Abstract: A package structure for packaging a panel module. The panel module comprises at least a gap. The package structure comprises a base and a cover. The base comprises a first loading surface for loading the panel module and at least one first engaging portion corresponding to the gap. The cover comprises a first covering surface and a second engaging portion corresponding to the first engaging portion. The first engaging portion and the second engaging portion connect the first loading surface and the first covering surface.

Abstract: A method of operating an optical module/printer module system through a changer such that either the optical module or the printer module is driven. A first module and a second module is defined such that if the first module is an optical module, the second module is a printer module and if the first module is a printer module, the second module is an optical module. The operating method includes the following steps. In step one, the changer engages with the first module and drives the first module. In step two, the changer rotates so that the changer detaches from the first module and engages with the second module. In step three, the changer drives the second module.

Abstract: A semiconductor packaging substrate and a process for producing the same is disclosed. An internal circuit is formed by lamination. Then, external circuit is formed on the internal circuit by build-up technology. The substrate can be used as a flip-chip ball grid array packaging substrate with high density and small pitch. Furthermore, the substrate of the invention has a plurality of bonding pads thereon. The bump pads are divided into power/ground bump pads, first signal bump pads, and second signal bump pads. The first signal bump pads surround the power/ground bump pads and are surrounded by the second signal bump pads.

Abstract: A chip package includes a coreless package substrate and a chip. The coreless package substrate includes an interconnection structure and a ceramic stiffener. The interconnection structure has a first inner circuit, a carrying surface and a corresponding contact surface. The first inner circuit has multiple contact pads disposed on the contact surface. The ceramic stiffener is disposed on the carrying surface and has a first opening. In addition, the chip is disposed on the carrying surface and within the first opening and electrically connected to at least one of the contact pads.

Abstract: A packaging structure for a container. The packaging structure includes a main frame including a first portion, a second portion and a connecting plate connecting the first and second portions, and a plurality of separators inserted in first and second grooves defined at the first and second portions respectively. The glass substrate is sealed in a loading slot formed by the separators.

Abstract: An optical scanner is provided with a carrier, a casing, a driving unit and a transmission unit. The carrier has a connecting unit and an optical system mounted thereon. The casing has a guiding rail formed as integral unit on the interior wall. The guiding rail has at least a fastener for latching onto the connecting unit of the carrier. The transmission unit links up the driving unit and the carrier. The driving unit drives the transmission unit and then the transmission unit pulls the carrier along the guiding rail through the linkage between the connecting unit and the fastener.

Abstract: The present invention discloses a dense arrangement in the conductors of a package and the corresponding conductive pads of a circuit board. The conductors and the corresponding conductive pads are separated into at least a first group in a peripheral region of the grid array package, and a second group in another region of the grid array package. Most in the first group of conductive pads are apart at a first pitch, most in the second group of conductive pads are apart at a second pitch which is less than the first pitch. According to the shrinking in the conductive trace on a conductive layer and the shrinking in the through hole, the first pitch and the second pitch are optimized for the maximum conductors and the corresponding conductive pads.

Abstract: A chip embedded package structure is provided. A stiffener is disposed on a tape. The tape has at least an alignment mark and the stiffener has at least a chip opening. A chip having a plurality of bonding pads thereon is disposed on the tape within the chip opening such that the bonding pads face the tape. A plurality of through holes is formed in the tape to expose the bonding pads respectively. After that, an electrically conductive material is deposited to fill the through holes and form a plurality of conductive vias that connects with the bonding pads respectively. A multi-layered interconnection structure is formed on the surface of the tape away from the chip. The multi-layered interconnection structure has an inner circuit that connects to the conductive vias. The inner circuit has a plurality of metallic pads disposed on the outer surface of the multi-layered interconnection structure.

Abstract: An optical scanner is provided with a carrier, a casing, a driving unit and a transmission unit. The carrier has a connecting unit and an optical system mounted thereon. The casing has a guiding rail formed as integral unit on the interior wall. The guiding rail has at least a fastener for latching onto the connecting unit of the carrier. The transmission unit links up the driving unit and the carrier. The driving unit drives the transmission unit and then the transmission unit pulls the carrier along the guiding rail through the linkage between the connecting unit and the fastener.

Abstract: A process for fabricating a chip embedded package structure is provided. A stiffener is disposed on a tape. A chip is disposed on the tape inside a chip opening of the stiffener such that an active surface of the chip faces the tape. Through holes are formed passing the tape and exposing bonding pads of the chip on the active surface respectively. Conductive material is deposited into the though holes to form a plurality of conductive vias which are connected to the bonding pads respectively. A multi-layered interconnection structure is formed on the tape on the opposite of the chip, wherein the multi-layered interconnection structure comprises an inner circuit which is connected to the conductive vias, and the inner circuit has a plurality of metallic pads on a surface of the multi-layered interconnection structure away from the tape.

