Abstract: A computing device is electronically connected to a measurement machine and a controller. The controller is connected to a sensor installed on the measurement machine. The computing device receives spectral signal data sent from the controller and generates an intensity distribution diagram according to the spectral signal data. Furthermore, the computing device sends control commands to the measurement machine, to adjust a position of the sensor on the measurement machine according to variation of a peak value of a wave in the intensity distribution diagram.

Abstract: A touch display having advanced-fringe-field-switching liquid crystal structure, including a pixel cell and a multiplexer circuit, wherein the multiplexer circuit is used to couple the pixel cell with a source driver unit to provide a fringe-field-switching display function during a display period, and couple the pixel cell with a touch detection unit to provide a touch detection function during a touch detection period.

Abstract: A method of making a pillar structure includes forming a first under-bump-metallurgy (UBM) layer formed on a pad region of a substrate, wherein the first UBM layer includes sidewalls. The method further includes forming a second UBM layer on the first UBM layer, wherein the second UBM layer includes a sidewall surface, an area of the first UBM layer is greater than an area of the second UBM layer. The method further includes forming a copper-containing pillar on the second UBM layer, wherein the copper-containing pillar includes a sidewall surface and a top surface. The method further includes forming a protection structure on the sidewall surface of the copper-containing pillar and on an entirety of the sidewall surface of the second UBM layer, wherein the protection structure does not cover the sidewalls of the first UBM layer, and the protection structure is a non-metal material.

Abstract: A circuit board assembly includes a substrate, a first optical connector, a second optical connector, and at least two planar light wave circuits. The first optical connector includes a first circuit board electrically connected to the substrate, at least one first laser diode, at least one first photodiode, and a first transparent shell. The second optical connector includes a second circuit board connected to the substrate, at least one second laser diode, at least one second photodiode, and a second transparent shell. The planar light wave circuits are arranged between the first and second transparent shells. Each first laser diode is optically coupled with a second photodiode through a first transparent shell, a planar light wave circuit, and a second transparent shell. Each second laser diode is optically coupled with a first photodiode through a second transparent shell, a planar light wave circuit, and a first transparent shell.

Abstract: An optical communication module includes a substrate, an optical signal receiving unit, an optical signal emitting unit and a coupler. The substrate includes a first surface and a second surface. The substrate defines through holes passing through the first and second surfaces. The optical signal receiving unit includes optical-electrical signal converters. The optical signal emitting unit includes optical signal generators. Each of the optical-electrical signal converters and the optical signal generators is mounted on the first surface and aligned with a corresponding one of the through holes. The coupler includes coupling lenses. The coupler is fixed to the second surface. Each of the optical-electrical signal converters and the optical signal generators is aligned with a corresponding coupling lens through the corresponding through hole.

Abstract: A light-emitting diode driving device includes a light-emitting diode driving chip, for driving the one or more light-emitting diode strings according to a feedback voltage associated with the one or more light-emitting diode strings, and a voltage limiter, having a terminal coupled to the light-emitting diode driving chip and another terminal coupleable to the one or more light-emitting diode strings, for generating the feedback voltage for provision to the light-emitting diode driving chip according to a bottom voltage of the one or more light-emitting diode strings, and limiting the feedback voltage not to exceed a preset level; wherein the voltage limiter starts limiting the feedback voltage to substantially the preset level when the bottom voltage rises to the preset level.

Abstract: A miniature projection device includes a rotatable bracket assembly, a rotating plate, a driving device, and a light source unit. The rotating plate is rotatably mounted to the rotatable bracket assembly. The driving device is configured to drive the rotatable bracket assembly to rotate in a first direction, and to drive the rotatable plate to rotate in a second direction. The first direction is substantially perpendicular to the second direction. The light source unit is mounted on the rotatable plate and is capable of rotating together with the rotating plate. The light source unit is configured to emit laser beams and to project the laser beams onto a screen.

Abstract: An integrated backlight driving chip for driving a light-emitting diode backlight module includes a scaler circuit and a backlight driving circuit. The scaler circuit includes a digital control unit for generating a digital control signal, and a variable reference voltage generation unit for generating a reference voltage. The backlight driving circuit is coupled to the digital control unit, the variable reference voltage generation unit, and the LED backlight module, for generating a backlight driving signal according to the digital control signal and the reference voltage so as to drive the LED backlight module.

Abstract: A method and system for detecting and tracking coronary sinus (CS) catheter electrodes in a fluoroscopic image sequence is disclosed. An electrode model is initialized in a first frame of the fluoroscopic image sequence based on input locations of CS sinus catheter electrodes in the first frame. The electrode model is tracked in subsequent frames of the fluoroscopic image sequence by detecting electrode position candidates in the subsequent frames of the fluoroscopic image sequence using at least one trained electrode detector, generating electrode model candidates in the subsequent frames based on the detected electrode position candidates, calculating a probability score for each of the electrode model candidates, and selecting an electrode model candidate based on the probability score.

