Abstract: A semiconductor test apparatus includes a test chamber, a chuck and a refrigeration element. The chuck is arranged in the test chamber to fix a semiconductor element to be tested. The refrigeration element is connected to the test chamber to reduce a chamber ambient temperature of the test chamber from a first temperature to a second temperature. The foregoing semiconductor test apparatus is able to reduce the chamber ambient temperature of the test chamber to be equal to or lower than the specified test temperature.

Abstract: An active wafer prober preheat-precool system comprises a wafer loading unit used to load at least one wafer; a probe card disposed corresponding to the wafer loading unit and used to test the wafer; a carrying mechanism including a central connector corresponding to the wafer loading unit and having a first opening, wherein the probe card is connected with the central connector and faces the wafer loading unit through the first opening; a peripheral connector having a second opening, wherein the central connector is detachably disposed inside the second opening; and a first temperature regulation unit disposed in the peripheral connector; and a control unit electrically connected with the first temperature regulation unit and controlling the first temperature regulation unit to adjust the temperature of the peripheral connector. The present invention also discloses a method for testing wafers.

Abstract: A probe card including a circuit board, a transformer, a probe head, and a reinforcement structure is provided. The transformer including a body, a plurality of solder balls, and a plurality of first contact points are disposed on the substrate. The body has a first surface and a second surface, wherein the first surface is located between the circuit board and the second surface. The solder balls are disposed on the first surface, and the first contact points are disposed on the second surface. The probe head is disposed on the second surface. The probe head is electrically connected to the circuit board by the first solder balls. The reinforcement structure is disposed between the probe head and the circuit board.

Abstract: A driving module for a display device includes a first driving unit, for generating a plurality of data driving signals to a plurality of data lines of the display device according to a first control signal; and a control unit, for generating the first control signal to the first driving unit and a second control signal to a second driving unit of the display device; wherein the control unit controls the second driving unit to generate a plurality of gate driving signals to a plurality of scan lines of the display device via the second control signal, and durations of a plurality of gate enable periods in the plurality of gate driving signals are different.

Abstract: A method for reducing abnormalities in lipid metabolism and for reducing inflammation in a subject suffering from an autoimmune inflammatory disease accompanied by abnormalities in lipid metabolism includes administering an effective amount of a flavonolignan to the subject. The subject may additionally suffer from a liver disease, obesity, hypertension, diabetes mellitus or a metabolic syndrome. Further provided is a method for reducing the risk of a cardiovascular disease in a subject suffering from an autoimmune inflammatory disease accompanied by abnormalities in lipid metabolism and a method for reducing hepatic abnormalities and reducing inflammation in a subject suffering from an autoimmune inflammatory disease accompanied by hepatic abnormalities. Still further provided is a method for reducing liver damages associated with the treatment of rheumatoid arthritis with a disease-modifying antirheumatic drug or a non-steroidal anti-inflammatory drug.

Abstract: A photographic apparatus includes an image sensor, a processing unit, a light emitting unit, and a control unit. The image sensor is configured to capture a continuous image, and generate an exposure signal according to an exposure sequence corresponding to the continuous image. The processing unit is electrically connected to the image sensor and is configured to calculate an exposure value according to the continuous image. The control unit is electrically connected to the image sensor, the processing unit, and the light emitting unit. According to the exposure value, the control unit may select a continuous mode to drive the light emitting unit to emit light continuously, or a pulse mode to cooperate with the exposure signal to drive the light emitting unit to pulse light, in order to fill light while capturing the continuous image.

Abstract: A camera using an automatically depth-of-field adjusting method includes a camera lens, a diaphragm, a light-sensing part, and a controller. The light-sensing part can receive visible light of a first wave band and invisible light of a second wave band. The controller performs an adjusting procedure, according to which the controller measures a first light intensity of ambient light of a scene relative to the first wave band and a second light intensity of the ambient light relative to the second wave band, and when the controller determines that a ratio of a different between the first intensity and the second intensity to a sum of the first intensity and the second intensity is less than a predetermined value, controls the diaphragm to adjust an aperture of the diaphragm according to a current focal length of the camera lens.

Abstract: A probe card including a circuit board, a transformer, a probe head, and a reinforcement structure is provided. The transformer including a body, a plurality of solder balls, and a plurality of first contact points are disposed on the substrate. The body has a first surface and a second surface, wherein the first surface is located between the circuit board and the second surface. The solder balls are disposed on the first surface, and the first contact points are disposed on the second surface. The probe head is disposed on the second surface. The probe head is electrically connected to the circuit board by the first solder balls. The reinforcement structure is disposed between the probe head and the circuit board.

Abstract: A mobile device includes a metal back cover and a printed circuit board. The metal back cover has a slot. The printed circuit board includes a dielectric substrate, a first metal element, a second metal element, and via elements. The first metal element is disposed on a top surface of the dielectric substrate. The second metal element is disposed on a bottom surface of the dielectric substrate. The via elements are formed in the dielectric substrate, and are coupled between the first metal element and the second metal element. The first metal element is coupled to the metal back cover, such that a slot antenna is formed by the printed circuit board and the slot of the metal back cover. The slot antenna is excited by a signal source which is coupled to the second metal element.

Abstract: A light source control method is applied to a camera apparatus including a device body, a plurality of image capturers movably disposed on the device body, and a plurality of light sources disposed around the device body. The light source control method includes each image capturer capturing an uncompensated image toward a target region respectively when each light source is turned off, turning on the plurality of light sources by turns, each image capturer capturing a practical image toward the target region when each light source is turned on by turns, and comparing image reference values of the practical images captured by the plurality of image capturers when each light source is turned on by turns with image reference values of the corresponding uncompensated images respectively for controlling turning on or off of each light source respectively.

