Patents by Inventor Wen Zhou

Wen Zhou has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Electronic system with heat dissipation device
    Patent number: 7990719
    Abstract: A heat dissipation device is provided for dissipating heat generated by electronic components mounted on a printed circuit board in an electronic system. The electronic components have different heights. The heat dissipation device includes a connecting plate, at least two elastic members mounted on the connecting plate, and a heat sink having a substrate mounted on the connecting plate and located above one of the electronic components. A number of joining members extend through the printed circuit board and engage with the substrate to attach the substrate on the one electronic component on the printed circuit board. A distance between the substrate and the connecting plate is adjustable by adjusting the joining members to make the substrate intimately contact the one electronic component.
    Type: Grant
    Filed: November 2, 2009
    Date of Patent: August 2, 2011
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Guo Chen, Shi-Wen Zhou, Chun-Chi Chen
  • Heat dissipation device
    Patent number: 7983043
    Abstract: A heat dissipation device includes a heat sink and a pair of heat pipes fixed to the heat sink. The heat sink includes a rectangular post, four branches extending outwardly from four corners of the post, respectively, and a plurality of fins extending between the branches. Each heat pipe includes an evaporating section attached to a bottom of the post, a condensing section parallel to the evaporation section and attached to a top of the post, and an adiabatic section interconnecting the evaporating section and the condensing section. A block is secured to bottoms of the condensing sections of the heat pipes.
    Type: Grant
    Filed: July 24, 2009
    Date of Patent: July 19, 2011
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Shou-Biao Xu, Guo Chen, Shi-Wen Zhou
  • Heat dissipation device
    Patent number: 7967059
    Abstract: A heat dissipation device includes a base, a fin group, a plurality of heat pipes connecting the base and the fin group, a fan cover covering the fin group and a fan located at a side of the fan cover. The heat pipes are received in the base and extend through the fin group. The heat pipes are received in two opposite sides of the fin group and sandwiched between the fan cover and the fin group. The fan cover includes a body and a pair of side walls extending from the body. The side walls each include a plurality of heat-dissipating fins formed on an outer surface thereof for increasing heat dissipating surface of the heat dissipating device.
    Type: Grant
    Filed: September 30, 2008
    Date of Patent: June 28, 2011
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Yi-Jiun Li, Shi-Wen Zhou, Chun-Chi Chen
  • Apparatus and method for policy routing
    Patent number: 7957375
    Abstract: An apparatus and method for policy routing is provided. The method includes: A. configuring a policy routing to a label switching path and obtaining and saving forwarding information; and B. performing packet forwarding based on the forwarding information.
    Type: Grant
    Filed: October 23, 2008
    Date of Patent: June 7, 2011
    Assignee: Huawei Technologies Co., Ltd.
    Inventors: Yongle Sun, Xia Chen, Wen Zhou
  • HEAT DISSIPATION DEVICE WITH HEAT PIPE
    Publication number: 20110094711
    Abstract: An exemplary heat dissipation device dissipating heat generated by an electronic element mounted on a printed circuit board includes a supporter, a heat conducting base, a first fin assembly and a heat pipe. The heat conducting base is securely attached to a bottom side of the supporter and thermally contacting the electronic element. The first fin assembly is securely attached to a top side of the supporter. The heat pipe includes an evaporator sandwiched between the supporter and the heat conducting base, and a condenser extending through the supporter and extending in the first fin assembly.
    Type: Application
    Filed: January 15, 2010
    Publication date: April 28, 2011
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: GUO CHEN, SHI-WEN ZHOU, CHUN-CHI CHEN
  • Programmable interconnect network for logic array
    Patent number: 7928764
    Abstract: A programmable interconnect network for an array of logic cells. Said interconnect network has a plurality of switch boxes being connected in a tree structure and providing connections to its logic cells, switch boxes located at the lowest level of the tree structure are connected to logic cells; said interconnect network also has peripheral switch boxes, of which at least one is connected to an external logic. Also, an integrated circuit comprising an FP array of logic cells connected by the said programmable interconnect network and a mask programmable (MP) logic array.
