Abstract: The present invention is about an apparatus for scanning an object. The apparatus comprises an image capture module having a lens and a sensors array for capturing light after scanning the object. There are light sources comprising a visible light source and an infrared light source. Next, a key module of the present invention is a first translation module connected with the lens and the sensors array. The first translation module is-used for changing a first location of the lens and a second location of the sensors array according to using different the light sources so as to improve some optical characteristics, such as aberration resulting from different wavelengths of light sources. A power module connects with the first translation module and the light sources for supporting energy to the first translation module and the light sources. Moreover, a second translation module connects with the light sources and the image capture module, and the second translation driven by the power module.

Abstract: A semiconductor packaging substrate and a process for producing the same is disclosed. An internal circuit is formed by lamination. Then, external circuit is formed on the internal circuit by build-up technology. The substrate can be used as a flip-chip ball grid array packaging substrate with high density and small pitch. Furthermore, the substrate of the invention has a plurality of bonding pads thereon. The bump pads are divided into power/ground bump pads, first signal bump pads, and second signal bump pads. The first signal bump pads surround the power/ground bump pads and are surrounded by the second signal bump pads.

Abstract: A flip chip die, having a chip with an active surface, a passivation layer, at least one first bump pad and at least one second bump pad. The passivation layer, the first and second bump pads are formed on the active surface, where the first and second bump pads are exposed. The flip chip further has at least one first under ball metallurgy and one second under ball metallurgy formed on the first and the second bump pads, respectively. The contact area between the second under ball metallurgy and the second bump pad is larger than that between the first under ball metallurgy and the first bump pad. In addition, the flip chip has at least one first bump and at least one second bump formed on the first and second under ball metallurgies, respectively.

Abstract: A carrier device for a contact image sense optical scanner. The carrier device incorporates a pair of magnets with identical poles facing each other or a fluid filled sealed chamber for exerting an equal pressure on a scanning module within the scanner and maintaining close contact with a document platform throughout a scanning operation.

Abstract: A grid array package and a method for fabricating the same. The contact pads of the grid array package form three distinct groups: an outer array, a intermediate group, and a center array. The center array is positioned in the center of the package, the intermediate group forms a ring around the center array, and the outer array forms a ring around both the intermediate group and the inner array. The contact pads of the center array connect to ground. Most of the contact pads of the intermediate group connect to power, but selected contact pads of the intermediate group connect to ground. Within the outer array, most of the contact pads connect the integrated circuit to outside circuitry, but selected contact pads of the outer array connect to ground.

Abstract: A grid array packaged integrated circuit includes a substrate and a chip with a core circuit. The chip is disposed on the substrate. The chip includes I/O devices, bonding pad arranged on the chip in a multi-tier manner surrounding the I/O devices, metal traces and vias on metal layers of the chip for electrically connecting each I/O device and each bonding pad, rings and fingers surrounding the chip on the substrate, and bonding wires for electrically connecting each bonding pad to a corresponding finger or to a corresponding ring. Bonding pads electrically connected to different voltage levels can share the same I/O device.

Abstract: An IC tray for carrying IC packages that prevents incorrect placement of IC packages is provided. The tray includes a number of IC cavities used to accommodate the IC packages, with each of the IC packages having been provided with the second direction indicator that corresponds to the first direction indicator that each of the IC cavity has, preventing the IC packages from being placed into the IC tray in wrong directions. The IC tray prevents the users or operators from placing the IC packages into it in wrong directions, therefore effectively improves the convenience and yield rate in the subsequent manufacturing processes.

Abstract: A grid array package and a method for fabricating the same. The contact pads of the grid array package form three distinct groups: an outer array, a intermediate group, and a center array. The center array is positioned in the center of the package, the intermediate group forms a ring around the center array, and the outer array forms a ring around both the intermediate group and the inner array. The contact pads of the center array connect to ground. Most of the contact pads of the intermediate group connect to power, but selected contact pads of the intermediate group connect to ground. Within the outer array, most of the contact pads connect the integrated circuit to outside circuitry, but selected contact pads of the outer array connect to ground.

Abstract: An IC tray for carrying IC packages that prevents incorrect placement of IC packages is provided. The tray includes a number of IC cavities used to accommodate the IC packages, with each of the IC packages having been provided with the second direction indicator that corresponds to the first direction indicator that each of the IC cavity has, preventing the IC packages from being placed into the IC tray in wrong directions. The IC tray prevents the users or operators from placing the IC packages into it in wrong directions, therefore effectively improves the convenience and yield rate in the subsequent manufacturing processes.

Abstract: A foldable chair includes a support member formed by two intersecting frame members. A backrest member and a seat member are disposed on the frame members at a determined angle. A shaft passes through ends of the backrest member and the seat member that intersect, and also passes through the intersecting ends of the frame members. The distal end of the seat member has a closable connecting element fixedly provided thereon. The other end of the connecting element passes around the backrest member and the support member to be secured on the frame members. Furthermore, the distal end of the seat member that is not pivotally connected to the shaft and the frame member opposed thereto are provided with inter-engageable retaining elements. In use, the seat member, backrest member and the support member are erected and extended on the floor with a determined shape due to limited posed by the connecting element and the retaining elements.