Abstract: A system and method for a zero stand-off configuration are provided. An embodiment comprises forming a seal layer over a conductive region that is part of a first substrate and breaching the seal with a conductive member of a second substrate in order to bond the first substrate to the second substrate.

Abstract: The present invention is related to an UV LED curing apparatus, and more particularly, to an UV LED curing apparatus with improved housing and switch controller. The light reflective inner casing is preferably provided as an effective UV light reflector and as a supporting substrate of the UV LED light source while being capable of transmitting heat from the UV LED light source away for further heat dissipation to the ambient by the outer casing. The outer casing is detachably attached to the inner casing and allows a greater user interaction for decorative and entertainment purposes while also being a protective and heat dissipation means.

Abstract: A hafnium oxide-aluminum oxide-hafnium oxide (HAH) based multilayer stack is used as the dielectric material in the formation of decoupling capacitors employed in microelectronic logic circuits. In some embodiments, the thickness of the aluminum oxide layer in the HAH multilayer stack varies between 0.1 nm and 1 nm. In some embodiments, the thickness of the two hafnium oxide layers varies between about 3.0 nm and 4.5 nm.

Abstract: A laser projection device includes three laser chips, a spectroscope arranged on light paths of laser beams emitted from the three laser chips, and a lens mounted between the laser chips and the spectroscope. The lens includes a main body and a bending part bent from the main body. The main body is on the light paths of two of the laser chips. The bending part is on the light path of another laser chip. The laser beams emitted from the corresponding two laser chips are refracted by the main part of the lens. The laser beams emitted from the corresponding another laser chip are refracted by the bending part. The laser beams emitted from the laser chips are converged by the lens to reach the spectroscope and then reflected by the spectroscope to be mixed together.

Abstract: One embodiment of a sleeping bag extension piece or elongated sleeping bag with sufficient length beyond a traditional sleeping bag to rest upon the sleep surface above the user's shoulder line creating a natural body heat seal and restricting air flow between the sleeping bag top and sleep surface above the shoulder line, and having a separation to allow a user's head to protrude.

Abstract: A TFT display touch device, including: a TFT array, including: a plurality of thin film transistors, each having a source, a gate, and a drain, the drain being coupled with a capacitor; a plurality of gate connecting lines; and a plurality of source connecting lines; and a control unit, having a gate control unit and a source control unit, wherein, at least one of the gate control unit and the source control unit provides a hybrid voltage generation function, and at least one of the gate control unit and the source control unit provides a touch detection function, wherein the hybrid voltage generation function is used to provide a hybrid voltage source having a DC voltage component and an AC voltage component.

Abstract: A method for patterning vias in a chip comprises forming a photomask layer including a gap on a patterned hardmask layer including a plurality of trenches and in contact with a uniform layer on a substrate, wherein the gap overlaps with two or more of the trenches. The method further comprises exposing a portion of the uniform layer under the gap using a photo exposure process, etching the exposed portion of the uniform layer with the photomask layer to obtain a plurality of vias extended partially through the substrate, and further etching the vias to obtain corresponding through-substrate vias. Another method comprises patterning a plurality of vias in a plurality of trenches of a hardmask layer on a substrate using a single photo exposure step and a photomask comprising a single gap that overlaps with the trenches.

Abstract: A chip assembly includes a PCB and a chip positioned on the PCB. The PCB includes a number of first bonding pads. Each bonding pad includes two first soldering balls formed thereon. The chip includes a number of second bonding pads each corresponding to a first bonding pad. Each second bonding pad includes a second soldering ball. The two first soldering balls of a first bonding pad are electrically connected to the second soldering ball of a corresponding second bonding pad via two bonding wires.

Abstract: An optical communication module includes a lens unit and an optical-electrical converter. The optical-electrical converter includes a circuit board and the lens unit is fixed on the circuit board. The lens unit has an extension portion, and the extension portion extends outwards from the lens unit and is parallel to the circuit board. Glue is located between the extension portion and the circuit board to secure the lens unit on the circuit board.

Abstract: The present invention relates generally to methods of treating cancer with arginine deiminase, and in particular pegylated arginine deiminase.

Abstract: Nonvolatile memory elements that are based on resistive switching memory element layers are provided. A nonvolatile memory element may have a resistive switching metal oxide layer. The resistive switching metal oxide layer may have one or more layers of oxide. A resistive switching metal oxide may be doped with a dopant that increases its melting temperature and enhances its thermal stability. Layers may be formed to enhance the thermal stability of the nonvolatile memory element. An electrode for a nonvolatile memory element may contain a conductive layer and a buffer layer.

