Patents by Inventor Wen Wu

Wen Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Image processing unit, image processing apparatus and image display system
    Patent number: 9201483
    Abstract: An image processing unit including an always on circuit block and a non-always on circuit block is provided. When operating under a first operation mode, the non-always on circuit block receives a bias voltage from a power supply unit, so as to perform an image processing operation on an image input signal. When operating under a second operation mode, the non-always on circuit block stops receiving the bias voltage from the power supply unit, so as to stop the image processing operation, and at least a microcontroller of the non-always on circuit block is powered down. One of the always on circuit block and the non-always on circuit block controls the power supply unit to stop supplying the bias voltage to the non-always on circuit block according an event trigger signal, such that the non-always on circuit block enters the second operation mode from the first operation mode.
    Type: Grant
    Filed: June 4, 2013
    Date of Patent: December 1, 2015
    Assignee: Novatek Microelectronics Corp.
    Inventors: Wen-Chi Lin, Kuo-Chi Chen, Sih-Ting Wang, Wen-Hsuan Lin, Chung-Wen Wu
  • Wound drainage therapy system
    Patent number: 9199010
    Abstract: A wound drainage therapy system includes a wound seal unit, a fluid collector unit, a vacuum driving unit and an actuator. The fluid collector unit is detachably connected with the wound seal unit, and the fluid collector unit has a multiple-pipe integration module and a collection bag. The multiple-pipe integration module has a first row connection port group and a second row connection port group. The vacuum driving unit has a vacuum generator. The actuator has a motor, a negative pressure detector and a positive pressure detector, wherein the motor is used to drive the vacuum generator to operate and the motor is detachably connected with the vacuum generator. A connection port of the negative pressure detector and a connection port of the positive pressure detector are detachably connected with another two connection ports of the second row connection port group respectively.
    Type: Grant
    Filed: November 26, 2012
    Date of Patent: December 1, 2015
    Assignee: APEX MEDICAL CORP.
    Inventors: Nan-Kuang Yao, Luo-Hwa Miao, Jhy-Wen Wu, Yu-Yi Chien, Li-Ling Li, Chih-Tsan Chien
  • DISPLAYING METHOD AND ELECTRONIC DEVICE
    Publication number: 20150334305
    Abstract: A displaying method for an electronic device is provided. The electronic device comprises a storage device storing at least a photo group and a sharpness look-up table. The photo group includes a plurality of photos of an object successively captured in different focuses and the sharpness look-up table records sharpness information of each of the photos. The displaying method comprises displaying a cover photo of the photo group and receiving a selecting signal indicating a position on the cover photo. According to the position, the sharpness information of each photo in the sharpness look-up table is checked to determine a photo to be displayed, wherein the sharpness information of the determined photo shows a sharpness score at the position of the determined photo is the maximum among the sharpness scores at the positions of the photos in the photo group. The determined photo of the object is displayed.
    Type: Application
    Filed: May 13, 2014
    Publication date: November 19, 2015
    Applicant: HTC Corporation
    Inventors: Pai-Chang Yeh, Peng-Jr Weng, Jui-Chieh Wu, Chen-Wen Wu
  • Combined cardiac and respiratory motion compensation for atrial fibrillation ablation procedures
    Patent number: 9186087
    Abstract: A method for compensating cardiac and respiratory motion in atrial fibrillation ablation procedures includes (a) simultaneously determining a position of a circumferential mapping (CFM) catheter and a coronary sinus (CS) catheter in two consecutive image frames of a series of first 2-D image frames; (b) determining a distance between a virtual electrode on the CS catheter and a center of the CFM catheter for a first image frame of the two consecutive image frames, and for a second image frame of the two consecutive image frames; and (c) if an absolute difference of the distance for the first image frame and the distance for the second image frame is greater than a predetermined threshold, compensating for motion of the CFM catheter in a second 2-D image.
