Abstract: A photographic apparatus includes an image sensor, a processing unit, a light emitting unit, and a control unit. The image sensor is configured to capture a continuous image, and generate an exposure signal according to an exposure sequence corresponding to the continuous image. The processing unit is electrically connected to the image sensor and is configured to calculate an exposure value according to the continuous image. The control unit is electrically connected to the image sensor, the processing unit, and the light emitting unit. According to the exposure value, the control unit may select a continuous mode to drive the light emitting unit to emit light continuously, or a pulse mode to cooperate with the exposure signal to drive the light emitting unit to pulse light, in order to fill light while capturing the continuous image.

Abstract: A camera using an automatically depth-of-field adjusting method includes a camera lens, a diaphragm, a light-sensing part, and a controller. The light-sensing part can receive visible light of a first wave band and invisible light of a second wave band. The controller performs an adjusting procedure, according to which the controller measures a first light intensity of ambient light of a scene relative to the first wave band and a second light intensity of the ambient light relative to the second wave band, and when the controller determines that a ratio of a different between the first intensity and the second intensity to a sum of the first intensity and the second intensity is less than a predetermined value, controls the diaphragm to adjust an aperture of the diaphragm according to a current focal length of the camera lens.

Abstract: A probe card including a circuit board, a transformer, a probe head, and a reinforcement structure is provided. The transformer including a body, a plurality of solder balls, and a plurality of first contact points are disposed on the substrate. The body has a first surface and a second surface, wherein the first surface is located between the circuit board and the second surface. The solder balls are disposed on the first surface, and the first contact points are disposed on the second surface. The probe head is disposed on the second surface. The probe head is electrically connected to the circuit board by the first solder balls. The reinforcement structure is disposed between the probe head and the circuit board.

Abstract: A mobile device includes a metal back cover and a printed circuit board. The metal back cover has a slot. The printed circuit board includes a dielectric substrate, a first metal element, a second metal element, and via elements. The first metal element is disposed on a top surface of the dielectric substrate. The second metal element is disposed on a bottom surface of the dielectric substrate. The via elements are formed in the dielectric substrate, and are coupled between the first metal element and the second metal element. The first metal element is coupled to the metal back cover, such that a slot antenna is formed by the printed circuit board and the slot of the metal back cover. The slot antenna is excited by a signal source which is coupled to the second metal element.

Abstract: A light source control method is applied to a camera apparatus including a device body, a plurality of image capturers movably disposed on the device body, and a plurality of light sources disposed around the device body. The light source control method includes each image capturer capturing an uncompensated image toward a target region respectively when each light source is turned off, turning on the plurality of light sources by turns, each image capturer capturing a practical image toward the target region when each light source is turned on by turns, and comparing image reference values of the practical images captured by the plurality of image capturers when each light source is turned on by turns with image reference values of the corresponding uncompensated images respectively for controlling turning on or off of each light source respectively.

Abstract: An electronic structure is provided with a redistribution structure and the following elements. A first supporting structure has a first opening and is disposed on a first surface of the redistribution structure. A second supporting structure has a second opening and is disposed on a second surface of the redistribution structure opposite to the first surface. A first bonding protruding portions are disposed on the first surface of the redistribution structure and located in the first opening. A second bonding protruding portions are disposed on the second surface of the redistribution structure and located in the second opening. A first encapsulated material is filled between the first opening and the first bonding protruding portions. A second encapsulated material is filled between the second opening and the second bonding protruding portions. An electronic structure array is also provided.

Abstract: A network camera system includes a network camera and an illumination device. The illumination device is connected to the network camera. The illumination device includes an illumination unit and a processing unit. The illumination unit is used for providing illumination light to the network camera. The processing unit is connected to the illumination unit for detecting a practical operation power of the network camera, calculating a maximum illumination power according to an electrical power received by the illumination device and the practical operation power, and transmitting the practical operation power and the maximum illumination power to the network camera and the illumination unit respectively.

Abstract: A control method, suitable for an electronic device, includes following operations. A first connection is established based on a classic Bluetooth protocol or a Bluetooth Low Energy protocol from the electronic device to a first target device. A Bluetooth identifier of the first target device acquired in the first connection is recorded. The Bluetooth identifier of the first target device is shared. The Bluetooth identifier is utilized to establish a second connection based on the classic Bluetooth protocol or the Bluetooth Low Energy protocol to the first target device. The first connection and the second connection are established based on different protocols.

Abstract: An electronic structure is provided with a redistribution structure and the following elements. A first supporting structure has a first opening and is disposed on a first surface of the redistribution structure. A second supporting structure has a second opening and is disposed on a second surface of the redistribution structure opposite to the first surface. A first bonding protruding portions are disposed on the first surface of the redistribution structure and located in the first opening. A second bonding protruding portions are disposed on the second surface of the redistribution structure and located in the second opening. A first encapsulated material is filled between the first opening and the first bonding protruding portions. A second encapsulated material is filled between the second opening and the second bonding protruding portions. An electronic structure array is also provided.

Abstract: A door closer device for driving a door to a predetermined closed position includes an adjustment mechanism and a door closer which is integrated with the door. The adjustment mechanism includes a base, an adjusting plate and at least one fixing element, wherein the adjusting plate is stacked with the base and coupled with the door closer. The adjusting plate and the base respectively include at least one adjusting bore, and the adjusting bores are corresponding with each other. One of the adjusting bores includes a first limiting end and a second limiting end, and a first moving path is defined between the first and second limiting ends. The fixing element is disposed in the adjusting bores and can move along the first moving path to fix the adjusting plate on the base.