Abstract: An electronic structure is provided with a redistribution structure and the following elements. A first supporting structure has a first opening and is disposed on a first surface of the redistribution structure. A second supporting structure has a second opening and is disposed on a second surface of the redistribution structure opposite to the first surface. A first bonding protruding portions are disposed on the first surface of the redistribution structure and located in the first opening. A second bonding protruding portions are disposed on the second surface of the redistribution structure and located in the second opening. A first encapsulated material is filled between the first opening and the first bonding protruding portions. A second encapsulated material is filled between the second opening and the second bonding protruding portions. An electronic structure array is also provided.

Abstract: A network camera system includes a network camera and an illumination device. The illumination device is connected to the network camera. The illumination device includes an illumination unit and a processing unit. The illumination unit is used for providing illumination light to the network camera. The processing unit is connected to the illumination unit for detecting a practical operation power of the network camera, calculating a maximum illumination power according to an electrical power received by the illumination device and the practical operation power, and transmitting the practical operation power and the maximum illumination power to the network camera and the illumination unit respectively.

Abstract: A control method, suitable for an electronic device, includes following operations. A first connection is established based on a classic Bluetooth protocol or a Bluetooth Low Energy protocol from the electronic device to a first target device. A Bluetooth identifier of the first target device acquired in the first connection is recorded. The Bluetooth identifier of the first target device is shared. The Bluetooth identifier is utilized to establish a second connection based on the classic Bluetooth protocol or the Bluetooth Low Energy protocol to the first target device. The first connection and the second connection are established based on different protocols.

Abstract: A door closer device for driving a door to a predetermined closed position includes an adjustment mechanism and a door closer which is integrated with the door. The adjustment mechanism includes a base, an adjusting plate and at least one fixing element, wherein the adjusting plate is stacked with the base and coupled with the door closer. The adjusting plate and the base respectively include at least one adjusting bore, and the adjusting bores are corresponding with each other. One of the adjusting bores includes a first limiting end and a second limiting end, and a first moving path is defined between the first and second limiting ends. The fixing element is disposed in the adjusting bores and can move along the first moving path to fix the adjusting plate on the base.

Abstract: An electronic structure is provided with a redistribution structure and the following elements. A first supporting structure has a first opening and is disposed on a first surface of the redistribution structure. A second supporting structure has a second opening and is disposed on a second surface of the redistribution structure opposite to the first surface. A first bonding protruding portions are disposed on the first surface of the redistribution structure and located in the first opening. A second bonding protruding portions are disposed on the second surface of the redistribution structure and located in the second opening. A first encapsulated material is filled between the first opening and the first bonding protruding portions. A second encapsulated material is filled between the second opening and the second bonding protruding portions. An electronic structure array is also provided.

Abstract: A chip package array including a plurality of chip packages is provided. The chip packages are suitable for array arrangement to form the chip package array. Each of the chip packages includes a redistribution structure, a supporting structure, a chip, and an encapsulated material. The supporting structure is disposed on the redistribution structure and has an opening. The chip is disposed on the redistribution structure and located in the opening. The encapsulated material is located between the opening and the chip, wherein the encapsulated material is filled between the opening and the chip, and the chip and the supporting structure are respectively connected to the redistribution structure.

Abstract: A chip package process includes the following steps. A supporting structure and a carrier plate are provided. The supporting structure has a plurality of openings. The supporting structure is disposed on the carrier plate. A plurality of chips is disposed on the carrier plate. The chips are respectively located in the openings of the supporting structure. An encapsulated material is formed to cover the supporting structure and the chips. The supporting structure and the chips are located between the encapsulated material and the carrier plate. The encapsulated material is filled between the openings and the chips. The carrier plate is removed. A redistribution structure is disposed on the supporting structure, wherein the redistribution structure is connected to the chips.

Abstract: An electronic structure process includes the following steps. A redistribution structure and a carrier plate are provided. A plurality of first bonding protruding portions and a first supporting structure are formed on the redistribution structure. A first encapsulated material is formed and filled between a first opening and the first bonding protruding portions. The carrier plate is removed. A plurality of second bonding protruding portions and a second supporting structure are formed on the redistribution structure. A second encapsulated material is formed and filled between a second opening and the second bonding protruding portions.

Abstract: An electronic structure process includes the following steps. A redistribution structure and a carrier plate are provided. A plurality of first bonding protruding portions and a first supporting structure are formed on the redistribution structure. A first encapsulated material is formed and filled between a first opening and the first bonding protruding portions. The carrier plate is removed. A plurality of second bonding protruding portions and a second supporting structure are formed on the redistribution structure. A second encapsulated material is formed and filled between a second opening and the second bonding protruding portions.

Abstract: A flip-chip light emitting diode chip includes a first semiconductor structure, which includes a P-type semiconductor layer, a N-type semiconductor layer, openings, a reflective layer, a barrier layer, a passivation layer, and an electrical contact layer. The openings penetrate the P-type semiconductor layer and a part of the N-type semiconductor layer so as to partially expose the N-type semiconductor layer. The reflective layer is disposed on the P-type semiconductor layer. The barrier layer is disposed on the reflective layer, and the area of the barrier layer is smaller than that of the reflective layer therefore the reflective layer is exposed from the barrier layer. The passivation layer is disposed on the barrier layer and partially fills in the openings. The electrical contact layer disposed on the passivation layer partially penetrates through the passivation layer to contact the exposed part of the N-type semiconductor layer.