Abstract: An active device substrate and a manufacturing method thereof are provided. The active device substrate includes a substrate, first and second scan lines, a data line, first and second active devices and first and second pixel electrodes. The first active device includes a first semiconductor channel layer, a first gate, a first source and a first drain. The first gate is electrically connected to the first scan line. The first pixel electrode is electrically connected to the first drain. The second active device includes a second semiconductor channel layer, a second gate and a second drain. The first semiconductor channel layer is connected to a source region of the second semiconductor channel layer. The first semiconductor channel layer and the second semiconductor channel layer belong to same layer. The second gate is electrically connected to the second scan line. The second pixel electrode is electrically connected to the second drain.

Abstract: A first dummy gate and a second dummy gate are formed on a substrate with a gap between the first and second dummy gates. The first dummy gate has a first sidewall. The second dummy gate has a second sidewall directly facing the first sidewall. A first sidewall spacer is disposed on the first sidewall. A second sidewall spacer is disposed on the second sidewall. A contact etch stop layer is deposited on the first and second dummy gates and on the first and second sidewall spacers. The contact etch stop layer is subjected to a tilt-angle plasma etching process to trim a corner portion of the contact etch stop layer. An inter-layer dielectric layer is then deposited on the contact etch stop layer and into the gap.

Abstract: A microcontroller unit (MCU) is provided. The MCU includes a reset circuit, a clock circuit, a detection circuit, a counter and a control circuit. The detection circuit detects a first EFT event, and when a first EFT event is detected, the detection circuit generates a first block signal. The counter is coupled to the detection circuit, and when the counter receives the first block signal, the counter starts to count. The control circuit is coupled to the reset circuit, the clock circuit and the counter, and receives the first block signal from the counter. When the control circuit receives the first block signal, the control circuit maintains output signals of the reset circuit and the clock circuit in a prior state, in which the output signals have not been influenced by the first EFT event, until the count number of the counter reaches a default value.

Abstract: A manufacturing method of an array substrate including following steps is provided. A plurality of scan lines are formed on a substrate having a pixel region and a fan-out region. A plurality of data lines are formed. A plurality of transistors are formed and respectively electrically connected to the corresponding scan lines and data lines. A plurality of common electrodes are formed. A plurality of pixel electrodes are formed and respectively electrically connected to the corresponding transistors. A plurality of first fan-out lines, second fan-out lines, and third fan-out lines are formed in the fan-out region. Each of the third fan-out lines includes a transparent conductive layer and an auxiliary conductive layer located on and contacting the transparent conductive layer. The third fan-out lines and the common electrodes are formed by the same photomask.

Abstract: An antenna of reduced size but of multiple functions according to manual adjustment includes a side frame made of metallic material, a feeding portion, and a moving module. The side frame defines first and second gaps each passing through the side frame to form at least one radiating portion. The feeding portion can feed current to either of the radiating portions. The metallic and movable moving module including an extending portion is movable relative to the side frame. In a first position, the extending portion is not connected to any radiating portion, and when moved to a second position, the extending portion is connected to one of the radiating portions.

Abstract: A transistor structure includes a substrate. A gate structure is disposed on the substrate. A hexagonal-shaped trench is disposed in the substrate at one side of the gate structure. A first epitaxial layer including first-type dopants is disposed in the hexagonal-shaped trench and contacts the hexagonal-shaped trench. A second epitaxial layer including second-type dopants is disposed in the hexagon-shaped trench. The first epitaxial layer is outside of the second epitaxial layer. The second epitaxial layer serves as a source/drain doped region of the transistor structure. The first-type dopants and the second-type dopants are of different conductive types.

Abstract: A semiconductor package is provided. The semiconductor package includes a package substrate. The semiconductor package further includes a first chip and a second chip mounted on the package substrate. The thickness of the first chip is different from that of the second chip. In addition, the semiconductor package includes a heat spreader attached on top of the first chip and top of the second chip. A first portion of the heat spreader over the first chip and a second portion of the heat spreader over the second chip have the same thickness.

Abstract: A semiconductor structure is disclosed. The semiconductor structure includes first and second metal gates on a substrate with a gap therebetween. The first metal gate has a first sidewall, and the second metal gate has a second sidewall directly facing the first sidewall. A contact etch stop layer (CESL) is disposed within the gap and extends along the first and second sidewalls. The CESL has a first top portion adjacent to a top surface of the first metal gate and a second top portion adjacent to a top surface of the second metal gate. The first top portion and the second top portion have a trapezoid cross-sectional profile. A first sidewall spacer is disposed on the first sidewall and between the CESL and the first metal gate. A second sidewall spacer is disposed on the second sidewall and between the CESL and the second metal gate.

