality of directional axis associated with the load port do not interfere with one another, thereby conserving calibration time while permitting a single individual to perform calibration operations thereof.
    Type: Application
    Filed: July 15, 2002
    Publication date: January 15, 2004
    Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
    Inventors: Yaw-Wen Wu, Tung-Gan Cheng, Tung-Liang Wua, Cheng-Chao Lin, Hsueh-Cheng Lin, Chia-Fu Tsai, Chih-Jung Yeh, Hung-Tse Huang, Ray-Wen Tsai
  • Patent number: 6664126
    Abstract: This invention provides a fabrication process for manufacturing of truly 3-dimensional micromechanisms which takes advantages of SOI (silicon-on-insulator) wafers each of which is processed to create a respective structural element of the 3-dimensional micromechanisms by DRIE (deep reactive ion etching) of the wafer and thermal oxidation of the trenches opened during the DRIE etching. The wafers are sequentially bonded into a multistack structure from which the 3-D micromechanism. is released by XeF2 etching. Thermally grown SiO2 is used as structural material for the 3-D micromechanism.
    Type: Grant
    Filed: February 27, 2002
    Date of Patent: December 16, 2003
    Assignee: University of Maryland, College Park
    Inventors: Donald Lad Devoe, Lung-Wen Tsai
  • Patent number: 6653574
    Abstract: A multi-layered substrate having built-in capacitors is disclosed. The substrate comprises at least one high permittivity of dielectric material filled in the through holes between the power plane and the ground plane so as to form capacitors. The built in capacitors are to decouple high frequency noise due to the voltage fluctuation.
    Type: Grant
    Filed: August 23, 2001
    Date of Patent: November 25, 2003
    Assignee: Silicon Integrated Systems Corporation
    Inventors: Chen-Wen Tsai, Chung-Ju Wu, Wei-Feng Lin
  • Patent number: 6648208
    Abstract: A method of manufacturing a joint between metal and a ceramic substrate for a high temperature sensor. First, a predetermined hole is formed in the ceramic substrate to serve as a joint portion. A bonding layer is preferably disposed on the ceramic substrate to form on the inner surface and the surrounding portion of the hole. Next, the hole is filled with a supporting metal. Then, a conductive layer is formed on the supporting metal and the bonding layer. A metal signal conductive frame is then formed on the conductive layer. Next, a welding spot is formed through the metal signal conductive frame, the conductive layer and the supporting metal at the joint portion by a welding process.
    Type: Grant
    Filed: August 12, 2002
    Date of Patent: November 18, 2003
    Inventors: Leu-Wen Tsay, Ren-Kae Shiue
  • Patent number: 6644386
    Abstract: A heat-dissipating member includes a sheet, an upper extension, and a lower extension. Each extension includes an engaging portion having a pair of opposed engaging hooks with an engaging slot defined therebetween. Each engaging hook is connected to an associated extension via a slant lug. Each engaging portion includes a rear portion extending into an associated extension, thereby leaving a notched portion on an associated end of the sheet. The slant lugs of the engaging portion of the heat-dissipating member are extendible into a rear portion of an engaging slot of another similarly constructed heat-dissipating member, with two edges of a notched portion of another similarly constructed heat-dissipating member being engaged with the engaging hooks of the heat dissipating member.
    Type: Grant
    Filed: December 3, 2002
    Date of Patent: November 11, 2003
    Inventor: Wen-Tsai Hsu
  • Publication number: 20030200673
    Abstract: A device for rapidly cooling a semiconductor wafer test/transfer machine. The device includes a body which is provided with an interior gas passage one end of which is connected to a source of clean, dry air or other gas by a tubing. In typical application, the body is rested on the cover of a semiconductor wafer test or transfer machine, typically above or adjacent to the chuck or other wafer holder of the machine, with the other end of the gas passage in contact with the cover. The air or gas flowing through the gas passage impinges against the machine cover and rapidly cools the chuck or other wafer holder.
    Type: Application
    Filed: April 25, 2002
    Publication date: October 30, 2003
    Applicant: Taiwan Semiconductor Manufacturing Co, Ltd.
