Abstract: A vehicle power control method for jump-start uses a vehicle control system that includes a low voltage DC/DC converter for converting a voltage of a high voltage battery to a low voltage to be output and a junction box for connecting the low voltage DC/DC converter to an auxiliary battery and load. The vehicle power control method includes a jump-start preparation step in which when the auxiliary battery is in a discharge condition, a first relay, which connects or disconnects the junction box to or from the auxiliary battery, is turned off and a second relay, which connects or disconnects the junction box to or from a jump-start power supply connection terminal, is turned on; and a jump-start completion step in which, after a vehicle starts by a power inputted through the jump-start power supply connection terminal, the second relay is turned off, and the first relay is turned on.

Abstract: A system for diagnosing a battery connection status includes: a DC-DC converter that converts and outputs a level of an input voltage; a battery connected to an output terminal of the DC-DC converter; and a controller that generates a control value for compensating for an error between a voltage command or a current command of the battery and a detection voltage or a detection current of the battery, controls the output of the DC-DC converter by applying the control value, and diagnoses a connection status between the DC-DC converter and the battery based on a change in error between the detection voltage or the detection current of the battery and the voltage command or the current command of the battery.

Abstract: A method and system for controlling a vehicular direct current converter are provided. In particular, zero-current control is performed during control for maintaining an SOC of an auxiliary battery. Accordingly, energy loss due to charging and discharging of the auxiliary battery is minimized and the fuel efficiency of a vehicle is improved.

Abstract: ADC-DC converter system is provided. The DC-DC converter system includes a transformer that is disposed between an input terminal and an output terminal, and a primary side switching circuit unit that converts voltage of the input terminal to AC voltage and provide the converted AC voltage to a primary side coil of the transformer. A secondary side switching circuit unit includes a plurality of switches that convert voltage induced in a secondary side coil of the transformer to DC voltage and provide the converted DC voltage to the output terminal. A controller is configured to adjust a short-circuit/open state of the plurality of switches based on voltages at both ends of each of the plurality of switches.

Abstract: a control method for charging a high voltage battery of a vehicle includes charging, by a vehicle controller, the high voltage battery using a low voltage DC-DC converter The state information. of the low voltage DC-DC converter, which includes the current and the temperature of the low voltage DC-DC converter, is sensed by the vehicle controller while charging the high voltage battery. The charging current of the high voltage battery is derated by the vehicle controller when the sensed state information of the low voltage DC-DC converter satisfies a converter derating condition.

Abstract: A method of compensating for a current sensor offset of an inverter includes: calculating a current sensor offset based on an output value of a current sensor, which detects an output current of the inverter, after a vehicle has started and before a current control of the inverter is performed; actuating the inverter to perform the current control according to the calculated current sensor offset; determining whether the inverter enters a burst mode while performing the current control; and re-calculating the current sensor offset based on the output value of the current sensor when the inverter is determined to enter the burst mode.

Abstract: A system for protecting the output terminal of the on-board-charger (OBC) includes: the OBC configured to apply an output voltage equal to a voltage of a battery to the battery to perform charging of the battery, an output terminal protection apparatus configured to compare a voltage difference between the output voltage of the OBC and the voltage of the battery with a threshold, and an OBC relay configured to connect the OBC to the battery when the voltage difference is less than the threshold. The OBC performs the charging of the battery after the OBC is connected to the battery.

Abstract: A method and system of controlling a converter is provided. The method includes sensing, by a controller, an on and off state of a secondary side switch of the converter and deriving, by the controller, a current command of the converter. The current command is then compared with preset current reference values each provided based on the on and off state of the secondary side switch. As the result of the comparison of the current command with the current reference value, the on and off state of the secondary side switch is either changed or maintained.

Abstract: A vehicle power supply system is provided. The system includes a main battery and an OBC having first and second input/output terminals, in which AC power input to the first input/output terminal is converted into DC power to be output to the second input/output terminal, and a magnitude of the DC power input to the second input/output terminal is converted and output to the first input/output terminal. Additionally, the system includes an LDC in which a DC voltage input from the main battery is converted into a low voltage to be supplied to an auxiliary battery or an electronic load and a switching unit is connected between the first input/output terminal and the LDC. A controller is then configured to adjust a powering direction of the OBC and an on/off state of the switching unit, based on whether the main battery is charged and whether the LDC fails.

Abstract: A semiconductor device includes a semiconductor die. A first interconnect structure is disposed over a peripheral region of the semiconductor die. A semiconductor component is disposed over the semiconductor die. The semiconductor component includes a second interconnect structure. The semiconductor component is disposed over the semiconductor die to align the second interconnect structure with the first interconnect structure. The first interconnect structure includes a plurality of interconnection units disposed around first and second adjacent sides of the semiconductor die to form an L-shape border of the interconnection units around the semiconductor die. A third interconnect structure is formed over the semiconductor die perpendicular to the first interconnect structure. An insulating layer is formed over the semiconductor die and first interconnect structure.

Abstract: A method for controlling a relay of an auxiliary battery by a controller includes deciding whether or not a low direct current (DC) to DC converter (LDC) supplies power required in an electronic load in a state of charge (SOC) maintaining mode of the auxiliary battery. As a result of the decision, a turn-on state of the relay in which power of the auxiliary battery is supplied to the electronic load is maintained when the LDC does not supply the power required in the electronic load. As a result of the decision, the relay is turned off so that power of the auxiliary battery is not supplied to the electronic load when the LDC supplies the power required in the electronic load.