    Type: Grant
    Filed: August 31, 2006
    Date of Patent: April 19, 2011
    Assignee: Agate Logic (Beijing), Inc.
    Inventors: John Jun Yu, Fungfung Lee, Wen Zhou
  • HEAT DISSIPATION DEVICE
    Publication number: 20110083830
    Abstract: An exemplary heat dissipation device includes a base, a first heat sink mounted over the base and connected to the base via two first heat pipes, and a second heat sink located at a lateral side of the first heat sink and thermally connected to the base via a second heat pipe. The first heat sink includes two fin groups. One of the fin groups is stacked on the other fin group. Each of the fin groups includes a plurality of fins spreading radially from a center of the fin group to a periphery of the fin group along horizontal directions.
    Type: Application
    Filed: December 21, 2009
    Publication date: April 14, 2011
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: SHOU-BIAO XU, GUO CHEN, SHI-WEN ZHOU, CHUN-CHI CHEN
  • METHOD AND APPARATUS FOR POSITIONING SUBSCRIBER ZONE
    Publication number: 20110086633
    Abstract: A method and apparatus for positioning a subscriber zone. The method includes: receiving a zone positioning request sent by a subscriber, collecting position sample points of the subscriber; and acquiring a cell list of the subscriber zone according to the position sample points of the subscriber. The apparatus includes: a collection module for receiving a zone positioning request sent by a subscriber, and collecting position sample points of the subscriber; an acquisition module for acquiring a cell list of the subscriber zone according to the position sample points of the subscriber collected by the collection module. Positioning the subscriber zone by collecting the position sample points of the subscriber, improves the accuracy and operability of subscriber zone positioning.
    Type: Application
    Filed: December 17, 2010
    Publication date: April 14, 2011
    Applicant: HUAWEI TECHNOLOGIES CO., LTD.
    Inventor: Wen ZHOU
  • Heat dissipation device
    Patent number: 7916469
    Abstract: A heat dissipation device adapted for cooling an electronic device mounted on a printed circuited board includes a heat spreader thermally contacting the electronic device, a fin assembly comprising a plurality of fins, a first heat pipe interconnecting the fin assembly and the heat spreader and a plurality of supporting posts inserted in the fin assembly.
    Type: Grant
    Filed: May 7, 2009
    Date of Patent: March 29, 2011
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Shi-Wen Zhou, Jun Cao, Qing-Song Xu, Chun-Chi Chen
  • Integrated circuit with improved logic cells
    Patent number: 7915917
    Abstract: The present invention provides integrated circuits with improved logic cells. In one embodiment, an integrated circuit having a plurality of logic cells (LC) is provided, each LC comprising: a lookup table having a LUT output terminal; and, a first multiplexer; wherein, a first multiplexer input terminal is connected to of a first input terminal of the LC, a second multiplexer input terminal is connected to the LUT output terminal, a multiplexer output terminal is connected to a first output terminal of the LC, and a multiplexer select terminal is connected to a second input terminal of the LC so as to select which of the signals appearing at the first and second multiplexer input terminal to pass through; wherein, by coupling in chain the first input terminal of one LC to the first output terminal of another LC, a WLUT chain is formed.
    Type: Grant
    Filed: April 2, 2010
    Date of Patent: March 29, 2011
    Assignee: Agate Logic (Beijing), Inc.
    Inventors: Fung Fung Lee, Wen Zhou
  • Integrated circuit with improved logic cells
    Patent number: 7911228
    Abstract: The present invention provides integrated circuits with improved logic cells. In one embodiment, an integrated circuit having a plurality of logic cells (LC) is provided, each LC comprising: a lookup table having a LUT output terminal; and, a first multiplexer; wherein, a first multiplexer input terminal is connected to of a first input terminal of the LC, a second multiplexer input terminal is connected to the LUT output terminal, a multiplexer output terminal is connected to a first output terminal of the LC, and a multiplexer select terminal is connected to a second input terminal of the LC so as to select which of the signals appearing at the first and second multiplexer input terminal to pass through; wherein, by coupling in chain the first input terminal of one LC to the first output terminal of another LC, a WLUT chain is formed.