Abstract: A light-emitting diode driving device includes a light-emitting diode driving chip, for driving the one or more light-emitting diode strings according to a feedback voltage associated with the one or more light-emitting diode strings, and a voltage limiter, having a terminal coupled to the light-emitting diode driving chip and another terminal coupleable to the one or more light-emitting diode strings, for generating the feedback voltage for provision to the light-emitting diode driving chip according to a bottom voltage of the one or more light-emitting diode strings, and limiting the feedback voltage not to exceed a preset level.

Abstract: A chip assembly includes a PCB, a connecting pad fixed on the PCB, and a chip. The connecting pad defines a through hole. The chip is received in the through hole and fixed on the PCB by an adhesive distributed in the through hole. A thickness of the adhesive is less than that of the connecting pad.

Abstract: A circuit board assembly includes a circuit board, at least one pad formed on the circuit board, and at least one connection line. Each of the at least one connection line includes a connection end connected to a respective one of the at least one pad and has the same resistance value as the respective pad.

Abstract: A method of making a semiconductor device includes forming an under bump metallurgy (UBM) layer over a substrate, the UBM layer comprising sidewalls and a surface region. The method further includes forming a conductive pillar over the UBM layer, the conductive pillar includes sidewalls, wherein the conductive pillar exposes the surface region of the UBM layer. The method further includes forming a non-metal protective structure over the sidewalls of the conductive pillar, wherein the non-metal protective structure contacts the surface region of the UBM layer, and the non-metal protective structure exposes the sidewalls of the UBM layer.

Abstract: A touch display having in-plane-switching liquid crystal structure, comprising a pixel cell and a multiplexer circuit, wherein the multiplexer circuit is used to couple a source driver unit with the pixel cell to provide an in-plane switching display function during a display period, and couple a touch control unit with the pixel cell to provide a touch detection function during a touch detection period.

Abstract: A circuit board includes a first circuit substrate configured for mounting a driving chip and a second circuit substrate positioned on and electrical connected to the first circuit substrate. The second circuit substrate comprises two first top pads, and each of the first top pads can be configured for mounting a light emitter. The second circuit substrate is arranged on the first circuit substrate and can be employed to mount the light emitters, which can improve the precision in the process of mounting the light emitters.

Abstract: An LED module includes a circuit board with circuit arranged thereon and an LED package mounted on the circuit board via flip-chip mounting. The LED package includes a substrate, a pin structure and a reflector arranged on the substrate, an LED chip disposed on the pin structure and an encapsulation layer covering the LED chip and received in the reflector. A top surface of the encapsulation layer adjacent to the circuit board acts as a light outputting surface. The pin structure extends from the substrate to a top surface of the reflector near the light outputting surface. The pin structure electrically connects the circuit board by conductive adhesive arranged therebetween. The light outputting surface faces a through hole defined in the circuit board. Light emitted from the LED chip travels through the light outputting surface and the through hole in sequence to illuminate.

Abstract: Optical connector includes a circuit board, a photoelectric element, a driver chip, a coupler, and a holder. The circuit board includes a substrate including a first surface and a second surface opposite to the first surface and a circuit portion formed on the substrate. The substrate defines a receiving groove in the second surface and a through hole passing through a bottom surface of the receiving groove and the first surface. The photoelectric element and the driver chip are positioned on the bottom surface of the receiving groove, and the photoelectric element is aligned with the through hole. The coupler is positioned on the first surface of the substrate and is aligned with the photoelectric element through the through hole. The holder holds an optical fiber. The holder is supported on the first surface and connected to the coupler. The coupler optically couples the optical fiber with the photoelectric element.

Abstract: A method includes forming a polymer layer over a metal pad, forming an opening in the polymer layer to expose a portion of the metal pad, and forming an under-bump-metallurgy (UBM). The UBM includes a portion extending into the opening to electrically couple to the metal pad.

Abstract: A laser projection device includes a substrate, three laser diodes mounted on the substrate, and a spectroscope located on light paths of the laser diodes. The laser diodes are arranged along an arc-shaped curve. A sector-shaped region is defined by the three laser diodes and two intersected sides of the substrate. The spectroscope is located at the sector-shaped region. Light emitted from the laser diodes is adjusted by the spectroscope to transmit along a common direction and be mixed with each other.

Abstract: A circuit board includes a dielectric layer and a signal routing layer on the dielectric layer. The signal routing layer includes chip traces, connector traces, and signal traces connected with the chip traces and the connector traces. The dielectric layer includes a signal trace area for arraying the signal traces, a chip trace area for arraying the chip traces, and a connector trace area for arraying the connector traces. The dielectric coefficient of the signal trace area is smaller than the dielectric coefficient of the chip trace area and greater than the dielectric coefficient of the connector trace area.