    Inventors: Pao-Kun Liao, Wen-Tsai Su
  • Publication number: 20030199352
    Abstract: Disclosed is a motor-integrated transmission mechanism for use in parallel hybrid electric vehicles. The transmission can provide five basic modes of operation that can be further classified into sixteen sub-modes: one electric motor mode, four engine modes, four engine/charge modes, three power modes and four regenerative braking modes. Each of these sub-modes can be grouped into like clutching conditions, providing the functional appearance of a conventional 4-speed automatic transmission, with electric launch, engine-only, engine/charge, power-assist, and regeneration capability. CVT capability is provided with one of the engine/charge modes. The transmission can be incorporated in front-wheel drive and in rear-wheel drive vehicles.
    Type: Application
    Filed: February 10, 2003
    Publication date: October 23, 2003
    Inventors: Lung-Wen Tsai, Gregory A. Schultz
  • Publication number: 20030178466
    Abstract: A solder paste stenciling apparatus for minimizing residue of solder paste has a stencil disposed above a substrate in a proper distance. Multiple stencil opens are defined through the stencil and distributed in a predetermined formation. A squeegee for applying solder paste onto the stencil has a hollow body for receiving the solder paste. A piston is used to apply pressure to the solder paste in the body so that the solder paste is urged to flow through an outlet defined in a bottom surface of the body. Two blowers are mounted on opposite sides of the body and a vent is defined in each blower. In operation, the solder paste flows out of the body via the outlet and into the stencil opens to be further deposited onto the substrate. Then, air coming out of the blowers assists the solder paste to be fully evacuated from the stencil opens.
    Type: Application
    Filed: March 20, 2002
    Publication date: September 25, 2003
    Inventors: Cheng-Yuan Lin, Te-Chang Huang, Genie Chiang, Chieh-Wen Tsai, Kuei-Feng Liang
  • Publication number: 20030154198
    Abstract: A method that automatically calculates supplier/vendor scores and payable due dates by material delivery inspection is a system that combines material delivery and quality inspection. It utilizes a pre-determined formula through the Enterprise Resource Planning (ERP) server to calculate supplier/vendor scores and automatically announces the inspection score of supplier/vendor material delivery to further generate payable due dates uploaded to the enterprise end as the basis of the accommodation check period. It can synchronize respective facilities, reduce obstacles to communications, decrease a glut in the inventory of facilities, diminish the risk of purchasing materials from the enterprise end and increase the enterprise profits.
    Type: Application
    Filed: February 12, 2002
    Publication date: August 14, 2003
    Inventors: Hung-Liang Chiu, Yih-Wen Tsai
  • Publication number: 20030141348
    Abstract: A method of manufacturing a joint between metal and a ceramic substrate for a high temperature sensor. First, a predetermined hole is formed in the ceramic substrate to serve as a joint portion. A bonding layer is preferably disposed on the ceramic substrate to form on the inner surface and the surrounding portion of the hole. Next, the hole is filled with a supporting metal. Then, a conductive layer is formed on the supporting metal and the bonding layer. A metal signal conductive frame is then formed on the conductive layer. Next, a welding spot is formed through the metal signal conductive frame, the conductive layer and the supporting metal at the joint portion by a welding process.
    Type: Application
    Filed: August 12, 2002
    Publication date: July 31, 2003
    Inventors: Leu-Wen Tsay, Ren-Kae Shiue
  • Patent number: 6592484
    Abstract: Disclosed is a novel parallel hybrid transmission that transmits torque from two power sources to the drive wheels of a vehicle. The transmission functions with a single heat engine and a single electric motor/generator. Through the use of a compound planetary gear train and four automatically controlled clutches, the transmission is able to (i) sum torque from the two power sources to drive the vehicle; (ii) split torque from the heat engine to drive the vehicle and charge the batteries; (iii) transmit torque individually from either of the two power sources; and (iv) operate as a one- or two-degree-of-freedom mechanism. The configuration of clutches and the compound planetary gear train enable thirteen modes of operation, namely, one motor-only mode, three combined motor and engine modes, one continuous variable transmission/charging mode, four engine-only modes, and four regenerative braking modes.