Abstract: A multiple lens system includes at least one lens unit, at least one reflecting unit, a first image sensing element, a second image sensing element, and a processing unit. The processing unit is electrically connected to the first image sensing element and the second image sensing element. The processing unit controls at least one angle of the at least one reflection unit according to a capturing mode, changes at least one optical path of the at least one reflection unit, and selects at least one lens of the at least one lens unit. At least one image beam obtained by the selected at least one lens is reflected or projected to at least one of the first image sensing element and the second image sensing element through the at least one optical path.

Abstract: A manufacturing method of a recycling nylon fiber includes steps as follows. A nylon fiber waste is provided, wherein the nylon fiber waste is an oiled nylon 6 fiber waste or an oiled nylon 66 fiber waste. A cutting step is performed, wherein a plurality of nylon fiber debris are formed. A washing step is performed, wherein an oil content of the nylon fiber debris is reduced to less than 0.22 wt %. A dehydrating and squeezing step is performed, wherein a plurality of nylon films are formed. A melting and granulating step is performed, wherein a plurality of recycling nylon particles are formed. A melting and spinning step is performed, wherein the recycling nylon fiber is obtained.

Abstract: A microcontroller unit (MCU) is provided. The MCU includes a reset circuit, a clock circuit, a detection circuit, a counter and a control circuit. The detection circuit detects a first EFT event, and when a first EFT event is detected, the detection circuit generates a first block signal. The counter is coupled to the detection circuit, and when the counter receives the first block signal, the counter starts to count. The control circuit is coupled to the reset circuit, the clock circuit and the counter, and receives the first block signal from the counter. When the control circuit receives the first block signal, the control circuit maintains output signals of the reset circuit and the clock circuit in a prior state, in which the output signals have not been influenced by the first EFT event, until the count number of the counter reaches a default value.

Abstract: A manufacturing method of an array substrate including following steps is provided. A plurality of scan lines are formed on a substrate having a pixel region and a fan-out region. A plurality of data lines are formed. A plurality of transistors are formed and respectively electrically connected to the corresponding scan lines and data lines. A plurality of common electrodes are formed. A plurality of pixel electrodes are formed and respectively electrically connected to the corresponding transistors. A plurality of first fan-out lines, second fan-out lines, and third fan-out lines are formed in the fan-out region. Each of the third fan-out lines includes a transparent conductive layer and an auxiliary conductive layer located on and contacting the transparent conductive layer. The third fan-out lines and the common electrodes are formed by the same photomask.

Abstract: An antenna structure able to occupy a very small space in an electronic device includes a metal frame and at least one feed source. The metal frame is metallic, a protruding portion protrudes from a side of the metal frame. The side of the metal frame with the protruding portion defines a first gap and a second gap. The first gap and the second gap divide the metal frame into radiation portions. The at least one feed source is electrically connected to each of the at least two radiation portions and feeds a current to each of the at least two radiation portions.

Abstract: The disclosure provides a storage medium, an expansion base and an operation method thereof combined with a portable electronic device. The portable electronic device is pre-installed with an application program and includes a touch screen. The expansion base is paired with the portable electronic device and accommodates the portable electronic device. When the portable electronic device is accommodated inside the expansion base, a touch window on the surface of the expansion base exposes at least a portion of the touch screen, and the portable electronic device executes the application program to automatically adjust a size or a display position of a display image of the touch screen to correspond to the touch window.

Abstract: A wireless charging device is provided, including an accommodating space, a first coil, a second coil, and a control module. The first coil surrounds the accommodating space, and the second coil is disposed in the accommodating space. The control module is electrically connected to the first coil and the second coil.

Abstract: A laminated structure with an adjustable elastic modulus has multiple connecting elements and at least one connecting point. Each connecting element is an S-shaped curved component, and has an inner end and an outer end. The multiple connecting elements are combined with each other by at least one connecting point, and a diameter of the at least one connecting point is equal to or greater than a diameter of each connecting element connected by the at least one connecting point.

Abstract: A smart lighting device includes a light source module, an image projection module and an ambient light sensing module. The image projection module is pivoted to the light source module, and the ambient light sensing module is electrically connected to the light source module and the image projection module. The ambient light sensing module is configured to sense a brightness value of ambient light. Brightness values of the light source module and the image projection module are adjusted according to the brightness value of the ambient light sensed by the ambient light sensing module. A control method for a smart lighting device is also provided.

Abstract: A projection device includes a projection module and a first camera module. The projection device has a first optical axis and configured to form a projection area, wherein a projection of the first optical axis on an X-Z plane of the projection device is perpendicular to an X-Y plane on which the projection area is formed. The first camera module is disposed on a side of the projection module and includes a second optical axis, wherein the first camera module is configured to form a first shooting area, the second optical axis forms a first angle ??1 with respect to the first optical axis, the projection area at least partially overlaps the first shooting area to form an overlapping area, and the first angle ??1 is a function of a distance between the projection module and the first camera module.