Abstract: A method for detecting defects in a semiconductor device including singulating a die having a substrate including a circuit region and an outer border, a plurality of detecting devices disposed over the substrate and located between the circuit region and the outer border, a first probe pad and a second probe pad electrically connected to two ends of each detecting device, and a seal ring located between the outer border of the die and the detecting devices. The method further includes probing the first probe pad and the second probe pad to determine a connection status of the detecting device, and recognizing a defect when the connection status of the detecting device indicates an open circuit.

Abstract: A semiconductor structure includes a molding compound having a first surface and a second surface opposite to the first surface, a passive device component disposed in the molding compound, a via penetrating the molding compound from the first surface to the second surface, a first connection structure disposed over the first surface of the molding compound and electrically coupled to the passive device component, and a second connection structure disposed over the second surface of the molding compound. The first connection structure and the second connection structure are electrically coupled to each other by the via.

Abstract: An inductive device includes an insulating layer, a lower magnetic layer, and an upper magnetic layer that are formed such that the insulating layer does not separate the lower magnetic layer and the upper magnetic layer at the outer edges or wings of the inductive device. The lower magnetic layer and the upper magnetic layer form a continuous magnetic layer around the insulating layer and the conductors of the inductive device. Magnetic leakage paths are provided by forming openings through the upper magnetic layer. The openings may be formed through the upper magnetic layer by semiconductor processes that have relatively higher precision and accuracy compared to semiconductor processes for forming the insulating layer such as spin coating. This reduces magnetic leakage path variation within the inductive device and from inductive device to inductive device.

Abstract: Provided is a method for inserting a pre-designed filler cell, as a replacement to a standard filler cell, including identifying at least one gap among a plurality of functional cells. In some embodiments, a pre-designed filler cell is inserted within the at least one gap. By way of example, the pre-designed filler cell includes a layout design having a pattern associated with a particular failure mode. In various embodiments, a layer is patterned on a semiconductor substrate such that the pattern of the layout design is transferred to the layer on the semiconductor substrate. Thereafter, the patterned layer is inspected using an electron beam (e-beam) inspection process.

Abstract: Disclosed herein are dilators for vascular access systems, and associated devices and methods. In some embodiments, a dilator includes an elongate body having a diameter that is generally constant or uniform along the length of the body. The diameter can be sized to correspond with a catheter of a vascular access system, such that the dilator can be positioned within the catheter with little or no gaps or spacing between the dilator and an interior of the catheter. Additionally, or alternatively, the body of the dilator can include multiple body regions, each having one or more respective mechanical properties. In these and other embodiments, the dilator can be configured to interface with at least a portion of the vascular access system. For example, the dilator can include one or more notches configured to couple the dilator to the vascular access system via a valve of the vascular access system.

Abstract: A semiconductor package structure and method of manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a connection layer formed on a metal base layer, at least one die unit formed on the connection layer, a metal pillar connecting the metal base layer and surrounding the die unit, and an interconnect structure overlaid onto the die unit and the metal pillar. Each die unit comprises at least one die attached onto the connection layer and surrounded by a molding structure. The interconnect structure includes a first interconnect layer overlaid onto the die unit and the metal pillar and a second interconnect layer formed on the first interconnect layer. The first and second interconnect layers comprise first and second metal layers being parallel with the top surface of the die unit. A projection of the metal layers overlaps an upper surface of the die.

Abstract: A semiconductor isolation structure includes a silicon-on-insulator wafer, a first deep trench isolation structure and a second deep trench isolation structure. The silicon-on-insulator wafer includes a semiconductor substrate, a buried insulation layer disposed on the semiconductor substrate, and a semiconductor layer disposed on the buried insulation layer. The semiconductor layer has a functional region. The first deep trench isolation structure penetrates the semiconductor layer and the buried insulation layer, and surrounds the functional region. The second deep trench isolation structure penetrates semiconductor layer and the buried insulation layer, and surrounds the first deep trench isolation structure.

Abstract: A motor for an electric cylinder includes a motor body, an encoder, a rotor coupling portion and an encoder fixing portion. The motor body includes a rotor having a shaft hole through which a rotating shaft extends. The encoder is installed on the motor body and includes a fixing ring fixed on the rotating shaft, a magnet holder combined with the fixing ring, an encoder magnet mounted on the magnet holder, and a magnetic sensor opposite to the encoder magnet. The magnet holder is rotatable relative to the fixing ring to adjust the magnetic pole position of the encoder magnet relative to the magnetic sensor. The rotor coupling portion is arranged on the rotor and fixed to the rotating shaft at a first corresponding position. The encoder fixing portion is arranged on the fixing ring and fixed with the rotating shaft at a second corresponding position.

Abstract: A network communication device having an antenna frame includes a circuit board, a network communication chip, an antenna, a signal cable and an antenna frame. The network communication chip is disposed on the circuit board. The signal cable is electrically connected to the antenna and the circuit board. The antenna frame is assembled on the circuit board. The antenna frame has a slot. The antenna is engaged in the slot. The antenna is directly fixed on the circuit board through the antenna frame, and the assembling of the antenna is easy to complete.

