Abstract: A microelectronic package of the present description may comprises a first microelectronic device having at least one row of connection structures electrically connected thereto and a second microelectronic device having at least one row of connection structures electrically connected thereto, wherein the connection structures within the at least one first microelectronic device row are aligned with corresponding connection structures within the at least one second microelectronic device row in an x-direction.

Abstract: A microelectronic package of the present description may comprises a first microelectronic device having at least one row of connection structures electrically connected thereto and a second microelectronic device having at least one row of connection structures electrically connected thereto, wherein the connection structures within the at least one first microelectronic device row are aligned with corresponding connection structures within the at least one second microelectronic device row in an x-direction.

Abstract: A die assembly formed on a thin dielectric sheet is described. In one example, a first and a second die have interconnect areas. A dielectric sheet is over the interconnect areas of the first and the second die. Conductive vias in the dielectric sheet connect with pads of the interconnect areas. A build-up layer over the dielectric sheet includes routing to connect pads of the first die interconnect area to pads of the second die interconnect area through the conductive vias. The dies are mounted to a package substrate through the build-up layers, and a package cover is over the dies, the dielectric sheet, and the build-up layer.

Abstract: Embodiments of the present disclosure are directed toward techniques and configurations associated with a capductor assembly. In one embodiment, a capductor assembly may include a semiconductor wafer and a plurality of inductors disposed on a first side of the semiconductor wafer. The plurality of inductors may be embedded in electrically insulative material having a plurality of interconnect structures disposed thereon. The plurality of interconnect structures may be configured to electrically couple the plurality of inductors to a die. The IC assembly may further include a plurality of capacitors disposed on a second side of the wafer disposed opposite the first side of the wafer. The plurality of capacitors may be electrically coupled with a second plurality of interconnect structures that may be configured to electrically couple the plurality of capacitors with the die. Other embodiments may be described and/or claimed.

Abstract: A die assembly formed on a thin dielectric sheet is described. In one example, a first and a second die have interconnect areas. A dielectric sheet, such as glass, silicon, or oxidized metal is applied over the interconnect areas of dies. Conductive vias are formed in the dielectric sheet to connect with pads of the interconnect areas. A build-up layer includes routing to connect pads of the first die interconnect area to pads of the second die interconnect area through the conductive vias and a cover is applied over the dies, the dielectric sheet, and the build-up layer.

Abstract: A microelectronic package of the present description may comprises a first microelectronic device having at least one row of connection structures electrically connected thereto and a second microelectronic device having at least one row of connection structures electrically connected thereto, wherein the connection structures within the at least one first microelectronic device row are aligned with corresponding connection structures within the at least one second microelectronic device row in an x-direction.

Abstract: A die assembly formed on a thin dielectric sheet is described. In one example, a first and a second die have interconnect areas. A dielectric sheet, such as glass, silicon, or oxidized metal is applied over the interconnect areas of dies. Conductive vias are formed in the dielectric sheet to connect with pads of the interconnect areas. A build-up layer includes routing to connect pads of the first die interconnect area to pads of the second die interconnect area through the conductive vias and a cover is applied over the dies, the dielectric sheet, and the build-up layer.

Abstract: A transient voltage compensation system is provided. The transient voltage compensation system includes a processor and a first voltage regulator coupled to the processor, wherein the first voltage regulator is to deliver a load current to the processor at an output voltage. The transient voltage compensation system also includes a second voltage regulator coupled to the first voltage regulator, wherein the second voltage regulator is to regulate the output voltage in response to transient loads of the processor.

Abstract: A transient voltage compensation system is provided. The transient voltage compensation system includes a processor and a first voltage regulator coupled to the processor, wherein the first voltage regulator is to deliver a load current to the processor at an output voltage. The transient voltage compensation system also includes a second voltage regulator coupled to the first voltage regulator, wherein the second voltage regulator is to regulate the output voltage in response to transient loads of the processor.

Abstract: There are disclosed methods for the treatment of non-insulin dependent diabetes mellitus in a mammal comprising the prolonged administration of GLP-1 (7-37), and related peptides. Also disclosed are compositions to prolong the administration of the peptides.

Abstract: A cake resistance measuring system and method are used to measure the cake resistance of a freeze dried sample during or after processing, with the results of the measurement being used to improve that processing and/or subsequent freeze drying processes or formulations.

Abstract: There are disclosed methods for the treatment of non-insulin dependent diabetes mellitus in a mammal comprising the prolonged administration of GLP-1 (7-37), and related peptides. Also disclosed are compositions to prolong the administration of the peptides.

Abstract: A cake resistance measuring system and method are used to measure the cake resistance of a freeze dried sample during or after processing, with the results of the measurement being used to improve that processing and/or subsequent freeze drying processes or formulations.

Abstract: There are disclosed methods for the treatment of non-insulin dependent diabetes mellitus in a mammal comprising the prolonged administration of GLP-1 (7-37), and related peptides. Also disclosed are compositions to prolong the administration of the peptides.

Abstract: A control system is described for controlling the flow of multi-format, multi-bit macroinstructions for loading data into registers. The control system is adapted to: (A) control microprogram flow of instructions based on data within a floating point macroinstruction, (B) speed up macroinstruction flow as a function of data within various fields of the macroinstruction, and (C) speed up macroinstruction branches.