Patents by Inventor Wen Tseng

Wen Tseng has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11088037
    Abstract: A semiconductor device includes a substrate including a circuit region and an outer border, a plurality of detecting devices disposed over the substrate and located between the circuit region and the outer border, first and second probe pads electrically connected to two ends of each detecting device, and a seal ring located between the outer border of the substrate and the detecting devices. A method for detecting defects in a semiconductor device includes singulating a die having a substrate, a plurality of detecting devices, a first probe pad and a second probe pad electrically connected to two ends of each detecting device, and a seal ring; probing the first and the second probe pads to determine a connection status of the detecting devices; and recognizing a defect when the connection status of the detecting devices indicates an open circuit.
    Type: Grant
    Filed: January 22, 2019
    Date of Patent: August 10, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Yang-Che Chen, Wei-Yu Chou, Hong-Seng Shue, Chen-Hua Lin, Huang-Wen Tseng, Victor Chiang Liang, Chwen-Ming Liu
  • Publication number: 20210238770
    Abstract: A hollow polymeric fiber includes: a tetragonal shape sectional area having four corner points and four edges. The four corner points form a square. All four edges are concave or straight. The fiber has a cross sectional area hollowness ranging from 12 to 25%. The fiber has a titer in a range of from 4 to 16 dtex.
    Type: Application
    Filed: January 29, 2021
    Publication date: August 5, 2021
    Inventors: Shih Wen Tseng, Michael Hess, Hsien Fang Chiou, Wie Ren Huang, Huan Hsiang Lin, Volker Roehring
  • Publication number: 20210215552
    Abstract: A method for measuring temperature is used to obtain a room temperature of a room. The method for measuring temperature includes: obtaining a first temperature inside an operating area in a portable electronic device in the room; obtaining a second temperature outside the operating area in the portable electronic device by a first temperature sensor; calculating a temperature difference between the first temperature and the second temperature; obtaining a compensation temperature according to the temperature difference and a compensation temperature table; and calculating the room temperature according to the second temperature and the compensation temperature.
    Type: Application
    Filed: December 29, 2020
    Publication date: July 15, 2021
    Inventors: Chiung-Wen TSENG, Yi-Xuan HUANG, Yu-An HSU
  • Publication number: 20210202329
    Abstract: A semiconductor package includes a semiconductor chip disposed over a first main surface of a first substrate, a package lid disposed over the semiconductor chip, and spacers extending from the package lid through corresponding holes in the first substrate. The spacers enter the holes at a first main surface of the first substrate and extend beyond an opposing second main surface of the first substrate.
    Type: Application
    Filed: October 29, 2020
    Publication date: July 1, 2021
    Inventors: Yang-Che CHEN, Chen-Hua LIN, Huang-Wen TSENG, Victor Chiang LIANG, Chwen-Ming LIU
  • Patent number: 11036254
    Abstract: A foldable electronic input device having a folded mode and an unfolded mode is provided. The foldable electronic input device includes a first body having a first surface and a second surface opposite to the first surface and a second body having a third surface. A first input area and a second input area are disposed on the first surface and the second surface, respectively. The third input area is disposed on the third surface. When in the folded mode, the second body is located directly below the first body and the third surface faces the second surface. When in the unfolded mode, the first body is located beside the second body, the second surface forms a plane with the third surface, and the second input area and the third input area constitute a fourth input area. A portable electronic device including the foldable electronic input device is also provided.
    Type: Grant
    Filed: March 27, 2019
    Date of Patent: June 15, 2021
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Jyh-Chyang Tzou, Hsiao-Wen Tseng, Yi-Hsun Liu, Yao-Hsien Yang, Han-Tsai Liu
  • Patent number: 11038098
    Abstract: A semiconductor device includes a magnetic random access memory (MRAM). The MRAM comprises a plurality of MRAM cells including a first type MRAM cell and a second type MRAM cell. Each of the plurality of MRAM cells includes a magnetic tunneling junction (MTJ) layer including a pinned magnetic layer, a tunneling barrier layer and a free magnetic layer. A size of the MTJ film stack of the first type MRAM cell is different from a size of the MTJ film stack of the second type MRAM cell. In one or more of the foregoing and following embodiments, a width of the MTJ film stack of the first type MRAM cell is different from a width of the MTJ film stack of the second type MRAM cell.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: June 15, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Huang-Wen Tseng, Cheng-Chou Wu, Che-Jui Chang
  • Patent number: 11032538
    Abstract: A method of inspecting and controlling applied to a process of a testing a camera for correct color temperature in image-capturing includes: obtaining a first device identifier of light sources; obtaining a second device identifier of control devices; wherein each control device governs the opening or closing of a light source; associating the first device identifiers with each second device identifier, and generating a binding list; obtaining the second device identifier corresponding to a camera device; comparing the second device identifier corresponding to the camera device with the binding list, and recording the corresponding first device identifiers; wherein the camera device takes pictures under the light source corresponding to the first device identifiers to obtain image for analysis and analyzing whether image-capturing function of the camera is normal. A computer device and a storage medium for performing the above-described method are also disclosed.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: June 8, 2021
    Assignee: TRIPLE WIN TECHNOLOGY (SHENZHEN) CO.LTD.
