Abstract: A heat sink includes a heat conducting base, a heat conducting shaft thermally connected to and rotating with respect to the base, and a plurality of fins. The shaft includes a heat absorbing section thermally connected to the base and a heat dissipating section connected with the heat absorbing section. The fins are disposed on the heat dissipating section of the shaft.

Abstract: Transgenes encoding exogenous antibodies are stably integrated into donor cells and are present in the somatic tissue of chimeric birds. The transgenes encode exogenous antibodies and are preferably expressed in the oviduct for collection in the egg. Tissue specificity is provided by selecting the content of the transgene accordingly. Birds whose genome is comprised of trangene-derived exogenous antibody-encoding DNA express exogenous antibodies having desirable chemical properties with increased therapeutic utility compared to antibodies derived from bacterial expression systems.

Abstract: A heat dissipation device includes a canister filled with a phase-changeable working fluid, a housing hermetically fixed to a top of the canister and communicating with the canister, a fan located above a top of the housing and an impeller comprising a driving member received in the housing, an annular magnet accommodated in the hub and an axle coaxially connecting the driving member and the annular magnet together. The fan includes a plurality of windings fixed on an inner side thereof. When the working fluid is heated and vaporized to move through the driving member, the driving member is driven by the vaporized working fluid to rotate, whereby the annular magnet rotates within the windings to cause the windings to generate a current.

Abstract: A method of manufacturing a heat sink includes, firstly, providing a plurality of fins each having a head and a body extending from the head, providing a base having a plurality of studs protruding from a top surface thereof, and providing a cover defining a plurality of recesses in a bottom thereof for receiving the heads of the fins and a plurality of orfices for receiving the studs. Next, the cover and the base are pressed to sandwich the heads of the fins therebetween. Then the studs of the base are punched to expand the studs and cause the studs to intimately engage with the cover.

Abstract: A wireless terminal operating in TDD mode transmits a plurality of sounding reference signals using an assigned maximum sounding reference signal (SRS) bandwidth (BW) size. At least one of the sounding reference signals is transmitted in a corresponding uplink pilot time slot (UpPTS) region of a special sub-frame of a radio frame wherein, in the frequency dimension, an uplink BW center is misaligned with a BW center of the SRS in the UpPTS region, a maximum SRS BW size in the UpPTS region is an even number of resource blocks with prime factors from a set of {2, 3, 5}, and the maximum SRS BW having a size in number of resource blocks less than or equal to (NRBUL?6·NRA) where NRA is a number of Random Access Channel (RACH) opportunities in the UpPTS region.

Abstract: An exemplary connector includes a main body and a block engaged with the main body. The main body includes a central plate, a first extension plate extending downwardly from a lateral side of the central plate, and a second extension plate extending upwardly from an opposite lateral side of the central plate. Two riveting holes are defined through the central plate. The block includes a first securing plate and a second securing plate extending from the first securing plate and attached to the central plate of the main body. Two pins extend from the second securing plate and are punched to be engagingly received in the rivet holes of the central plate to engage with the main body.

Abstract: A heat sink includes a base with a plurality of recesses defined therein, a plurality of columned fins each having a head and a body extending from the head, and a cover joining with the base. Each head is received in and higher than a corresponding recess of the base. The heads are sandwiched between the cover and the base, whereby the columned fins are secured on the base. A portion of the cover contacting the head of each of the columned fins protrudes to form a deformed part. A method of manufacturing the heat sink is also disclosed.

Abstract: A heat sink assembly includes a base, a fin group and a heat pipe connecting with the base and the fin group. The fin group includes a plurality of fins. Each of the fins defines a recess at a lower portion thereof. The heat pipe includes an evaporating portion extending through the base and a condensing portion extending through the fin group. The base is interferentially fitted into the recesses of the fins. The base, the fin group and the heat pipe directly and intimately connect with each other. The recess and the base have correspondingly T-shaped profiles. Each fin forms a bended flange defining the recess. The bended flange intimately contacts with the base and the evaporating portion of the heat pipe.

Abstract: A heat dissipation device dissipating heat from a heat-generating electronic element, includes a canister filled with a phase-changeable working fluid, a housing hermetically fixed to a top of the canister and communicating with the canister, a fan located above a top of the housing, an impeller comprising a driving member received in the housing and an axle which extends through a center of the driving member. The axle has a lower end extending downwardly through a bottom of the housing to a center of the top of the canister and an upper end extending upwardly through a top of the housing to engage the fan. The working fluid is heated by the heat-generating electronic element and vaporized into the housing to engage the driving member to rotate and drive the fan to rotate synchronously.

Abstract: A heat dissipation device includes a heat spreader for thermally engaging with a heat generating electronic device, a heat sink assembly located above the heat spreader, and first and second heat pipes connecting with the heat spreader and the heat sink assembly. Each of the first and second heat pipes comprises an evaporation section engaged in the heat spreader, two arc-shaped condensation sections thermally inserted in the heat sink assembly, and two connecting sections interconnecting corresponding condensation sections and the evaporation section. The condensation sections are coplanar with each other and located in a same circle. The condensation sections of the first heat pipe extend in a clockwise direction, while the condensation sections of the second heat pipe extend in an anticlockwise direction.