Abstract: A semiconductor device comprises a carrier including an adhesive disposed over the carrier. The semiconductor device further comprises a semiconductor wafer including a plurality of semiconductor die separated by a non-active region. A plurality of bumps is formed over the semiconductor die. The semiconductor wafer is mounted to the carrier with the adhesive disposed around the plurality of bumps. Irradiated energy is applied to the non-active region to form a modified region within the non-active region. The semiconductor wafer is singulated along the modified region to separate the semiconductor die. The semiconductor wafer is singulated along the modified region by applying stress to the semiconductor wafer. The adhesive is removed from around the plurality of bumps after singulating the semiconductor wafer. The semiconductor wafer includes a plurality of semiconductor die comprising through silicon vias. The modified region optionally includes a plurality of vertically stacked modified regions.

Abstract: A semiconductor device has a substrate. A plurality of conductive vias is formed through the substrate. A conductive layer is formed over the substrate. An insulating layer is formed over conductive layer. A portion of the substrate is removed to expose the conductive vias. A plurality of vertical interconnect structures is formed over the substrate. A first semiconductor die is disposed over the substrate. A height of the vertical interconnect structures is less than a height of the first semiconductor die. An encapsulant is deposited over the first semiconductor die and the vertical interconnect structures. A first portion of the encapsulant is removed from over the first semiconductor die while leaving a second portion of the encapsulant over the vertical interconnect structures. The second portion of the encapsulant is removed to expose the vertical interconnect structures. A second semiconductor die is disposed over the first semiconductor die.

Abstract: A method of diagnosing a fault by using impedance of an output terminal of a power supply device for an environmentally-friendly vehicle is provided. The method estimates impedance of the output terminal of the power supply device and diagnoses a fault by using the estimated impedance, thereby preventing an auxiliary battery from being discharged. Whether or not the fault is generated according to the impedance when the estimated impedance exceeds a reference value is determined.

Abstract: A semiconductor device has a substrate. A plurality of conductive vias is formed through the substrate. A conductive layer is formed over the substrate. An insulating layer is formed over conductive layer. A portion of the substrate is removed to expose the conductive vias. A plurality of vertical interconnect structures is formed over the substrate. A first semiconductor die is disposed over the substrate. A height of the vertical interconnect structures is less than a height of the first semiconductor die. An encapsulant is deposited over the first semiconductor die and the vertical interconnect structures. A first portion of the encapsulant is removed from over the first semiconductor die while leaving a second portion of the encapsulant over the vertical interconnect structures. The second portion of the encapsulant is removed to expose the vertical interconnect structures. A second semiconductor die is disposed over the first semiconductor die.

Abstract: An apparatus and a method are provided for controlling a low DC-DC converter (LDC) in an electric vehicle by prioritizing respective controllers, connecting the controllers in series in ascending order according to priority, and determining a command voltage of the LDC on the basis of output voltages of the respective controllers. Accordingly, even when a controller with a highest priority is operating, controllers of lower priority continue operating. Thus, electrical load performance degradation caused by instantaneous overcurrent generated in state transitions is prevented.

Abstract: A semiconductor device has a plurality of conductive vias formed into a semiconductor wafer. A portion of the semiconductor wafer is removed so the conductive vias extend above a surface of the semiconductor wafer. A notch is formed in the semiconductor wafer around each of the conductive vias. The notch around the conductive vias can be formed by wet etching, dry etching, or LDA. A first insulating layer is formed over a surface of the semiconductor wafer and conductive vias and into the notch to provide stress relief between the conductive vias and semiconductor wafer. A portion of the first insulating layer is removed to expose the conductive vias. A first conductive layer and second insulating layer can be formed around the conductive vias. A second conductive layer can be formed over the conductive vias. The notch can extend into the second insulating layer.

Abstract: A semiconductor device has a first component. A modular interconnect structure is disposed adjacent to the first component. A first interconnect structure is formed over the first component and modular interconnect structure. A shielding layer is formed over the first component, modular interconnect structure, and first interconnect structure. The shielding layer provides protection for the enclosed semiconductor devices against EMI, RFI, or other inter-device interference, whether generated internally or from external semiconductor devices. The shielding layer is electrically connected to an external low-impedance ground point. A second component is disposed adjacent to the first component. The second component includes a passive device. An LC circuit includes the first component and second component. A semiconductor die is disposed adjacent to the first component. A conductive adhesive is disposed over the modular interconnect structure.

Abstract: A vehicle power supply system is provided. The system includes a main battery and an OBC having first and second input/output terminals, in which AC power input to the first input/output terminal is converted into DC power to be output to the second input/output terminal, and a magnitude of the DC power input to the second input/output terminal is converted and output to the first input/output terminal Additionally, the system includes an LDC in which a DC voltage input from the main battery is converted into a low voltage to be supplied to an auxiliary battery or an electronic load and a switching unit is connected between the first input/output terminal and the LDC. A controller is then configured to adjust a powering direction of the OBC and an on/off state of the switching unit, based on whether the main battery is charged and whether the LDC fails.

Abstract: A semiconductor device has a first semiconductor die and a modular interconnect structure adjacent to the first semiconductor die. An encapsulant is deposited over the first semiconductor die and modular interconnect structure as a reconstituted panel. An interconnect structure is formed over the first semiconductor die and modular interconnect structure. An active area of the first semiconductor die remains devoid of the interconnect structure. A second semiconductor die is mounted over the first semiconductor die with an active surface of the second semiconductor die oriented toward an active surface of the first semiconductor die. The reconstituted panel is singulated before or after mounting the second semiconductor die. The first or second semiconductor die includes a microelectromechanical system (MEMS). The second semiconductor die includes an encapsulant and an interconnect structure formed over the second semiconductor die.