Abstract: Disclosed are a computer-implemented method for generating a data cube from data, a system and a computer program product. The method comprises selecting a candidate granularity from a plurality of candidate granularities determined for a dimension of the data cube, where a data distribution obtained in the selected candidate granularity satisfies a predetermined condition; and generating the data cube based on the selected candidate granularity for the dimension.

Abstract: A noise reduction capacitive touch panel comprises a sensing area, a non-sensing area, a main body, a plurality of driving electrodes, a plurality of driving electrode wires, a plurality of sensing electrodes, a plurality of sensing electrode wires, at least one noise sensing electrodes and at least noise sensing electrode wires. The sensing area is located in the middle of the panel and the rest area of the panel is the non-sensing area. The main body is a flat board having a normal line. The driving electrodes are strip electrodes and disposed on the main body. The driving electrodes are perpendicular to the normal line. The driving electrodes wires are disposed on the main body. The sensing electrodes are strip electrodes and disposed on the main body. Capacitive coupling is occurred between the driving electrodes and the sensing electrodes because there is a distance between them.

Abstract: A standard cell circuit includes a standard cell unit and a first resistive device. The standard cell unit is coupled to at least one resistor. The first resistive device is coupled to the standard cell unit and provides a first current path for a first current to flow through.

Abstract: A system and method for providing a post-passivation opening and undercontact metallization is provided. An embodiment comprises an opening through the post-passivation which has a first dimension longer than a second dimension, wherein the first dimension is aligned perpendicular to a chip's direction of coefficient of thermal expansion mismatch. By shaping and aligning the opening through the post-passivation layer in this fashion, the post-passivation layer helps to shield the underlying layers from stresses generated from mismatches of the materials' coefficient of thermal expansion.

Abstract: Protection device structures and related fabrication methods are provided. An exemplary semiconductor protection device includes a base region of semiconductor material having a first conductivity type, an emitter region within the base region having the opposite conductivity type, and a collector region of semiconductor material having the second conductivity type, wherein at least a portion of the base region resides between the emitter region and the collector region. A depth of the collector region is greater than a depth of the emitter region and less than or equal to a depth of the base region such that a distance between a lateral boundary of the emitter region and a proximal lateral boundary of the collector region is greater than zero and the collector region does not overlap or otherwise underlie the emitter region.

Abstract: Embodiments of the present disclosure include a semiconductor device, a package and methods of forming a semiconductor device and a package. An embodiment is a semiconductor device including a molding material over a first substrate with a first opening having a first width in the molding material. The semiconductor device further includes a second opening having a second width in the molding material with the second width being greater than the first width. A first connector is in the first opening and a second connector is in the second opening.

Abstract: A portable electronic device and a control method thereof are provided. The method is adapted to a portable electronic device including a rotatable element, a fixed element, a screen, a processor, a switch module with at least two protruding elements, and fixed points. The rotatable element is nearby the fixed element. The protruding elements and the fixed points are facing to each other and configured at one and the other of the rotatable element and the fixed element. The processor is coupled to the switch module and the screen. The method includes to display a default user interface corresponding to a default mode on the screen, to determine a corresponding mode according to all press states of each protruding element in the switch module by the processor when the rotatable element is rotated due to an external force applied thereto, and to display a corresponding user interface on the screen.

Abstract: A portable electronic apparatus and an operation method of the portable electronic apparatus are provided. The operation method includes: sensing an angle of a cover relative to a base. The operation method often includes sensing a posture of the cover. In the operation method, a virtual operating function of an optical sensor is enabled based on the angle and the posture.

Abstract: Protection device structures and related fabrication methods are provided. An exemplary semiconductor protection device includes a first base region of semiconductor material having a first conductivity type, a second base region of semiconductor material having the first conductivity type and a dopant concentration that is less than the first base region, a third base region of semiconductor material having the first conductivity type and a dopant concentration that is greater than the second base region, an emitter region of semiconductor material having a second conductivity type opposite the first conductivity type within the first base region, and a collector region of semiconductor material having the second conductivity type. At least a portion of the second base region resides between the third base region and the first base region and at least a portion of the first base region resides between the emitter region and the collector region.

Abstract: Various packages and methods of forming packages are disclosed. In an embodiment, a package includes a hybrid encapsulant encapsulating a chip attached to a substrate. The hybrid encapsulant comprises a first molding compound and a second molding compound that has a different composition than the first molding compound. In another embodiment, a package includes an encapsulant encapsulating a chip attached to a substrate. A surface of the chip is exposed through the encapsulant. The encapsulant comprises a recess in a surface of a first molding compound proximate the surface of the chip. A thermal interface material is on the surface of the chip and in the recess, and a lid is attached to the thermal interface material.

Abstract: The present invention discloses a lateral double diffused metal oxide semiconductor (LDMOS) device and a manufacturing method thereof. The LDMOS device includes: drift region, an isolation oxide region, a first oxide region, a second oxide region, a gate, a body region, a source, and a drain. The isolation oxide region, the first oxide region, and the second oxide region have an isolation thickness, a first thickness, and a second thickness respectively, wherein the second thickness is less than the first thickness. The present invention can reduce a conduction resistance without decreasing a breakdown voltage of the LDMOS device by the first oxidation region and the second oxidation region.

Abstract: A projected capacitive touch panel comprises a touch control integrated circuit, sensing electrodes, driving electrodes, a MCU, a AC signal generator, a sensing bus, and a driving bus. The driving electrodes are made of high resistance material. One driving electrodes is selected by MCU based on firmware program as selected driving electrode. A low voltage AC signal is generated by the AC signal generator. The AC signal is transmitted to the selected driving electrode and its adjacent two driving electrodes via the driving bus. The rest of driving electrodes are connected to a fixed DC level. Providing the same AC signal to three driving electrodes simultaneously can induce higher sensing signal in the sensing electrodes.

Abstract: A touch inductive unit includes a receiving electrode pattern and a driving electrode pattern. The receiving electrode pattern includes a first main stem, a first branch portion and a second branch portion. The first branch portion and the second branch portion are extended from the first main stem. The driving electrode pattern includes a second main stem, a third branch portion and a fourth branch portion. The third branch portion and the fourth branch portion are extended from the second main stem. The receiving electrode pattern and the driving electrode pattern are interdigitated and physically spaced apart from each other.