Patents by Inventor Wen Wang

Wen Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 12266124
    Abstract: A structured-light three-dimensional (3D) scanning system includes a projector that emits a projected light with a predetermined pattern onto an object; an image capture device that generates a captured image according to a reflected light reflected from the object, the predetermined pattern of the projected light being distorted due to 3D shape of the object, thereby resulting in a distorted pattern; a depth decoder that converts the distorted pattern into a depth map representing the 3D shape of the object; and a depth fusion device that generates a fused depth map according to at least two different depth maps associated with the object.
    Type: Grant
    Filed: October 7, 2022
    Date of Patent: April 1, 2025
    Assignee: Himax Technologies Limited
    Inventors: Hsueh-Tsung Lu, Ching-Wen Wang, Cheng-Che Tsai, Wu-Feng Chen
  • Patent number: 12266722
    Abstract: The present disclosure relates to a semiconductor device and its manufacturing method, and the semiconductor device includes a substrate, a channel layer, a gate electrode, a first electrode, a second electrode, and a metal plate. The channel layer is disposed on the substrate, and the gate electrode is disposed on the channel layer. The first electrode and the second electrode are disposed on the channel layer, at two opposite sides of the gate electrode respectively. The metal plate is disposed over the channel layer, between the first electrode and the gate electrode. The metal plate includes a first extending portion and a second extending portion, wherein the second extending portion extends towards the substrate without contacting the channel layer, and the first extending portion extends toward and directly contacts the first electrode or the second electrode.
    Type: Grant
    Filed: March 21, 2021
    Date of Patent: April 1, 2025
    Assignee: UNITED MICROELECTRONICS CORP.
    Inventors: Po-Yu Yang, Hsun-Wen Wang
  • Patent number: 12265208
    Abstract: An optical device includes a range finding module. The range finding module includes a first light condenser unit, a light emitting unit and a light receiving unit. The first light condenser unit defines an optical axis and a hole disposed along the optical axis. The first light condenser unit, the light emitting unit and the light receiving unit are sequentially arranged along the optical axis. The light is emitted by the light emitting unit, passes through the hole, reaches an object, is reflected by the object, is converged by the first light condenser unit and is received by the light receiving unit to generate an electrical signal.
    Type: Grant
    Filed: May 9, 2022
    Date of Patent: April 1, 2025
    Assignees: SINTAI OPTICAL (SHENZHEN) CO., LTD., ASIA OPTICAL CO., INC.
    Inventors: Kung-Hsin Teng, Yan-Rong Fan, Hsien-Chi Lin, Zhi-You Dai, Chun-Chou Lin, Chih-Wen Wang, Jia-Zhong Hsu
  • Patent number: 12261046
    Abstract: Various methods for manufacturing semiconductor structures are provided. An embodiment method includes forming a first patterned hard mask and epitaxial layer on a semiconductor substrate, and forming a first doped region in the epitaxial layer by performing a first implantation through the first patterned hard mask. A second doped region is formed in the epitaxial layer by performing a second implantation through the first patterned hard mask, with the first doped region at least partially overlapping the second doped region. A second patterned hard mask is formed, which surrounds the first patterned hard mask and covers at least a portion of the first doped region. A third doped region is formed in the epitaxial layer by performing a third implantation through the first patterned hard mask and the second patterned hard mask.
    Type: Grant
    Filed: April 4, 2024
    Date of Patent: March 25, 2025
    Assignee: Diodes Incorporated
    Inventors: Jie Li, Ming-Wei Tsai, Chiao-Shun Chuang, Ching-Wen Wang
  • Patent number: 12260258
    Abstract: A system may include a memory and a processor in communication with the memory. The processor may be configured to perform operations. The operations may include calculating a priority factor with a node autonomous center in a node and computing a node service capability with the node autonomous center. The operations may further include selecting, with the node autonomous center, a task based on the priority factor and the node service capability. The operations may further include directing the task to the node.
    Type: Grant
    Filed: September 3, 2021
    Date of Patent: March 25, 2025
    Assignee: International Business Machines Corporation
    Inventors: Hao Sheng, Wen Wang, Rong Fu, Jian Dong Yin, Chuan Qing Yu, Kang Zhang
  • Patent number: 12262550
    Abstract: A method of manufacturing a semiconductor structure is provided. A substrate including a first silicon carbide layer and a second silicon carbide layer under the first silicon carbide layer is formed. The substrate includes a unit region and a termination region surrounding the unit region. A first guard ring structure is formed in the termination region and the first silicon carbide layer, adjoining a top surface of the first silicon carbide layer. A second guard ring structure is formed in the termination region and the second silicon carbide layer. Second guard ring well regions of the second guard ring structure correspond one-on-one to first guard ring well regions of the first guard ring structure. Each of the second guard ring well regions overlaps with a corresponding one of the first guard ring well regions in a vertical direction perpendicular to the top surface of the substrate.