    Type: Grant
    Filed: April 2, 2010
    Date of Patent: March 22, 2011
    Assignee: Agate Logic (Beijing), Inc.
    Inventors: Fung Fung Lee, Wen Zhou
  • ELECTRONIC SYSTEM WITH HEAT DISSIPATION DEVICE
    Publication number: 20110063802
    Abstract: A heat dissipation device is provided for dissipating heat generated by electronic components mounted on a printed circuit board in an electronic system. The electronic components have different heights. The heat dissipation device includes a connecting plate, at least two elastic members mounted on the connecting plate, and a heat sink having a substrate mounted on the connecting plate and located above one of the electronic components. A number of joining members extend through the printed circuit board and engage with the substrate to attach the substrate on the one electronic component on the printed circuit board. A distance between the substrate and the connecting plate is adjustable by adjusting the joining members to make the substrate intimately contact the one electronic component.
    Type: Application
    Filed: November 2, 2009
    Publication date: March 17, 2011
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: GUO CHEN, SHI-WEN ZHOU, CHUN-CHI CHEN
  • HEAT DISSIPATION DEVICE
    Publication number: 20110048681
    Abstract: An exemplary heat dissipation device includes a connecting plate, a first heat sink, a second heat sink, and a second flattened heat pipe. The first heat sink includes a substrate mounted on a bottom of the connecting plate and a plurality of cylindrical pins inserted in the connecting plate and contacting the substrate. The second heat sink includes a heat spreader and a plurality of rectangular solid fins integrally extending from the heat spreader. The heat spreader engages in the connecting plate. The heat pipe thermally connects the substrate of the first heat sink and the second heat spreader of the second heat sink.
    Type: Application
    Filed: November 17, 2009
    Publication date: March 3, 2011
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: GUO CHEN, SHI-WEN ZHOU, CHUN-CHI CHEN
  • HEAT SINK
    Publication number: 20110048675
    Abstract: A heat sink includes a plurality of first fins and a plurality of second fins. Each first fin and each second fin includes an inner end and an outer end opposite to the inner end, respectively. Each of the second fins is sandwiched between two respective adjacent first fins. The inner end of each of the first fins is engagingly received in the inner end of the previous adjacent first fin, sandwiching the inner end of a corresponding second fin therebetween. The outer end of each of the first fins is engagingly received in the outer end of the previous adjacent second fin, and the outer end of each of the second fins is engagingly received in the outer end of the previous adjacent first fin.
    Type: Application
    Filed: November 17, 2009
    Publication date: March 3, 2011
    Applicants: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Shou-Biao Xu, Shi-Wen Zhou, Chun-Chi Chen
  • Heat sink and method of manufacturing the same
    Patent number: 7898809
    Abstract: A heat sink includes a base plate and a plurality of cylindrical pins extending upwardly from the base plate. The cylindrical pins each include an upper dissipating portion, a lower mounting portion, and an engaging portion between the dissipating portion and the mounting portion. The mounting portion is interferentially fitted in a lower part of a corresponding aperture of the base plate. The engaging portion has a diameter smaller than that of the mounting portion. The engaging portion is cramped by an interior wall of the base plate defining an upper part of the corresponding aperture of the base plate by punching an upper surface of the base plate downwardly at a rim of the corresponding aperture.
    Type: Grant
    Filed: October 16, 2008
    Date of Patent: March 1, 2011
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Yi-Jiun Li, Peng Liu, Shi-Wen Zhou, Chun-Chi Chen
  • Heat dissipation device having a fan for dissipating heat generated by at least two electronic components
    Patent number: 7891411
    Abstract: A heat dissipation device for at least two heat-generating electronic components, includes a base, a fin set and a plurality of heat pipes. The base includes a supporting frame and at least two plates attached to a bottom of the frame for contacting with the at least two heat-generating electronic components. The fin set includes a plurality of fins on the base. The heat pipes respectively and thermally connect the at least two plates and the fin set together. A single fan is attached to the heat dissipation device for generating an airflow through the fin set to dissipate heat in the fin set absorbed from the at least two heat-generating electronic components.