    Type: Grant
    Filed: March 29, 2012
    Date of Patent: November 17, 2015
    Assignees: Siemens Aktiengesellschaft, Friedrich-Alexander-Universität Erlangen-Nürnberg
    Inventors: Rui Liao, Alexander Benjamin Brost, Wen Wu, Terrence Chen, Joachim Hornegger, Martin Willibald Koch, Norbert Strobel, Andreas Wimmer
  • METHOD OF MAKING A PILLAR STRUCTURE HAVING A NON-METAL SIDEWALL PROTECTION STRUCTURE AND INTEGRATED CIRCUIT INCLUDING THE SAME
    Publication number: 20150325546
    Abstract: An integrated circuit device includes a semiconductor substrate; and a pad region over the semiconductor substrate. The integrated circuit device further includes an under-bump-metallurgy (UBM) layer over the pad region. The integrated circuit device further includes a conductive pillar on the UBM layer, wherein the conductive pillar has a sidewall surface and a top surface. The integrated circuit device further includes a protection structure over the sidewall surface of the conductive pillar, wherein sidewalls of the UBM layer are substantially free of the protection structure, and the protection structure is a non-metal material.
    Type: Application
    Filed: July 21, 2015
    Publication date: November 12, 2015
    Inventors: Chien Ling HWANG, Yi-Wen WU, Chun-Chieh WANG, Chung-Shi LIU
  • METHOD OF FORMING POST-PASSIVATION INTERCONNECT STRUCTURE
    Publication number: 20150325539
    Abstract: A method includes coating a passivation layer overlying a semiconductor substrate and forming an interconnect layer overlying the passivation layer. The interconnect layer includes a line region and a landing pad region. The method further includes forming a metallic layer including tin on a surface of the interconnect layer using an immersion process, forming a protective layer on the metallic layer, and exposing a portion of the metallic layer on the landing pad region of the interconnect layer through the protective layer.
    Type: Application
    Filed: July 23, 2015
    Publication date: November 12, 2015
    Inventors: Yi-Wen WU, Zheng-Yi LIM, Ming-Che HO, Chung-Shi LIU
  • Semiconductor Package and Method of Manufacturing the Same
    Publication number: 20150318252
    Abstract: A semiconductor package includes a semiconductor substrate, a contact pad overlying the semiconductor substrate, an interconnect layer overlying the contact pad, a passivation layer formed between the contact pad and the interconnect layer, a bump overlying the interconnect layer, and a protection layer overlying the interconnect layer and the passivation layer and covering a lower portion of the bump. The protection layer includes a curved surface region.
    Type: Application
    Filed: July 14, 2015
    Publication date: November 5, 2015
    Inventors: Wen-Hsiung Lu, Ming-Da Cheng, Yi-Wen Wu, Yu-Peng Tsai, Chia-Wei Tu, Chung-Shi Liu
  • Touch display driving circuit capable of responding to CPU commands
    Patent number: 9176613
    Abstract: A touch display driving circuit capable of responding to CPU commands, including: a first interface for receiving pixel data and touch configuration data; a second interface for coupling with a touch display; and a control unit, which drives the touch display via the second interface to show an image according to the pixel data, and executes a touch detection procedure on the touch display via the second interface, wherein the touch detection procedure is determined according to the touch configuration data.
    Type: Grant
    Filed: March 14, 2013
    Date of Patent: November 3, 2015
    Assignee: Rich IP Technology Inc.
    Inventors: Han-Chang Chen, Chung-Lin Chia, Chih-Wen Wu, Yen-Hung Tu, Jen-Chieh Chang
  • Method for performing dynamic registration, overlays, and 3D views with fluoroscopic images
    Patent number: 9173626
    Abstract: A method (200, 300) and system (100) for performing real-time, dynamic overlays on fluoroscopic images to aid in navigation and localization during medical procedures.
    Type: Grant
    Filed: January 3, 2013
    Date of Patent: November 3, 2015
    Assignee: Siemens Aktiengesellschaft
    Inventors: Atilla Peter Kiraly, Wen Wu, Norbert Strobel, Alexander Benjamin Brost, Terrence Chen
  • Interconnection Structure And Method For Semiconductor Device
    Publication number: 20150311152
    Abstract: A semiconductor device is disclosed. The device includes a substrate, a first dielectric layer disposed over the substrate and a metal structure disposed in the first dielectric layer and below a surface of the first dielectric layer. The metal structure has a such shape that having an upper portion with a first width and a lower portion with a second width. The second width is substantially larger than the first width. The semiconductor device also includes a sub-structure of a second dielectric positioned between the upper portion of the metal structure and the first dielectric layer.
