Abstract: Described herein is a system for heating and/or cooling a fluid that includes a temperature forcing device having a bottom plate and a top plate hingedly coupled to the bottom plate. At least one of the bottom plate and the top plate has a recess or other area for receiving at least one flexible fluid holder (e.g., a polymer bag). The bottom plate and/or top plate also has at least one protrusion and/or recession in its interior wall(s) such that a fluid passageway in the flexible fluid holder is defined when the fluid holder is placed between the top and bottom plates, and the plates are closed together. The fluid holder then has a fluid inlet for receiving the fluid to be heated and/or cooled and a fluid outlet for delivering the fluid. The fluid, upon being heated and/or cooled by the temperature forcing device, may then be delivered to a patient or may be delivered to another system component, e.g., for additional heating/cooling.

Abstract: Disclosed herein are clot treatment systems including catheters having multiple lumens, and associated systems and methods. In some embodiments, a clot treatment system includes a catheter having a distal tip configured to be intravascularly positioned proximate to clot material within a blood vessel. The catheter can further include/define an aspiration lumen having a distal aspiration opening and an injection lumen having a distal injection opening. The clot treatment system can further include a pressure source fluidly coupled to the aspiration lumen, and a fluid source fluidly coupled to the injection lumen. The pressure source is configured to generate negative pressure within the aspiration lumen to aspirate at least a portion of the clot material through the distal aspiration opening. The fluid source is configured to inject a fluid through the injection lumen and out of the distal injection opening into the blood vessel.

Abstract: A method includes forming a solder layer on a surface of one or more chips. A lid is positioned over the solder layer on each of the one or more chips. Heat and pressure are applied to melt the solder layer and attach each lid to a corresponding solder layer. The solder layer has a thermal conductivity of ?50 W/mK.

Abstract: An antenna module and a related network communication device are provided in this disclosure. A network communication device includes a circuit board, a network communication chip, an antenna, a signal line, and an antenna bracket. The network communication chip is disposed on the circuit board. The antenna bracket has a first antenna slot, a circuit board slot, a circuit board hook and an opposite supporting part. The first antenna slot is configured to carry the antenna. The circuit board hook and the opposite supporting part are respectively located on opposing first surface and second surface of the circuit board. The circuit board slot is located between the circuit board hook and the opposite supporting part to accommodate the circuit board. The circuit board hook is buckled to a first buckle hole of the circuit board.

Abstract: A package structure includes a wiring structure, a first electronic device and a reinforcement structure. The first electronic device is disposed over the top surface of the wiring structure, and has a bottom surface facing the top surface of the wiring structure. The first electronic device includes a plurality of first wires. The reinforcement structure is disposed over the top surface of the wiring structure, and includes a plurality of second wires directly contacting the plurality of first wires to reduce a variation of an elevation of the bottom surface of the first electronic device with respect to the top surface of the wiring structure.

Abstract: A method for eliminating divot formation includes forming an isolation layer; forming a conduction layer which has an upper inclined boundary with the isolation layer such that the conduction layer has a portion located above a portion of the isolation layer at the upper inclined boundary; etching back the isolation layer; and etching back the conduction layer after etching back the isolation layer such that a top surface of the etched conduction layer is located at a level lower than a top surface of the etched isolation layer.

Abstract: Provided is a method for inserting a pre-designed filler cell, as a replacement to a standard filler cell, including identifying at least one gap among a plurality of functional cells. In some embodiments, a pre-designed filler cell is inserted within the at least one gap. By way of example, the pre-designed filler cell includes a layout design having a pattern associated with a particular failure mode. In various embodiments, a layer is patterned on a semiconductor substrate such that the pattern of the layout design is transferred to the layer on the semiconductor substrate. Thereafter, the patterned layer is inspected using an electron beam (e-beam) inspection process.

Abstract: A method includes forming a solder layer on a surface of one or more chips. A lid is positioned over the solder layer on each of the one or more chips. Heat and pressure are applied to melt the solder layer and attach each lid to a corresponding solder layer. The solder layer has a thermal conductivity of ?50 W/mK.

Abstract: A conference system, including a remote device and a local device, is disclosed. The remote device includes a voice broadcasting element. The local device includes several image capture elements and a processor. When the remote device is communicatively connected through an internet to the local device, several image capture elements obtain a number of people present in a local environment of the local device. The processor, coupled to several image capture elements, generates a voice message according to the number of people present, and the processor transmits the voice message to the remote device, so that the voice broadcasting element of the remote device plays the voice message.

Abstract: A method for eliminating divot formation includes forming an isolation layer; forming a conduction layer which has an upper inclined boundary with the isolation layer such that the conduction layer has a portion located above a portion of the isolation layer at the upper inclined boundary; etching back the isolation layer; and etching back the conduction layer after etching back the isolation layer such that a top surface of the etched conduction layer is located at a level lower than a top surface of the etched isolation layer.