    Inventors: Rui Feng, Wen-Tseng Chiang, Yu-Tsang Tu, Yen-Sheng Lin, Ying-Quan Zhao
  • Patent number: 11031412
    Abstract: A non-volatile memory (NVM) cell includes a semiconductor wire including a select gate portion and a control gate portion. The NVM cell includes a select transistor formed with the select gate portion and a control transistor formed with the control gate portion. The select transistor includes a gate dielectric layer disposed around the select gate portion and a select gate electrode disposed on the gate dielectric layer. The control transistor includes a stacked dielectric layer disposed around the control gate portion, a gate dielectric layer disposed on the stacked dielectric layer and a control gate electrode disposed on the gate dielectric layer. The stacked dielectric layer includes a first silicon oxide layer disposed on the control gate portion, a charge trapping layer disposed on the first silicon oxide, and a second silicon oxide layer disposed on the charge trapping layer.
    Type: Grant
    Filed: April 27, 2020
    Date of Patent: June 8, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Yun-Chi Wu, Yu-Wen Tseng
  • Patent number: 11000407
    Abstract: An IV pole mountable, therapeutic infusate processing device is incorporated into a hypothermia system to receive therapeutic fluid(s), such as normal saline, peritioneal dialysis solution, or other crystalloid solution, to heat such therapeutic fluid(s) a few degrees centigrade above normal body temperature and to direct the resulting heated infusate to and through a selected anatomical portion of a patients body to raise the temperature of that body portion so as to affect any cancerous or other tumors that may be located therein. The processing device is provided with touch screen controls and visual indicators to facilitate its proper use; while the system further includes temperature and pressure sensors to monitor the hyperthermia processing to insure patient safety.
    Type: Grant
    Filed: January 9, 2014
    Date of Patent: May 11, 2021
    Assignee: Belmont Instrument, LLC
    Inventors: John Joseph Landy, III, Michael Gildersleeve, Yeu Wen Tseng
  • Publication number: 20210130167
    Abstract: A micro electro mechanical system (MEMS) includes a circuit substrate, a first MEMS structure disposed over the circuit substrate, and a second MEMS structure disposed over the first MEMS structure.
    Type: Application
    Filed: July 24, 2020
    Publication date: May 6, 2021
    Inventors: Yang-Che CHEN, Victor Chiang LIANG, Chen-Hua LIN, Chwen-Ming LIU, Huang-Wen TSENG, Yi-Chuan TENG
  • Patent number: 10978269
    Abstract: A sample chip for electron microscope includes a first substrate having a film layer, a buffer layer, and a body layer, a spacing layer positioned below the first substrate, and a second substrate positioned below the spacing layer. The buffer layer is positioned on the film layer and has a buffer opening corresponding to an area of the film layer, the body layer is positioned on the buffer layer and has a body opening corresponding to the buffer opening of the buffer layer to expose the area of the film layer corresponding to the buffer opening, the body layer has a thickness of 10 ?m-800 ?m, and etching properties of the film layer, the buffer layer, and the body layer are different. A specimen accommodating space is defined in the spacing layer to correspond to the area of the film layer corresponding to the buffer opening.
    Type: Grant
    Filed: November 27, 2018
    Date of Patent: April 13, 2021
    Assignee: NATIONAL CHENG KUNG UNIVERSITY
    Inventors: Po Tsung Hsieh, Chung Jen Chung, Shih Wen Tseng, Chiu Hua Huang, Tzu Hsin Chen, Ya Wen Tsai
  • Publication number: 20210099694
    Abstract: A method of inspecting and controlling applied to a process of a testing a camera for correct color temperature in image-capturing includes: obtaining a first device identifier of light sources; obtaining a second device identifier of control devices; wherein each control device governs the opening or closing of a light source; associating the first device identifiers with each second device identifier, and generating a binding list; obtaining the second device identifier corresponding to a camera device; comparing the second device identifier corresponding to the camera device with the binding list, and recording the corresponding first device identifiers; wherein the camera device takes pictures under the light source corresponding to the first device identifiers to obtain image for analysis and analyzing whether image-capturing function of the camera is normal. A computer device and a storage medium for performing the above-described method are also disclosed.
    Type: Application
    Filed: November 27, 2019
    Publication date: April 1, 2021
    Inventors: RUI FENG, WEN-TSENG CHIANG, YU-TSANG TU, YEN-SHENG LIN, YING-QUAN ZHAO
  • Patent number: 10937772
    Abstract: A semiconductor package structure includes an interconnection structure having a first surface and a second surface opposite to the first surface, a die surrounded by a molding compound over the first surface of the interconnection structure, and a passive device surrounded by a dielectric structure over the second surface of the interconnection structure. The passive device is electrically coupled to the die by the interconnection structure.