Abstract: A chip package array including a plurality of chip packages is provided. The chip packages are suitable for array arrangement to form the chip package array. Each of the chip packages includes a redistribution structure, a supporting structure, a chip, and an encapsulated material. The supporting structure is disposed on the redistribution structure and has an opening. The chip is disposed on the redistribution structure and located in the opening. The encapsulated material is located between the opening and the chip, wherein the encapsulated material is filled between the opening and the chip, and the chip and the supporting structure are respectively connected to the redistribution structure.

Abstract: An electronic structure process includes the following steps. A redistribution structure and a carrier plate are provided. A plurality of first bonding protruding portions and a first supporting structure are formed on the redistribution structure. A first encapsulated material is formed and filled between a first opening and the first bonding protruding portions. The carrier plate is removed. A plurality of second bonding protruding portions and a second supporting structure are formed on the redistribution structure. A second encapsulated material is formed and filled between a second opening and the second bonding protruding portions.

Abstract: A chip package process includes the following steps. A supporting structure and a carrier plate are provided. The supporting structure has a plurality of openings. The supporting structure is disposed on the carrier plate. A plurality of chips is disposed on the carrier plate. The chips are respectively located in the openings of the supporting structure. An encapsulated material is formed to cover the supporting structure and the chips. The supporting structure and the chips are located between the encapsulated material and the carrier plate. The encapsulated material is filled between the openings and the chips. The carrier plate is removed. A redistribution structure is disposed on the supporting structure, wherein the redistribution structure is connected to the chips.

Abstract: An electronic structure process includes the following steps. A redistribution structure and a carrier plate are provided. A plurality of first bonding protruding portions and a first supporting structure are formed on the redistribution structure. A first encapsulated material is formed and filled between a first opening and the first bonding protruding portions. The carrier plate is removed. A plurality of second bonding protruding portions and a second supporting structure are formed on the redistribution structure. A second encapsulated material is formed and filled between a second opening and the second bonding protruding portions.

Abstract: A flip-chip light emitting diode chip includes a first semiconductor structure, which includes a P-type semiconductor layer, a N-type semiconductor layer, openings, a reflective layer, a barrier layer, a passivation layer, and an electrical contact layer. The openings penetrate the P-type semiconductor layer and a part of the N-type semiconductor layer so as to partially expose the N-type semiconductor layer. The reflective layer is disposed on the P-type semiconductor layer. The barrier layer is disposed on the reflective layer, and the area of the barrier layer is smaller than that of the reflective layer therefore the reflective layer is exposed from the barrier layer. The passivation layer is disposed on the barrier layer and partially fills in the openings. The electrical contact layer disposed on the passivation layer partially penetrates through the passivation layer to contact the exposed part of the N-type semiconductor layer.

Abstract: A safety belt buckle includes a base unit, a driving unit mounted on the base unit, and a torque device mounted on the driving unit. The base unit is provided with a plurality of insertion slots, a rotation shaft, and a positioning portion. The driving unit includes a circular cap and a driving handle. The torque device includes a ring, two balls, two compression springs and a fixed plate. In practice, when the driving handle is driven by a user, the circular cap is rotated to operate the two compression springs which press the two balls to increase a resistance to the circular cap, and to obstruct rotation of the driving unit, thereby preventing the driving unit from being driven freely by an external force.

Abstract: The present invention discloses a pharmaceutical composition of treating multidrug resistance cancer, comprising a citrus methoxyflavone and a chemotherapeutic drug, in which the citrus methoxyflavone is nobiletin. A method of treating multidrug resistance cancer comprising administrating citrus methoxyflavone and a chemotherapeutic drug is also disclosed.

Abstract: The present invention discloses a pharmaceutical composition of treating multidrug resistance cancer, comprising a citrus methoxyflavone and a chemotherapeutic drug, in which the citrus methoxyflavone is tangeretin. A method of treating multidrug resistance cancer comprising administrating citrus methoxyflavone and a chemotherapeutic drug is also disclosed.

Abstract: Disclosed are a fusion cage for a spinal surgery and a clamping device thereof. The fusion cage comprises a fusion cage body (1) and a triangular screw plate (2). A limiting groove (12) fit with the clamping device is provided at a rear end surface of the fusion cage body (1), the fusion cage body (1) is hinged with the screw plate (2), and each of three corners of the screw plate (2) is provided with a screw hole (23). The clamping device comprises two clamping rods (4) which are fit with each other, and a front end of each clamping rod (4) is provided with a clamping head (41), wherein each of face-to-face sides of the clamping heads (41) is provided with a limiting protrusion (42), a front end of each clamping head (41) is capable of being inserted into the limiting groove (12) of the fusion cage body (1), and the limiting protrusion (42) is capable of being clamped at a front side surface of the screw plate (2).

Abstract: A light source assembly comprises a base body and at least one light source module. The base body comprises a first and a second bearing base connected to each other. The first bearing base is configured for an image capture module to be disposed thereon. The second bearing base is located on the periphery of the first bearing base. The at least one light source module is slidably disposed on the second bearing base, and movable toward and away from the first bearing base. The at least one light source module forms an adjustable space. The adjustable space is configured for receiving the image capture module. The first bearing base has a first bearing surface configured for the image capture module to be disposed thereon. A sliding direction of the at least one light source module is not parallel to a normal direction of the first bearing surface.