Abstract: A heat dissipation device removing heat from an electronic device includes a base plate, a fin set in thermal connection with the base plate, a fixing member and two fans. The fixing member includes a driving part coupled to a top of the fin set, two mounting parts located at two opposite sides of a circumference of the fin set and two connecting arms extending outwardly from the driving part and connecting with the two mounting parts. The two fans, respectively mounted on the two mounting parts of the fixing member and located at two opposite sites of the circumference of the fin set, are driven to rotate around the circumference of the fin set by the driving part and generate two streams of airflow which flow through the fin set that are non-intersecting.

Abstract: A heat dissipation device includes a first heat sink, a second heat sink located on the first heat sink, a third heat sink located on the second heat sink, and a heat conducting member formed by bending a flat, plate-like member and connecting the first, second and third heat sinks. The heat conducting member includes a heat absorbing section contacting with the first heat sink, and first and second heat dissipating sections extending inwards from upper ends of first and second connecting sections extending upwardly from two ends of the heat absorbing section, respectively. The first heat dissipating section is sandwiched between the first and second heat sinks, and the second heat dissipating section is sandwiched between the second and third heat sinks. A width of the first and second heat dissipating sections is identical to that of the second heat sink.

Abstract: The present invention provides a class of thermotropic liquid crystalline polyesters (TLCPs) and molding compositions comprising the polyesters and glass fiber. The TLCPs consist essentially of repeat units derived from p-hydroxybenzoic acid (HBA), 6-hydroxy-2-naphthoic acid (HNA), terephthalic acid (TA), and hydroquinone (HQ), and the mole percent of HBA, HNA, TA and HQ is 34-72%, 12-26%, 4-21% and 4-21%, respectively. The TLCPs have a melting temperature equal to or below 355° C., an inherent viscosity of 4.0-10.0 dL/g and a Heat Deflection Temperature (HDT) in the range of 260-285° C. when compounded with 30% by weight glass fiber. The optimum compositions, selected from the above-mentioned compositional ranges exhibit a relatively low melting temperature and a relatively high HDT. Specified compositions, selected from the above-mentioned compositional ranges have low melting point, which are useful to blend with conventional polymers such as poly (ethylene terephthalate) and nylon etc.

Abstract: A heat dissipation device is provided for dissipating heat generated by a plurality of electronic components mounted on a printed circuit board and having different heights. The heat dissipation device includes a connecting member and a first base mounted on the connecting member and located at above one of the electronic components. A number of joining members extend through the printed circuit board and engage with the first base to assemble the first base on the one of the electronic components on the printed circuit board. A distance between the first base and the one of the electronic components is adjustable by adjusting the joining members to make the first base intimately contact with the one of the electronic components.

Abstract: The present invention provides an integrated circuit, comprising an array of components and programmable interconnect network for the array of components, said programmable interconnect network comprising a plurality of switch boxes being connected in a tree-based hierarchical architecture and providing selection and connection for the components responsive to configuration bits, switch boxes located at the lowest level of hierarchy are connected to the components; switch boxes in at least one level of hierarchy have different number of children from those in other levels of hierarchy. The present invention provides a hierarchical architecture with a vast variety of cell numbers, which facilitates circuit implementation. The present invention also offers greater layout flexibility.

Abstract: A heat dissipation device is provided for dissipating heat generated by electronic components mounted on a printed circuit board in an electronic system. The electronic components have different heights. The heat dissipation device includes a connecting plate, at least two elastic members mounted on the connecting plate, and a heat sink having a substrate mounted on the connecting plate and located above one of the electronic components. A number of joining members extend through the printed circuit board and engage with the substrate to attach the substrate on the one electronic component on the printed circuit board. A distance between the substrate and the connecting plate is adjustable by adjusting the joining members to make the substrate intimately contact the one electronic component.

Abstract: An electronic system such as a computer system includes a casing defining an opening at a side thereof, a motherboard arranged in the casing, a hard disk located at a side of the motherboard and a heat dissipation structure covering the opening of the casing. The motherboard includes a printed circuit board facing toward the opening of the casing, first electronic components and second electronic components mounted on the printed circuit board and facing toward the opening. The heat dissipation structure includes a base engaging with the casing and fins extending from the base and outside of the casing. The base includes a first engaging portion contacting the first and second electronic components and a second engaging portion contacting the hard disk. The first engaging portion and the second engaging portion are in different levels from each other.

Abstract: A heat dissipation device includes a heat sink and a pair of heat pipes fixed to the heat sink. The heat sink includes a rectangular post, four branches extending outwardly from four corners of the post, respectively, and a plurality of fins extending between the branches. Each heat pipe includes an evaporating section attached to a bottom of the post, a condensing section parallel to the evaporation section and attached to a top of the post, and an adiabatic section interconnecting the evaporating section and the condensing section. A block is secured to bottoms of the condensing sections of the heat pipes.

Abstract: A heat dissipation device includes a base, a fin group, a plurality of heat pipes connecting the base and the fin group, a fan cover covering the fin group and a fan located at a side of the fan cover. The heat pipes are received in the base and extend through the fin group. The heat pipes are received in two opposite sides of the fin group and sandwiched between the fan cover and the fin group. The fan cover includes a body and a pair of side walls extending from the body. The side walls each include a plurality of heat-dissipating fins formed on an outer surface thereof for increasing heat dissipating surface of the heat dissipating device.

Abstract: An apparatus and method for policy routing is provided. The method includes: A. configuring a policy routing to a label switching path and obtaining and saving forwarding information; and B. performing packet forwarding based on the forwarding information.