    Type: Grant
    Filed: June 22, 2007
    Date of Patent: February 22, 2011
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Shi-Wen Zhou, Peng Liu, Jun Cao
  • HEAT DISSIPATION DEVICE
    Publication number: 20110024090
    Abstract: An exemplary heat dissipation device includes a base plate, two fin groups, a core, a fan holder coupled to a top of the core, a fan located over the fin groups and secured by the fan holder, and two heat pipes. The two fin groups cooperate to define a central hole in a center thereof and have a plurality of fins extending radially and outwardly from the central hole. The core is placed on the base plate and received in the central hole. Each heat pipe comprises an evaporation section sandwiched between the core and the base plate, an arc-shaped condensation section sandwiched between the two fin groups and an adiabatic section connecting the evaporation section and the condensation section.
    Type: Application
    Filed: December 18, 2009
    Publication date: February 3, 2011
    Applicants: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: Shou-Biao Xu, Shi-Wen Zhou, Chun-Chi Chen
  • Heat dissipation device with a heat pipe
    Patent number: 7870889
    Abstract: A heat dissipation device comprises a radiator comprising a collar, a core received in the collar and a helical heat pipe embedded in a circumferential face of the core. The collar has a receiving hole and a plurality of fins extending radially and outwardly from an outer face of the collar. The core together with the heat pipe is received in the receiving hole of the radiator. The core has a flat bottom face and a top face opposite to the bottom face. The heat pipe is located between the radiator and the core and thermally contacts the collar of the radiator and the core. The heat pipe extends from the bottom face of the core to the top face of the core, and has a flattened bottom face coplanar with the bottom face of the core for contacting with an electronic device.
    Type: Grant
    Filed: May 23, 2007
    Date of Patent: January 18, 2011
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Shi-Wen Zhou, Guo Chen, Peng Liu, Chun-Chi Chen
  • Heat dissipation device with heat pipes
    Patent number: 7866375
    Abstract: A heat dissipation device includes a base (10), a plurality of fins (20), first and second heat pipes (30), (40), a fan holder (50) and a fan (60) secured to the fan holder. The first heat pipe includes a heat-receiving section (32) and two heat-discharging sections (34). The second heat pipe includes an evaporating portion (42) and two condensing portions (44). The condensing portions of the second heat pipe extend into the fins and are disposed adjacent to opposite ends of each of the fins. One heat-discharging section extends in the fins and is disposed between the condensing portions, thus allowing heat absorbed from the base to be evenly distributed throughout the fins by the heat-discharging sections and the condensing portions.
    Type: Grant
    Filed: December 1, 2006
    Date of Patent: January 11, 2011
    Assignees: Fu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Shi-Wen Zhou, Chun-Chi Chen, Bao-Chun Chen
  • Reference Signal Sounding for Uplink Pilot Time Slot in Wireless Communication System
    Publication number: 20100322115
    Abstract: A wireless terminal operating in TDD mode transmits a plurality of sounding reference signals using an assigned maximum sounding reference signal (SRS) bandwidth (BW) size. At least one of the sounding reference signals is transmitted in a corresponding uplink pilot time slot (UpPTS) region of a special sub-frame of a radio frame wherein, in the frequency dimension, an uplink BW center is misaligned with a BW center of the SRS in the UpPTS region, a maximum SRS BW size in the UpPTS region is an even number of resource blocks with prime factors from a set of {2, 3, 5}, and the maximum SRS BW having a size in number of resource blocks less than or equal to (NRBUL?6·NRA) where NRA is a number of Random Access Channel (RACH) opportunities in the UpPTS region.
    Type: Application
    Filed: June 23, 2009
    Publication date: December 23, 2010
    Applicant: MOTOROLA, INC.
    Inventors: Na Wei, Vijay Nangia, Wen Zhou, Brian K. Classon