Patents by Inventor Wen Wu

Wen Wu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Optical connector package and optical connector
    Patent number: 9122029
    Abstract: An optical connector package includes a substrate and a casing positioned on the substrate and comprising a positioning pin. The casing and the substrate cooperatively define a receiving space. The positioning pin defines a vent functioning as a sole channel communicating the receiving space with the outside of the casing. The vent is sealed after the optical connector package subjects to all required heating processes.
    Type: Grant
    Filed: July 22, 2012
    Date of Patent: September 1, 2015
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Kai-Wen Wu
  • Optical connector
    Patent number: 9122031
    Abstract: Optical connector includes a circuit board, a photoelectric element, a driver chip, a coupler, and a holder holding an optical fiber. The circuit board includes a substrate having a first surface and an opposing second surface and a circuit portion formed on the substrate. The substrate defines a receiving groove in the second surface and a through hole passing through a bottom surface of the receiving groove and the first surface. The photoelectric element and the driver chip are positioned on the bottom surface, and the photoelectric element aligns with the through hole. The coupler is positioned on the first surface and aligns with the photoelectric element through the through hole. The holder is supported on the first surface and connected to the coupler. The coupler optically couples the optical fiber with the photoelectric element.
    Type: Grant
    Filed: April 29, 2014
    Date of Patent: September 1, 2015
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Kai-Wen Wu
  • Via Structure For Packaging And A Method Of Forming
    Publication number: 20150243531
    Abstract: A via or pillar structure, and a method of forming, is provided. In an embodiment, a polymer layer is formed having openings exposing portions of an underlying conductive pad. A conductive layer is formed over the polymer layer, filling the openings. The dies are covered with a molding material and a planarization process is performed to form pillars in the openings. In another embodiment, pillars are formed and then a polymer layer is formed over the pillars. The dies are covered with a molding material and a planarization process is performed to expose the pillars. In yet another embodiment, pillars are formed and a molding material is formed directly over the pillars. A planarization process is performed to expose the pillars. In still yet another embodiment, bumps are formed and a molding material is formed directly over the bumps. A planarization process is performed to expose the bumps.
    Type: Application
    Filed: February 21, 2014
    Publication date: August 27, 2015
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Ming-Che Ho, Yi-Wen Wu, Chien Ling Hwang, Hung-Jui Kuo, Chung-Shi Liu
  • Packaging Devices and Methods
    Publication number: 20150243615
    Abstract: A method of manufacturing a packaging device may include: forming a plurality of through-substrate vias (TSVs) in a substrate, wherein each of the plurality of TSVs has a protruding portion extending away from a major surface of the substrate. A seed layer may be forming over the protruding portions of the plurality of TSVs, and a conductive ball may be coupled to the seed layer and the protruding portion of each of the plurality of TSVs. The seed layer and the protruding portion of each of the plurality of TSVs may extend into an interior region of the conductive ball.
    Type: Application
    Filed: May 11, 2015
    Publication date: August 27, 2015
    Inventors: Shih-Wei Liang, Kai-Chiang Wu, Ming-Che Ho, Yi-Wen Wu
  • Circuit board and optical-electrical module with same
    Patent number: 9116311
    Abstract: A circuit board includes a mounting surface and a number of connecting pads on the mounting surface. Each of the connecting pads defines a mounting area for mounting an element thereon. At least two of the connecting pads are substantially circular-shaped.
    Type: Grant
    Filed: April 30, 2013
    Date of Patent: August 25, 2015
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Kai-Wen Wu
  • Bonding package components through plating
    Patent number: 9117772
    Abstract: A method includes aligning a first electrical connector of a first package component to a second electrical connector of a second package component. With the first electrical connector aligned to the second electrical connector, a metal layer is plated on the first and the second electrical connectors. The metal layer bonds the first electrical connector to the second electrical connector.
    Type: Grant
    Filed: June 19, 2012
    Date of Patent: August 25, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Zheng-Yi Lim, Yi-Wen Wu, Tzong-Hann Yang, Ming-Che Ho, Chung-Shi Liu
  • METHODS OF TREATMENT WITH ARGININE DEIMINASE
    Publication number: 20150231272
    Abstract: The present invention relates generally to methods of treating cancer with arginine deiminase, and in particular pegylated arginine deiminase.
    Type: Application
    Filed: May 1, 2015
    Publication date: August 20, 2015
    Inventors: John S. Bomalaski, Bor-Wen Wu
  • METHOD OF FORMING CU PILLAR BUMP WITH NON-METAL SIDEWALL SPACER AND METAL TOP CAP
    Publication number: 20150228533
    Abstract: A method of forming an integrated circuit device includes forming a conductive element over a substrate, wherein the conductive element is over an under bump metallurgy (UBM) layer, and the UBM layer comprises a first UBM layer and a second UBM layer over the first UBM layer. The method further includes etching the second UBM layer to expose a portion of the first UBM layer beyond a periphery of the conductive element. The method further includes forming a protection layer over sidewalls of the conductive element, over sidewalls of the second UBM layer and over a top surface of the first UBM layer. The method further includes etching the first UBM layer to remove a portion of the first UBM layer. The method further includes forming a cap layer over a top surface of the conductive element.