Abstract: An optical element package includes an optical wave guide array, at least one optical assembly and at least one optical transmission member. The optical wave guide array has a reflection groove. The reflection groove includes a reflection surface. The at least one optical assembly is positioned on the optical wave guide array adjacent to the reflection surface. The at least one optical transmission member is positioned on the optical wave guide array, and is optically coupled with the reflection surface. The optical signals emitted by the at least one optical assembly are reflected by the reflection surface and then reaching the at least one optical transmission member for transmission.

Abstract: Packaging devices and packaging methods are disclosed. In some embodiments, a method of manufacturing a packaging device includes forming a plurality of through-substrate vias (TSVs) in an interposer substrate. The interposer substrate is recessed or a thickness of the plurality of TSVs is increased to expose portions of the plurality of TSVs. A conductive ball is coupled to the exposed portion of each of the plurality of TSVs.

Abstract: A performance management system, method and a non-transitory computer readable storage medium are disclosed herein. The performance management system includes a value-driven management module and an integrated control module. The value-driven management module includes a value-driven model configuration unit and a value-driven target configuration unit. The value-driven model configuration unit is configured to configure a value-driven model with a plurality of targets, and the targets respond to a plurality of factors. The value-driven target configuration unit is configured to set a goal value for each of the targets. The integrated control module is configured to monitor a performance of a building in accordance with the goal value for each of the targets and the value-driven model.

Abstract: Methods and apparatuses for wafer level packaging (WLP) of semiconductor devices are disclosed. A contact pad of a circuit may be connected to a solder bump by way of a post passivation interconnect (PPI) line and a PPI pad. The PPI pad may comprise a hollow part and an opening. The PPI pad may be formed together with the PPI line as one piece. The hollow part of the PPI pad can function to control the amount of solder flux used in the ball mounting process so that any extra amount of solder flux can escape from an opening of the solid part of the PPI pad. A solder ball can be mounted to the PPI pad directly without using any under bump metal (UBM) as a normal WLP package would need.

Abstract: A bump has a non-metal sidewall spacer on a lower sidewall portion of Cu pillar, and a metal top cap on a top surface and an upper sidewall portion of the Cu pillar. The metal top cap is formed by an electroless or immersion plating technique after the non-metal sidewall spacer formation.

Abstract: A touch panel is provided, which includes a poly(vinylidene fluoride) (PVDF) substrate and a touch electrode structure. The PVDF substrate has two opposite surfaces. The touch electrode structure is at least disposed on one of the surfaces.

Abstract: An optical fiber coupling assembly includes a first optical fiber connector and a second optical fiber connector. The first optical fiber connector includes a first body having a first light incident surface, first optical lenses, first plugs, and second plugs. The first optical lenses, the first plugs, and the second plugs are formed on the first light incident surface. The first optical lenses are positioned between the first plugs, and the first plugs are positioned between the second plugs. The second plugs are longer than the first plugs. The second optical fiber connector includes a second body having a second light incident surface and second optical lenses formed on the second light incident surface. First engaging holes and second engaging holes are defined in the second light incident surface. The first plugs are inserted into the first engaging holes, and the second plugs are inserted into the second engaging holes.

Abstract: A method and system for tracking an ablation catheter and a circumferential mapping catheter in a fluoroscopic image sequence is disclosed. Catheter electrode models for the ablation catheter and the circumferential mapping catheter are initialized in a first frame of a fluoroscopic image sequence based on user inputs. The catheter electrode models for the ablation catheter and the circumferential mapping catheter are then tracked in each remaining frame of the fluoroscopic image sequence. In each remaining frame, candidates of catheter landmarks such as the catheter tip, electrodes and body points are detected for the ablation catheter and the circumferential mapping catheter, tracking hypotheses for the catheter electrode models are generated, and for each of the ablation catheter and the circumferential mapping catheter, the catheter electrode model having the highest probability score is selected from the generated tracking hypotheses.

Abstract: An OLED touch device including at least one OLED and a controller, each of the at least one OLED having: a first substrate; a first electrode located on the first substrate; an organic material structure layer located on the first electrode; a second electrode located on the organic material structure layer; and a second substrate located on the second electrode; wherein, the control unit is used to apply a combined voltage source across the first electrode and the second electrode of at least one of the at least one OLED to provide a light emitting function and/or a touch detection function, wherein the combined voltage source has a DC voltage component and an AC voltage component.