    Type: Grant
    Filed: May 29, 2019
    Date of Patent: March 2, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Yang-Che Chen, Chen-Hua Lin, Huang-Wen Tseng, Victor Chiang Liang, Chwen-Ming Liu
  • Patent number: 10936015
    Abstract: An electronic device with multiple screens includes a first body, a second body, a keyboard, and at least one expansion module. The first body has a sliding rail assembly, a first end and a second end. The second body is rotatably connected to the first end of the first body. The sliding base is slidably connected to the sliding rail assembly of the first body. The lifting base is pivotally connected to one side of the keyboard facing the first end and is slidably connected to the sliding rail assembly. The at least one expansion module is detachably connected to the lifting base and is disposed between the second body and the keyboard. When the keyboard slides toward the second body, the sliding base is driven to move along the sliding rail assembly and away from the second end of the first body.
    Type: Grant
    Filed: April 21, 2020
    Date of Patent: March 2, 2021
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Yi-Hsun Liu, Hsiao-Wen Tseng, Yao-Hsien Yang, Jyh-Chyang Tzou
  • Patent number: 10937858
    Abstract: A method of manufacturing a semiconductor structure is provided. The method includes: providing a substrate including an electrical component; forming a capacitor structure in the substrate, proximal to a heterogeneous interface of the substrate, and physically and electrically isolated from the electrical component; forming a conductive terminal over and electrically connected with the capacitor structure; and contacting the conductive terminal with a probe to measure an electrical parameter of the capacitor structure, wherein the electrical parameter corresponds to a humidity permeability at the heterogeneous interface. A semiconductor structure thereof is also provided.
    Type: Grant
    Filed: April 20, 2020
    Date of Patent: March 2, 2021
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Yang-Che Chen, Chen-Hua Lin, Huang-Wen Tseng, Victor Chiang Liang, Chwen-Ming Liu
  • Publication number: 20210045913
    Abstract: Described herein is a system for heating and/or cooling a fluid that includes a temperature forcing device having a bottom plate and a top plate hingedly coupled to the bottom plate. At least one of the bottom plate and the top plate has a recess or other area for receiving at least one flexible fluid holder (e.g., a polymer bag). The bottom plate and/or top plate also has at least one protrusion and/or recession in its interior wall(s) such that a fluid passageway in the flexible fluid holder is defined when the fluid holder is placed between the top and bottom plates, and the plates are closed together. The fluid holder then has a fluid inlet for receiving the fluid to be heated and/or cooled and a fluid outlet for delivering the fluid. The fluid, upon being heated and/or cooled by the temperature forcing device, may then be delivered to a patient or may be delivered to another system component, e.g., for additional heating/cooling.
    Type: Application
    Filed: July 24, 2020
    Publication date: February 18, 2021
    Inventors: John Joseph Landy, III, Alexander Rick, Tristan Dion, Skylar Nesheim, David Dumais, Yeu Wen Tseng, Chuong Vu, Robert Charles Shea
  • Patent number: 10921942
    Abstract: A touch system has a touch device and an input device. The touch system executes a first mode and a second mode at different times. In the first mode, the touch device transmits a modulation signal to drive the touch electrodes and to be used as an uplink signal. The input device receives the modulation signal. In the second mode, the touch device receives the downlink signal from the input device. Thus, the touch device does not have to transmit the driving signal and the uplink signal at different times. Then the time is saved for the rest work periods so that every work periods get longer length of time.
    Type: Grant
    Filed: October 17, 2019
    Date of Patent: February 16, 2021
    Assignee: ELAN MICROELECTRONICS CORPORATION
    Inventors: Han-Wei Chen, Hsuan-Wen Tseng, Yi-Hsin Tao, Chia-Hsing Lin, Chen-Yu Hou, Chieh-Wen Chen
  • Patent number: D914672
    Type: Grant
    Filed: June 4, 2018
    Date of Patent: March 30, 2021
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Jyh-Chyang Tzou, Han-Tsai Liu, Hsiao-Wen Tseng, Yao-Hsien Yang, Yi-Hsun Liu
  • Patent number: D922370
    Type: Grant
    Filed: June 4, 2018
    Date of Patent: June 15, 2021
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Jyh-Chyang Tzou, Hsiao-Wen Tseng, Yao-Hsien Yang, Yi-Hsun Liu
  • Patent number: D926752
    Type: Grant
    Filed: June 4, 2018
    Date of Patent: August 3, 2021
    Assignee: COMPAL ELECTRONICS, INC.
    Inventors: Jyh-Chyang Tzou, Han-Tsai Liu, Hsiao-Wen Tseng, Yao-Hsien Yang, Yi-Hsun Liu