    Type: Grant
    Filed: December 12, 2024
    Date of Patent: March 25, 2025
    Assignee: Diodes Incorporated
    Inventors: Ching-Wen Wang, Jie Li, Ming-Wei Tsai, Chiao-Shun Chuang
  • Publication number: 20250096043
    Abstract: A semiconductor device includes a channel structure, a first gate structure straddling the channel structure, and an epitaxial structure. The epitaxial structure is adjacent to the first gate structure and is coupled to an end of the channel structure. The semiconductor device further includes a first contact structure disposed over and in contact with the epitaxial structure and a nitride-based conformal layer extending at least over the first contact structure. The semiconductor device further includes an oxide-based layer disposed over the nitride-based conformal layer. A portion of the nitride-based conformal layer, disposed over the first contact structure, has a dip that is filled with a first portion of the oxide-based layer.
    Type: Application
    Filed: December 4, 2024
    Publication date: March 20, 2025
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Te-Chih Hsiung, Yi-Chen Wang, Guang-Hong Cheng, Wen Wang, Yuan-Tien Tu, Huan-Just Lin
  • Publication number: 20250098555
    Abstract: A spatial light modulator device includes an array of spatial light modulator cells located over a substrate. Each of the spatial light modulator cells includes: a layer stack including a phase change material plate, a spacer dielectric material plate that underlies the phase change material plate, and a metallic heater plate underlying the spacer dielectric material plate and including outer sidewalls; and a pair of bottom electrode via structures contacting a respective surface segment of a bottom surface of the metallic heater plate. Each of the outer sidewalls of the metallic heater plate is vertically coincident with a respective sidewall of the spacer dielectric material plate and with a respective sidewall of the phase change material plate.
    Type: Application
    Filed: March 18, 2024
    Publication date: March 20, 2025
    Inventors: Chang-Chih Huang, Yu-Wen Wang, Wei-Fang Chen, Han-Yu Chen, Kuo-Chyuan Tzeng
  • Publication number: 20250088387
    Abstract: Novel tools and techniques are provided for implementing DyCon IPVPN functionalities. In various embodiments, a DyCon IPVPN system includes a gateway device, a plurality of orchestrators, and a plurality of task managers. The gateway device is configured to request an orchestrator from an orchestrator factory based on data contained in a request to perform a network provisioning service; and to instruct the orchestrator to perform the network provisioning service. The orchestrator is configured to request a task manager from a task factory based on a task type associated with a first task among one or more DyCon IPVPN tasks associated with the network provisioning service; and to instruct the task manager to perform the first task. The task manager is configured to perform at least one of creating the first task, triggering execution of the first task, or updating the first task, and/or the like.
    Type: Application
    Filed: September 4, 2024
    Publication date: March 13, 2025
    Applicant: CenturyLink Intellectual Property LLC
    Inventors: Wen Wang, Boris Abramovich, Syed Hussain Haider
  • Publication number: 20250089321
    Abstract: A silicon substrate structure has a substrate, a first groove, a second groove and a third groove. The substrate includes a first surface and a second surface. The first surface is formed on one side of the Si(111) lattice plane, and the second surface is formed on the opposite side of the Si(111) lattice plane. The first groove is disposed along a first direction on the second surface. The second groove is disposed along a second direction on the second surface. The third groove is disposed along a third direction on the second surface. The first direction is defined as the direction from the Si(111) lattice plane to the Si(1-1-1) lattice plane, the second direction is defined as the direction from the Si(-11-1) lattice plane to the Si(1-11) lattice plane, and the third direction is defined as the axial direction of the Si[1-10] lattice orientation.
    Type: Application
    Filed: February 28, 2024
    Publication date: March 13, 2025
    Inventors: Po-Jen HSIEH, Tzu-Wen WANG
  • Publication number: 20250088388
    Abstract: A system and method for providing on-demand edge compute. The system may include an orchestrator that provides a UI and controls an abstraction layer for implementing a workflow for providing on-demand edge compute. The abstraction layer may include a network configuration orchestration (NCO) system (e.g., a Network-as-a-Service (NaaS) system) and an API that may provide an interface between the orchestrator and the NCO. The API may enable the orchestrator to communicate with the NCO for receiving requests that enable the NCO to integrate with existing network controllers, orchestrators, and other systems and perform various network provisioning tasks (e.g., to build and provision a communication path between server instances). The various tasks, when executed, may provide end-to-end automated network provisioning services as part of providing on-demand edge compute service to users. The API may further enable the ECS orchestrator to receive information from the NCO, (e.g.
    Type: Application
    Filed: November 22, 2024
    Publication date: March 13, 2025
    Applicant: Level 3 Communications, LLC
    Inventors: Austin Ritchie, Scott Hemmann, Wen Wang, Brett Dwyer
  • Patent number: 12249108
    Abstract: A 3D image sensing device includes a first camera lens, a second camera lens and a light source. A 3D image processing method for the 3D image sensing device includes the following steps. Firstly, a target is photographed by the first camera lens and the second camera lens, and the obtained images are processed in a stereo vision mode. Consequently, a first depth map is obtained. After the light source emits plural feature points to the target, the target is photographed by the first camera lens and the second camera lens, and the obtained images are processed in an active stereo vision mode. Consequently, a second depth map is obtained. The first depth map and the second depth map are synthesized as a synthesized depth map according to a synthetization strategy.