    Type: Application
    Filed: April 23, 2015
    Publication date: August 13, 2015
    Inventors: Chien Ling HWANG, Hui-Jung TSAI, Yi-Wen WU, Chung-Shi LIU
  • Optical fiber coupler having male port and female port
    Patent number: 9103990
    Abstract: An optical fiber coupler includes a male port and a female port. The male port includes a main body, the male transmission lens and the male receiving lens positioned on the main body, and a male optical wave guide assembly. The male base board includes at least one male optical wave guide. Each male optical wave guide includes a male first alignment portion and a male second alignment portion. The male first alignment portion is optically coupled with one male receiving lens; and a male second alignment portion has a greater width than that of the male first alignment portion. The structure of the female port is similar to the male port.
    Type: Grant
    Filed: August 23, 2012
    Date of Patent: August 11, 2015
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Kai-Wen Wu
  • Post-passivation interconnect structure and method of forming the same
    Patent number: 9099396
    Abstract: A semiconductor device includes a conductive layer formed on the surface of a post-passivation interconnect (PPI) structure by an immersion tin process. A polymer layer is formed on the conductive layer and patterned with an opening to expose a portion of the conductive layer. A solder bump is then formed in the opening of the polymer layer to electrically connect to the PPI structure.
    Type: Grant
    Filed: November 8, 2011
    Date of Patent: August 4, 2015
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Yi-Wen Wu, Zheng-Yi Lim, Ming-Che Ho, Chung-Shi Liu
  • Optical connector with printed circuit board and lens element bonded to each other
    Patent number: 9097866
    Abstract: An optical connector includes a printed circuit board, a photoelectric element, a lens element, and an adhesive. The photoelectric element is positioned on and electrically connected to the printed circuit board. The positioning element is an enclosing wall extending from the printed circuit board and enclosing the photoelectric element. The lens element includes a bottom surface, an internal lens formed on the bottom surface, and a supporting leg, which is an enclosing wall extending from a periphery of the bottom surface. The supporting leg is positioned on the printed circuit board and fittingly engaged with the positioning element. The adhesive is applied between the supporting leg and the printed circuit board.
    Type: Grant
    Filed: August 9, 2013
    Date of Patent: August 4, 2015
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Kai-Wen Wu
  • Fluid collector
    Patent number: 9095644
    Abstract: A fluid collector has a container, a T-tube, a first screw unit and a second screw unit. The T-tube is connected to the container and has a main pipe and a branch pipe. The first screw unit is mounted in an outlet end of the main pipe. The second screw unit is mounted in a connecting end of the branch pipe, which is connected to the main pipe. The branch pipe has a detecting opening far from the connecting end and connects to a detecting device. By changing the length of the first and second screw units, different detecting values of the pressure are adjusted according to containers with different capacities. Moreover, with the flowing resistance resulting from the first and second screw units, different pressure variations are performed when liquid or air passes through the T-tube. Therefore, massive hemorrhage is clearly identified to keep the patient safe.
    Type: Grant
    Filed: April 13, 2012
    Date of Patent: August 4, 2015
    Assignee: APEX MEDICAL CORP.
    Inventors: Nan-Kuang Yao, Jhy-Wen Wu, Luo-Hwa Miau, Jen-Chien Chien, Shi-Fu Chen, Li-Ling Li
  • Optical coupler
    Patent number: 9097859
    Abstract: An optical coupler includes a male port and a female port. The male port includes a first main body, a first optical fiber, and a male port lens unit. The male port lens unit includes a first base body, a first male port lens coupling with the first optical fiber, and a second male port lens. The first base body includes a male port reflecting sidewall. The female port includes a second main body, a second optical fiber, and a female port lens unit. The female port lens unit includes a second base body, a first female port lens coupling with the second optical fiber, and a second female port lens coupling with the second male port lens. The second base body includes a female port reflecting surface parallel with the male port reflecting sidewall.
    Type: Grant
    Filed: October 19, 2012
    Date of Patent: August 4, 2015
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventor: Kai-Wen Wu
  • BATTERY MODULE AND HEAT DISSIPATING UNIT THEREOF
    Publication number: 20150200429
    Abstract: A battery module comprises a base, a set of battery cells and a plurality of heat dissipating units. The base comprises an input opening, an output opening and a plurality of fluid channels. A set of battery cells is disposed on the base and comprises a plurality of battery cells. A channel is formed between neighboring battery cells and the heat dissipating units are respectively disposed in the channels. Each heat dissipating unit has a main body having an expandable fluid channel, a fluid inlet and a fluid outlet. Each expandable fluid channel is communicated with the respective fluid inlet and the respective fluid outlet, and the expandable fluid channels are communicated with the fluid channels of the base. When a coolant flows into the expandable fluid channel, at least one side wall expands with the pressure of the coolant and contacts the surface of the battery cell.
    Type: Application
    Filed: April 3, 2014
    Publication date: July 16, 2015
    Applicant: Simplo Technology Co., Ltd.