    Type: Application
    Filed: July 7, 2015
    Publication date: October 29, 2015
    Inventors: Chih-Yuan Ting, Chung-Wen Wu
  • TOUCH DISPLAY DEVICE HAVING AUXILIARY CAPACITOR
    Publication number: 20150301654
    Abstract: A touch display device having auxiliary capacitor, including: at least one touch operation area, each having two opposing substrates, between which are a first electrode, a first conductive line coupled with the first electrode, a second electrode, a second conductive line coupled with the second electrode, and a display layer neighboring both the first electrode and the second electrode; a display driver unit for outputting at least one display driving voltage; a touch detection unit having at least one touch signal sensing port; at least one auxiliary capacitor, each coupled with one of the at least one touch operation area; and at least one switch element; wherein, each of the at least one display driving voltage is coupled to one of the at least one touch operation area via one of the at least one switch element.
    Type: Application
    Filed: April 16, 2015
    Publication date: October 22, 2015
    Inventors: Han-Chang CHEN, Yen-Hung TU, Chung-Lin CHIA, Chih-Wen WU, Jen-Chieh CHANG
  • Zero Stand-Off Bonding System and Method
    Publication number: 20150303161
    Abstract: A system and method for a zero stand-off configuration are provided. An embodiment comprises forming a seal layer over a conductive region that is part of a first substrate and breaching the seal with a conductive member of a second substrate in order to bond the first substrate to the second substrate.
    Type: Application
    Filed: June 22, 2015
    Publication date: October 22, 2015
    Inventors: Chun-Hung Lin, Ming-Che Ho, Yu-Feng Chen, Yi-Wen Wu, Hsien-Liang Meng, Han-Ping Pu
  • Circuit board with signal routing layer having uniform impedance
    Patent number: 9161437
    Abstract: A circuit board comprises a signal routing layer, a first dielectric layer, a second dielectric layer, a third dielectric layer, a first ground layer, a second ground layer, and a third ground layer. The signal routing layer includes chip traces, connector traces, and signal traces connected to components. The first dielectric layer, the first ground layer, the second dielectric layer, the second ground layer, the third dielectric layer, and the third ground layer, in that order, are located at gradually increasing distances from the signal routing layer. The first ground layer corresponds to the chip traces, the second ground layer corresponds to the signal traces, and the third ground layer corresponds to the connector traces.
    Type: Grant
    Filed: April 17, 2013
    Date of Patent: October 13, 2015
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Kai-Wen Wu
  • Laser projection device with splitters spaced from each other
    Patent number: 9152028
    Abstract: An exemplary laser projection device includes a substrate, three laser chips mounted on the substrate, and a spectroscope arranged on laser beams paths of the laser chips. Each laser chip is a laser diode. The spectroscope includes a first group of splitters, and a second group of splitters spaced from the first group of splitters. Laser beams emitted from the laser chips are adjusted into the second group of splitters by the first group of splitters. And then, the laser beams adjusted into the second group of splitters are adjusted to be oriented toward the same direction and mixed together to obtain light of a predetermined color.
    Type: Grant
    Filed: May 14, 2013
    Date of Patent: October 6, 2015
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Kai-Wen Wu
  • Method of preventing a pattern collapse
    Patent number: 9153479
    Abstract: A device includes a substrate and at least three conducting features embedded into the substrate. Each conducting feature includes a top width x and a bottom width y, such that a top and bottom width (x1, y1) of a first conducting feature has a dimension of (x1<y1), a top and bottom width (x2, y2) of a second conducting feature has a dimension of (x2<y2; x2=y2; or x2>y2), and a top and bottom width (x3, y3) of a third conducting feature has a dimension of (x3>y3). The device also includes a gap structure isolating the first and second conducting features. The gap structure can include such things as air or dielectric.
    Type: Grant
    Filed: June 6, 2013
    Date of Patent: October 6, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Yuan Ting, Chung-Wen Wu, Jeng-Shiou Chen, Jang-Shiang Tsai, Jyu-Horng Shieh
  • Systems and Methods for In Situ Maintenance of a Thin Hardmask During an Etch Process
    Publication number: 20150279685
    Abstract: Methods of patterning a target material layer are provided herein. The method includes steps of positioning a semiconductor wafer having the target material layer thereon in an etch chamber and of providing a flow of etch gases into the etch chamber, the flow of etch gases etchant gas comprising a plurality of gases. The semiconductor wafer has a patterned hardmask feature formed from a compound on the target material layer. The method also includes steps of etching the target material layer using the patterned hardmask feature as a mask feature, wherein one of the gases chemically alters the patterned hardmask feature and at least one of the gases chemically repairs the patterned hardmask feature so that the patterned hardmask feature retains its dimensions during the etching. Associated semiconductor wafer are also provided herein.