Abstract: A semiconductor package includes a multilayer substrate, a device die, an insulating encapsulant, and a shielding structure. The multilayer substrate has a first surface and a second surface opposite to the first surface. The multilayer substrate includes through holes, and each of the through holes extends from the first surface to the second surface. The device die is disposed on the first surface of the multilayer substrate. The insulating encapsulant is disposed on the first surface of the multilayered substrate and encapsulating the device die. The shielding structure is disposed over the first surface of the multilayer substrate. The shielding structure includes a cover body and conductive pillars. The cover body covers the device die and the insulating encapsulant. The conductive pillars are connected to the cover body and fitted into the through holes of the multilayer substrate.

Abstract: Provided is a method for inserting a pre-designed filler cell, as a replacement to a standard filler cell, including identifying at least one gap among a plurality of functional cells. In some embodiments, a pre-designed filler cell is inserted within the at least one gap. By way of example, the pre-designed filler cell includes a layout design having a pattern associated with a particular failure mode. In various embodiments, a layer is patterned on a semiconductor substrate such that the pattern of the layout design is transferred to the layer on the semiconductor substrate. Thereafter, the patterned layer is inspected using an electron beam (e-beam) inspection process.

Abstract: Described herein is a system for heating and/or cooling a fluid that includes a temperature forcing device having a bottom plate and a top plate hingedly coupled to the bottom plate. At least one of the bottom plate and the top plate has a recess or other area for receiving at least one flexible fluid holder (e.g., a polymer bag). The bottom plate and/or top plate also has at least one protrusion and/or recession in its interior wall(s) such that a fluid passageway in the flexible fluid holder is defined when the fluid holder is placed between the top and bottom plates, and the plates are closed together. The fluid holder then has a fluid inlet for receiving the fluid to be heated and/or cooled and a fluid outlet for delivering the fluid. The fluid, upon being heated and/or cooled by the temperature forcing device, may then be delivered to a patient or may be delivered to another system component, e.g., for additional heating/cooling.

Abstract: A trench-gate transistor device includes a substrate and a transistor structure. The transistor structure includes a plurality of superjunctions arranged in a first direction, a rectifying area that has at least one Schottky-based diode, and at least one active unit that is located at a side of said rectifying area in a second direction that intersects with the first direction.

Abstract: A method for eliminating divot formation includes forming an isolation layer; forming a conduction layer which has an upper inclined boundary with the isolation layer such that the conduction layer has a portion located above a portion of the isolation layer at the upper inclined boundary; etching back the isolation layer; and etching back the conduction layer after etching back the isolation layer such that a top surface of the etched conduction layer is located at a level lower than a top surface of the etched isolation layer.

Abstract: A semiconductor device and a method for detecting a defect in a semiconductor device are provided. The semiconductor device includes a packaging structure. The packaging structure includes a redistribution layer and a detecting component disposed in the redistribution layer. The semiconductor device further includes a cooling plate over the packaging structure and a fixing component penetrating through the packaging structure and the cooling plate. The packaging structure and the cooling plate are fixed by the fixing component. The detecting component is in a chain configuration having a ring shaped structure circling around the fixing component.

Abstract: Disclosed herein are aspiration catheters having grooved inner surfaces for removing clot material from the vasculature of a patient, and associated systems and methods. In some embodiments, an aspiration catheter can include a proximal terminus, a distal terminus, and an inner surface defining a lumen. The inner surface includes at least one groove formed therein and that extends from the distal terminus at least partially toward the proximal terminus. When clot material is aspirated through the aspiration catheter, the at least one groove can provide a leak path past the clot material to improve the ingestion of the clot material through the catheter and inhibit clogging.

Abstract: A method for measuring temperature is used to obtain a room temperature of a room. The method for measuring temperature includes: obtaining a first temperature inside an operating area in a portable electronic device in the room; obtaining a second temperature outside the operating area in the portable electronic device by a first temperature sensor; calculating a temperature difference between the first temperature and the second temperature; obtaining a compensation temperature according to the temperature difference and a compensation temperature table; and calculating the room temperature according to the second temperature and the compensation temperature.

Abstract: A method for eliminating divot formation includes forming an isolation layer; forming a conduction layer which has an upper inclined boundary with the isolation layer such that the conduction layer has a portion located above a portion of the isolation layer at the upper inclined boundary; etching back the isolation layer; and etching back the conduction layer after etching back the isolation layer such that a top surface of the etched conduction layer is located at a level lower than a top surface of the etched isolation layer.

Abstract: A semiconductor device includes a magnetic random access memory (MRAM). The MRAM comprises a plurality of MRAM cells including a first type MRAM cell and a second type MRAM cell. Each of the plurality of MRAM cells includes a magnetic tunneling junction (MTJ) layer including a pinned magnetic layer, a tunneling barrier layer and a free magnetic layer. A size of the MTJ film stack of the first type MRAM cell is different from a size of the MTJ film stack of the second type MRAM cell. In one or more of the foregoing and following embodiments, a width of the MTJ film stack of the first type MRAM cell is different from a width of the MTJ film stack of the second type MRAM cell.

Abstract: A conference system, including a remote device and a local device, is disclosed. The remote device includes a voice broadcasting element. The local device includes several image capture elements and a processor. When the remote device is communicatively connected through an internet to the local device, several image capture elements obtain a number of people present in a local environment of the local device. The processor, coupled to several image capture elements, generates a voice message according to the number of people present, and the processor transmits the voice message to the remote device, so that the voice broadcasting element of the remote device plays the voice message.