    Inventors: CHAO-FENG LEE, WEN WU, CHIA-HUNG CHIEN
  • Semiconductor package having protective layer with curved surface and method of manufacturing same
    Patent number: 9082776
    Abstract: A semiconductor package includes a semiconductor substrate, a contact pad overlying the semiconductor substrate, an interconnect layer overlying the contact pad, a passivation layer formed between the contact pad and the interconnect layer, a bump overlying the interconnect layer, and a protection layer overlying the interconnect layer and the passivation layer and covering a lower portion of the bump. The protection layer includes a curved surface region.
    Type: Grant
    Filed: August 24, 2012
    Date of Patent: July 14, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Wen-Hsiung Lu, Ming-Da Cheng, Yi-Wen Wu, Yu-Peng Tsai, Chia-Wei Tu, Chung-Shi Liu
  • SEMICONDUCTOR DEVICE AND FORMATION THEREOF
    Publication number: 20150194425
    Abstract: A semiconductor device and method of formation are provided herein. A semiconductor device includes a first active region adjacent a first side of a shallow trench isolation (STI) region. The first active region including a first proximal fin having a first proximal fin height adjacent the STI region, and a first distal fin having a first distal fin height adjacent the first proximal fin, the first proximal fin height less than the first distal fin height. The STI region includes oxide, the oxide having an oxide volume, where the oxide volume is inversely proportional to the first proximal fin height. A method of formation includes forming a first proximal fin with a first proximal fin height less than a first distal fin height of a first distal fin, such that the first proximal fin is situated between the first distal fin and an STI region.
    Type: Application
    Filed: January 6, 2014
    Publication date: July 9, 2015
    Applicant: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: I-Wen Wu, Mei-Yun Wang, Hsien-Cheng Wang, Shih-Wen Liu, Hsiao-Chiu Hsu, Hsin-Ying Lin
  • SEMICONDUCTOR ARRANGEMENT AND FORMATION THEREOF
    Publication number: 20150194516
    Abstract: A semiconductor arrangement and method of forming the same are described. A semiconductor arrangement includes a third metal connect in contact with a first metal connect in a first active region and a second metal connect in a second active region, and over a shallow trench isolation region located between the first active region and a second active region. A method of forming the semiconductor arrangement includes forming a first opening over the first metal connect, the STI region, and the second metal connect, and forming the third metal connect in the first opening. Forming the third metal connect over the first metal connect and the second metal connect mitigates RC coupling.
    Type: Application
    Filed: January 6, 2014
    Publication date: July 9, 2015
    Applicant: Taiwan Semiconductor Manufacturing Company Limited
    Inventors: I-Wen Wu, Mei-Yun Wang, Hsien-Cheng Wang, Shih-Wen Liu, Yun Lee, Chao-Hsun Wang
  • Method of forming interconnection structure having notches for semiconductor device
    Patent number: 9076729
    Abstract: A semiconductor device is disclosed. The device includes a substrate, a first dielectric layer disposed over the substrate and a metal structure disposed in the first dielectric layer and below a surface of the first dielectric layer. The metal structure has a such shape that having an upper portion with a first width and a lower portion with a second width. The second width is substantially larger than the first width. The semiconductor device also includes a sub-structure of a second dielectric positioned between the upper portion of the metal structure and the first dielectric layer.
    Type: Grant
    Filed: July 8, 2013
    Date of Patent: July 7, 2015
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Chih-Yuan Ting, Chung-Wen Wu
  • DEHAZING AGENT
    Publication number: 20150175865
    Abstract: A dehazing agent includes a polyethylene glycol compound of 6˜27 wt %, a modified organic polysiloxane mixture of 45˜60 wt % and alcohol. The surface of the article being sprayed or coated with the dehazing agent becomes hydrophilic such that the contact angle of a drop of water on the article is less than 10 degrees. As a result, it lasts for 30 minutes more without forming haze on the surface of the article. The article is thus applicable to humid and warm environments so as to assist the use to work for a long time in such a circumstance.
    Type: Application
    Filed: March 20, 2014
    Publication date: June 25, 2015
    Applicant: National Taiwan University
    Inventors: Bor-Shiunn Lee, Chia-Wen Wu
  • Optical fiber connector and optical fiber coupling assembly having same
    Patent number: 9063311
    Abstract: An optical fiber connector includes a body, a photoelectric conversion module received in the body, a receiving member, and two L-shaped optical fibers. The photoelectric conversion module includes a base, a light emitting unit, and a light receiving unit. The light emitting unit and the light receiving unit are mounted on the base. The receiving member is disposed over the light emitting unit and the light receiving unit and defines two L-shaped receiving holes. The optical fibers are received in the respective receiving holes. One end of one of the two optical fibers is optically aligned and coupled with the light emitting unit. One end of the other optical fiber is optically aligned and coupled with the light receiving unit.
    Type: Grant
    Filed: December 23, 2011
    Date of Patent: June 23, 2015
    Assignee: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: Kai-Wen Wu, Yi-Zhong Sheu