    Type: Grant
    Filed: August 9, 2000
    Date of Patent: July 15, 2003
    Inventors: Lung-Wen Tsai, Gregory A. Schultz
  • Publication number: 20030105616
    Abstract: A transportation crew dispatch method is disclosed. A plurality of initial samples is generated at first. Each initial sample includes a two dimensional transportation crew dispatch coding table. The initial samples are assigned as parent samples. A sample estimation is performed based on object functions and confinement formulas. By rule of roulette wheel, selection possibilities of chromosomes with superior fitness values are increased. After performing processes of chromosome crossover and mutation responsive to the selection possibilities of single point cutting and double point cutting, a process of sample update is executed by partial gene exchange so as to select preferred samples. The fitness value of each sample is determined from business cost, satisfaction of fairness index, and the disobedient cost of the confinement formulas.
    Type: Application
    Filed: November 7, 2001
    Publication date: June 5, 2003
    Applicant: Institute For Information Industry
    Inventors: Shaw-Ching Chang, Ming-Wen Tsai, Chih-Wei Huang, Yu-Chi Chung
  • Publication number: 20030100739
    Abstract: This invention is concerned with a new method for producing different types of cross-linked hyaluronic acid—protein bio-composites. In the process of manufacture, polysaccharide and protein solution are mixed under moderate pH values and salts, and the well mixed solution can be prepared to various types, such as membrane, sponge, fiber, tube or micro-granular and so on. After then, with the bio-compatibility, biodegradation, prolong enzymatic degradation and good physical of bio-composite is formed in the little acid of organic solution that with the cross-linked reagent.
    Type: Application
    Filed: February 19, 2002
    Publication date: May 29, 2003
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Shiao-Wen Tsai, Jui-Hsiang Chen, Chiung-Lin Yang
  • Publication number: 20030094719
    Abstract: This invention is concerned with a method for producing water-insoluble polysaccharides. A method for making the water-insoluble bio-compatible gel includes activating the hydroxyl-containing polysaccharides with the activating agent to form activated polysaccharides, and cross-linking the activated polysaccharides, under moderate conditions producing different shapes of the water-insoluble bio-compatible gel. The water-insoluble bio-compatible gels, films, porosities, powders, sheets, fibers and spheres of this invention may be applied to various medical and cosmetic uses.
    Type: Application
    Filed: January 9, 2002
    Publication date: May 22, 2003
    Inventors: Jean-Dean Yang, Shiao-Wen Tsai, Jui-Hsiang Chen, Chiung-Lin Yang, Yu-Lin Hsieh
  • Publication number: 20030093339
    Abstract: A method and a system for integrating material quality data are proposed, in which manufactories of a manufacturer at different locations can be connected through a network communication system to the integrating system, wherein the system has a supplier database for storing basic data of the material suppliers and an examination database for storing quality examined data established by the manufactories, and each of the material suppliers has a supplier code corresponding to the basic data thereof. In the use of the foregoing method and system, a common inputting interface used for material quality examination can be provided for IQC departments of the manufactories of the manufacturer, and quality examined data of the manufactories can be integrated, so as to allow the manufactories to immediately monitor qualities of incoming materials from material suppliers, thereby making manufactured products greatly improved in quality for the manufacturer.
    Type: Application
    Filed: November 14, 2001
    Publication date: May 15, 2003
    Inventors: Hung-Liang Chiu, Yih-Wen Tsai
  • Publication number: 20030075781
    Abstract: A chip-packaging substrate. The substrate is capable of reducing damage during packaging, shrinking its connecting portions so that the length of any of the gap slots between the packaging portion and the frame portion of the substrate is increased. Furthermore, a dummy layer is provided to one surface of the frame portion to flush the surface on the frame portion with that of the packaging portion as much as possible.
    Type: Application
    Filed: August 26, 2002
    Publication date: April 24, 2003
    Inventors: Wei-Feng Lin, Chung-Ju Wu, Chen-Wen Tsai
  • Patent number: D483131
    Type: Grant
    Filed: February 20, 2003
    Date of Patent: December 2, 2003
    Inventor: Hung-Wen Tsai