Abstract: A carrier device for a contact image sense optical scanner. The carrier device incorporates a pair of magnets with identical poles facing each other or a fluid filled sealed chamber for exerting an equal pressure on a scanning module within the scanner and maintaining close contact with a document platform throughout a scanning operation.

Abstract: A chip embedded package structure is provided. A stiffener is disposed on a tape. The tape has at least an alignment mark and the stiffener has at least a chip opening. A chip having a plurality of bonding pads thereon is disposed on the tape within the chip opening such that the bonding pads face the tape. A plurality of through holes is formed in the tape to expose the bonding pads respectively. After that, an electrically conductive material is deposited to fill the through holes and form a plurality of conductive vias that connects with the bonding pads respectively. A multi-layered interconnection structure is formed on the surface of the tape away from the chip. The multi-layered interconnection structure has an inner circuit that connects to the conductive vias. The inner circuit has a plurality of metallic pads disposed on the outer surface of the multi-layered interconnection structure.

Abstract: A semiconductor packaging substrate and a process for producing the same is disclosed. An internal circuit is formed by lamination. Then, external circuit is formed on the internal circuit by build-up technology. The substrate can be used as a flip-chip ball grid array packaging substrate with high density and small pitch. Furthermore, the substrate of the invention has a plurality of bonding pads thereon. The bump pads are divided into power/ground bump pads, first signal bump pads, and second signal bump pads. The first signal bump pads surround the power/ground bump pads and are surrounded by the second signal bump pads.

Abstract: A semiconductor packaging substrate and a process for producing the same is disclosed. An internal circuit is formed by lamination. Then, external circuit is formed on the internal circuit by build-up technology. The substrate can be used as a flip-chip ball grid array packaging substrate with high density and small pitch. Furthermore, the substrate of the invention has a plurality of bonding pads thereon. The bump pads are divided into power/ground bump pads, first signal bump pads, and second signal bump pads. The first signal bump pads surround the power/ground bump pads and are surrounded by the second signal bump pads.

Abstract: A carrier device for a contact image sense optical scanner. The carrier device incorporates a pair of magnets with identical poles facing each other or a fluid filled sealed chamber for exerting an equal pressure on a scanning module within the scanner and maintaining close contact with a document platform throughout a scanning operation.

Abstract: A packaging structure for a container. The packaging structure comprises a main frame including a first portion, a second portion and a connecting plate connecting the first and second portions, and a plurality of separators inserted in first and second grooves defined at the first and second portions respectively. The glass substrate is sealed in a loading slot formed by the separators.

Abstract: An optical scanner is provided with a carrier, a casing, a driving unit and a transmission unit. The carrier has a connecting unit and an optical system mounted thereon. The casing has a guiding rail formed as integral unit on the interior wall. The guiding rail has at least a fastener for latching onto the connecting unit of the carrier. The transmission unit links up the driving unit and the carrier. The driving unit drives the transmission unit and then the transmission unit pulls the carrier along the guiding rail through the linkage between the connecting unit and the fastener.

Abstract: A grid array packaged integrated circuit includes a substrate and a chip with a core circuit. The chip is disposed on the substrate. The chip includes I/O devices, bonding pad arranged on the chip in a multi-tier manner surrounding the I/O devices, metal traces and vias on metal layers of the chip for electrically connecting each I/O device and each bonding pad, rings and fingers surrounding the chip on the substrate, and bonding wires for electrically connecting each bonding pad to a corresponding finger or to a corresponding ring. Bonding pads electrically connected to different voltage levels can share the same I/O device.

Abstract: A semiconductor packaging substrate and a process for producing the same is disclosed. An internal circuit is formed by lamination. Then, external circuit is formed on the internal circuit by build-up technology. The substrate can be used as a flip-chip ball grid array packaging substrate with high density and small pitch. Furthermore, the substrate of the invention has a plurality of bonding pads thereon. The bump pads are divided into power/ground bump pads, first signal bump pads, and second signal bump pads. The first signal bump pads surround the power/ground bump pads and are surrounded by the second signal bump pads.

Abstract: A method of operating an optical module/printer module system through a changer such that either the optical module or the printer module is driven. A first module and a second module is defined such that if the first module is an optical module, the second module is a printer module and if the first module is a printer module, the second module is an optical module. The operating method includes the following steps. In step one, the changer engages with the first module and drives the first module. In step two, the changer rotates so that the changer detaches from the first module and engages with the second module. In step three, the changer drives the second module.