Abstract: An LDMOS transistor device includes a stepped isolation structure over a substrate, a gate electrode disposed over a portion of the stepped isolation structure, a source region disposed in the substrate, and a drain region disposed in the substrate. The stepped isolation structure includes a first portion having a first thickness, and a second portion having a second thickness greater than the first thickness. The second portion includes dopants. The drain region is adjacent to the stepped isolation structure.

Abstract: A semiconductor package includes a semiconductor chip disposed over a first main surface of a first substrate, a package lid disposed over the semiconductor chip, and spacers extending from the package lid through corresponding holes in the first substrate. The spacers enter the holes at a first main surface of the first substrate and extend beyond an opposing second main surface of the first substrate.

Abstract: A micro electro mechanical system (MEMS) includes a circuit substrate, a first MEMS structure disposed over the circuit substrate, and a second MEMS structure disposed over the first MEMS structure.

Abstract: A semiconductor package includes a semiconductor chip disposed over a first main surface of a first substrate, a package lid disposed over the semiconductor chip, and spacers extending from the package lid through corresponding holes in the first substrate. The spacers enter the holes at a first main surface of the first substrate and extend beyond an opposing second main surface of the first substrate.

Abstract: A micro electro mechanical system (MEMS) includes a circuit substrate, a first MEMS structure disposed over the circuit substrate, and a second MEMS structure disposed over the first MEMS structure.

Abstract: A method for processing a static pattern in an image and a circuit system are provided. In the method, each of frames of a video is divided into multiple areas. Several algorithms are used to calculate a static pattern index of every area. The static pattern index is used as a reference for determining if the area covers part or entire of a static pattern. An index threshold can be used to check the areas that are determined as the static pattern initially. A time threshold is then used to confirm the areas with the static pattern in every frame. Image data of the areas which are determined as the static patterns can then be adjusted, such as having brightness of the area that is determined as part or entire of the static patterns decreased, for preventing the display panel from negative effects of the static pattern.

Abstract: An inductive device includes an insulating layer, a lower magnetic layer, and an upper magnetic layer that are formed such that the insulating layer does not separate the lower magnetic layer and the upper magnetic layer at the outer edges or wings of the inductive device. The lower magnetic layer and the upper magnetic layer form a continuous magnetic layer around the insulating layer and the conductors of the inductive device. Magnetic leakage paths are provided by forming openings through the upper magnetic layer. The openings may be formed through the upper magnetic layer by semiconductor processes that have relatively higher precision and accuracy compared to semiconductor processes for forming the insulating layer such as spin coating. This reduces magnetic leakage path variation within the inductive device and from inductive device to inductive device.

Abstract: A semiconductor structure includes a molding compound having a first surface and a second surface opposite to the first surface, a passive device component disposed in the molding compound, a via penetrating the molding compound from the first surface to the second surface, a first connection structure disposed over the first surface of the molding compound and electrically coupled to the passive device component, and a second connection structure disposed over the second surface of the molding compound. The first connection structure and the second connection structure are electrically coupled to each other by the via.

Abstract: The present disclosure provides improved technologies relating to medical fluid heating systems and apparatus. In certain embodiments, the present disclosure relates to systems and apparatus for heating a fluid and, more particularly, for quickly and controllably heating a flow of blood or a blood product, for example, for infusion into a patient or for hyperthermia treatment. In particular, in a first aspect, the present disclosure is directed to a system and apparatus featuring single flow path fluid heating (“single path flow”). Moreover, in a second aspect, the present disclosure is directed to a system, apparatus, and related method for efficiently utilizing the thermal energy of an infusate stored in a reservoir (“slack time heating”). Furthermore, in a third aspect, the present disclosure is directed to a fluid heating system and apparatus featuring a vacuum release valve designed to prevent the undesired orientation of deformed inflow tubing (“vacuum release valve”).

Abstract: Described herein is a system for heating and/or cooling a fluid that includes a temperature forcing device having a bottom plate and a top plate hingedly coupled to the bottom plate. At least one of the bottom plate and the top plate has a recess or other area for receiving at least one flexible fluid holder (e.g., a polymer bag). The bottom plate and/or top plate also has at least one protrusion and/or recession in its interior wall(s) such that a fluid passageway in the flexible fluid holder is defined when the fluid holder is placed between the top and bottom plates, and the plates are closed together. The fluid holder then has a fluid inlet for receiving the fluid to be heated and/or cooled and a fluid outlet for delivering the fluid. The fluid, upon being heated and/or cooled by the temperature forcing device, may then be delivered to a patient or may be delivered to another system component, e.g., for additional heating/cooling.