    Type: Application
    Filed: March 28, 2014
    Publication date: October 1, 2015
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Yuan Ting, Chung-Wen Wu
  • Patterning Approach to Reduce Via to Via Minimum Spacing
    Publication number: 20150262934
    Abstract: A method for patterning vias in a chip comprises forming a photomask layer including a gap on a patterned hardmask layer including a plurality of trenches and in contact with a uniform layer on a substrate, wherein the gap overlaps with two or more of the trenches. The method further comprises exposing a portion of the uniform layer under the gap using a photo exposure process, etching the exposed portion of the uniform layer with the photomask layer to obtain a plurality of vias extended partially through the substrate, and further etching the vias to obtain corresponding through-substrate vias. Another method comprises patterning a plurality of vias in a plurality of trenches of a hardmask layer on a substrate using a single photo exposure step and a photomask comprising a single gap that overlaps with the trenches.
    Type: Application
    Filed: May 28, 2015
    Publication date: September 17, 2015
    Inventors: Chih-Yuan Ting, Chung-Wen Wu
  • Method of making a pillar structure having a non-metal sidewall protection structure
    Patent number: 9136167
    Abstract: A method of making a pillar structure includes forming a first under-bump-metallurgy (UBM) layer formed on a pad region of a substrate, wherein the first UBM layer includes sidewalls. The method further includes forming a second UBM layer on the first UBM layer, wherein the second UBM layer includes a sidewall surface, an area of the first UBM layer is greater than an area of the second UBM layer. The method further includes forming a copper-containing pillar on the second UBM layer, wherein the copper-containing pillar includes a sidewall surface and a top surface. The method further includes forming a protection structure on the sidewall surface of the copper-containing pillar and on an entirety of the sidewall surface of the second UBM layer, wherein the protection structure does not cover the sidewalls of the first UBM layer, and the protection structure is a non-metal material.
    Type: Grant
    Filed: August 22, 2014
    Date of Patent: September 15, 2015
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Chien Ling Hwang, Yi-Wen Wu, Chun-Chieh Wang, Chung-Shi Liu
  • CONNECTOR AND ASSEMBLY METHOD FOR TRANSMISSION ASSEMBLY OF CONNECTOR
    Publication number: 20150255936
    Abstract: A connector includes an insulated housing having a slot and a transmission assembly located inside the insulated housing. The transmission assembly includes a main circuit board, an expanded circuit board, a plurality of first terminals and at least one second terminal. The expanded circuit board is stacked on the main circuit board and a first lateral side and a second lateral side of the expanded circuit board which are opposite to each other has a plurality of first electrical contacts and at least one second electrical contact, respectively. The first terminals and the at least one second terminal are plugged in the main circuit board. One ends of the first terminals are in electrical contact with the first electrical contacts respectively. The other ends of the first terminals bend and extend towards the second lateral side of the expanded circuit board.
    Type: Application
    Filed: March 6, 2014
    Publication date: September 10, 2015
    Applicant: Telebox Industries Corp.
    Inventors: Fu-Wen WU, Su-Hui HUANG
  • Connector and assembly method for transmission assembly of connector
    Patent number: 9130329
    Abstract: A connector includes an insulated housing having a slot and a transmission assembly located inside the insulated housing. The transmission assembly includes a main circuit board, an expanded circuit board, a plurality of first terminals and at least one second terminal. The expanded circuit board is stacked on the main circuit board and a first lateral side and a second lateral side of the expanded circuit board which are opposite to each other has a plurality of first electrical contacts and at least one second electrical contact, respectively. The first terminals and the at least one second terminal are plugged in the main circuit board. One ends of the first terminals are in electrical contact with the first electrical contacts respectively. The other ends of the first terminals bend and extend towards the second lateral side of the expanded circuit board.
    Type: Grant
    Filed: March 6, 2014
    Date of Patent: September 8, 2015
    Assignee: TELEBOX INDUSTRIES CORP.
    Inventors: Fu-Wen Wu, Su-Hui Huang, Ching-Yi Hsu