    Type: Grant
    Filed: January 17, 2023
    Date of Patent: March 11, 2025
    Assignee: PRIMAX ELECTRONICS LTD.
    Inventors: Hsiu-Wen Wang, Chih-Wen Lin
  • Publication number: 20250079446
    Abstract: The present disclosure discloses a multilayer annular pore nickel-cobalt-aluminum precursor and a preparation method and a positive electrode material thereof. The precursor D50 is 8 to 20 ?m. It may be seen from a section diagram that there is a plurality of layers of annular pores in a secondary spherical particle structure, and a average porosity value of the section with a single particle or a plurality of particles is 6% to 14%. A co-precipitation reaction of nickel-cobalt mixed salt solution, alkali-aluminum solution, a complexing agent, and a precipitating agent is performed, a pH value and a concentration of aluminum solution at each stage are strictly controlled, and then working procedures of solid-liquid separating, washing, drying, mixing, sieving, and demagnetizing are performed to obtain the multilayer annular pore nickel-cobalt-aluminum precursor.
    Type: Application
    Filed: October 24, 2023
    Publication date: March 6, 2025
    Inventors: Xiaojin ZHAO, Di CHENG, Yunjun XU, Gaofeng ZUO, Zhimin HAO, Wen WANG, Wanchao WEN, Zhengzhong YIN
  • Publication number: 20250073334
    Abstract: The disclosure provides for a vaccine depot formulation that comprises a biodegradable thermosensitive hydrogel that has been loaded or embedded with nanoparticles that comprise an antigen and adjuvant, and uses thereof for protecting a subject from an infection or disease.
    Type: Application
    Filed: September 5, 2024
    Publication date: March 6, 2025
    Inventors: Szu-Wen Wang, Lu Wang, David Huw Davies, Aaron Ramirez
  • Publication number: 20250071889
    Abstract: A flexible circuit board includes a flexible substrate, a chip, a first test area, first test pads and a circuit layer connected to the chip and the first test pads. A working area and a non-working area are defined on an upper surface of the flexible substrate. The chip is disposed on the working area, the first test area is located within the non-working area and between a third edge and the working area, the first test pads are arranged on the first test area. Flexible circuit boards with different sizes can have the first test area with the same size and can be tested using a probe card with the same specification to lower testing cost.
    Type: Application
    Filed: July 31, 2024
    Publication date: February 27, 2025
    Inventors: Kung-Tzu Tu, Gwo-Shyan Sheu, Hsin-Hao Huang, Pei-Wen Wang, Yu-Chen Ma, Erh-Shun Chuang
  • Publication number: 20250067710
    Abstract: The present invention provides a method for constructing a fingerprint of a Xin Su Ning capsule and a fingerprint. The method includes: S1: taking contents of Xin Su Ning capsules of different batches, adding a methanol aqueous solution, and performing ultrasonic extraction to obtain test article solutions; S2: injecting the test article solutions into a high performance liquid chromatograph, performing gradient elution, performing chromatographic analysis, and recording chromatograms from 0 to 140 min; S3: importing the chromatograms into a traditional Chinese medicine chromatographic fingerprint similarity evaluation system to obtain a fingerprint; and S4: performing mass spectral analysis on the test article solutions, and determining chemical constituents of chromatographic peaks in the fingerprint according to results of the mass spectral analysis.
    Type: Application
    Filed: April 5, 2024
    Publication date: February 27, 2025
    Inventors: Chengyuan LIANG, Changhua Ke, Yue Xing, Jingjing Zhou, Jinrong Hu, Boxin Zhang, Yunfei Zhang, Bingxing Zhang, Wen Wang, Fei Li, Yifan Li
  • Publication number: 20250060455
    Abstract: A three-dimensional structure sensing system includes an image sensor that receives a reflected light from an object irradiated by an emitted light, the reflected light being converted into image data representing an image of the object; and a depth processing unit that generates depth data according to the image data. It is determined whether the depth data is affected by a reflective surface according to the image data and the depth data.
    Type: Application
    Filed: August 15, 2023
    Publication date: February 20, 2025
    Inventors: Min-Chian Wu, Cheng-Che Tsai, Ching-Wen Wang
  • Patent number: 12225924
    Abstract: Methods for creating self-folding materials that change shape in response to grooves created in the surface of the materials and when exposed to a stimuli. A tailored computational design tool, digital fabrication platform and mold for use with the methods also are provided.
    Type: Grant
    Filed: June 22, 2020
    Date of Patent: February 18, 2025
    Assignee: CARNEGIE MELLON UNIVERSITY
    Inventors: Lining Yao, Ye Tao, Yi-Chin Lee, Haolin Liu, Jianxun Cui, Catherine Mondoa, Jasio Santillan, Wen Wang, Teng Zhang
  • Patent number: D1066986
    Type: Grant
    Filed: March 10, 2023
    Date of Patent: March 18, 2025
    Assignee: Master Plans LLC
    Inventors: Yi Chia Chen, Szu Wen Wang
  • Patent number: D1066997
    Type: Grant
    Filed: November 26, 2024
    Date of Patent: March 18, 2025
    Inventor: Wen Wang