Abstract: A radio-frequency (RF) transceiver front-end circuit includes an antenna, a power amplifier, a low-noise amplifier, a first switch unit and a second switch unit. The power amplifier is connected to a transmitting unit and the antenna to form a transmission path. The low-noise amplifier is connected to a receiving unit and the antenna to form a reception path. The transmission path and the reception path selectively do not include a ?/4 transmission line connected to the antenna. The RF transceiver front-end circuit has a receiving state and a transmitting state. In the receiving state, the first switch unit is controlled and causes the transmission path to have high impedance. In the transmitting state, the second switch unit is controlled and causes the reception path to have high impedance.

Abstract: A device has a substrate transparent to ultraviolet (UV) light, and at least one metalens formed of a material having large permittivity of UV light on the substrate. A device has a UV reflector, a UV transparent film on the reflector, and at least one metalens formed of a material having large permittivity of UV light on the film.

Abstract: The present disclosure provides an annealing method for improving interface bonding strength of a wafer. The method includes: providing a substrate, the substrate having a bonding interface; performing a first annealing step, wherein the first annealing step is practiced in an oxygen-containing atmosphere, and an oxidation protection layer is formed on a surface of the substrate through the annealing step; and performing a second annealing step upon the first annealing step, wherein a temperature of the second annealing step is higher than that of the first annealing step, and the second annealing step is practiced in a nitrogen-free environment.

Abstract: The present invention provides for recombinant Endo-S mutants that exhibit reduced hydrolysis activity and increased transglycosylation activity for the synthesis of glycoproteins wherein a desired sialylated oxazoline or synthetic oligosaccharide oxazoline is added to a core fucosylated or nonfucosylated GlcNAc-protein acceptor. Such recombinant Endo-S mutants are useful for efficient glycosylation remodeling of IgG1-Fc domain to provide different antibody glycoforms carrying structurally well-defined Fc N-glycans.

Abstract: Embodiments of the present invention provide an information sharing method, an information sharing apparatus, and an electronic device. The method is implemented by a first electronic device. The method includes: when it is detected that an electronic device binding option built in a browser is triggered, retrieving a dialog box built in the browser, where at least one electronic device binding function option may be set in the dialog box; when it is detected that an electronic device binding function option is triggered, executing a corresponding electronic device binding function in the background, and sending first information to a server; and after the server determines that a preset correspondence exists between second information sent by a second electronic device and the first information and establishes a binding relationship between the first electronic device and the second electronic device, sharing information between the first electronic device and the second electronic device.

Abstract: A radio-frequency (RF) transceiver front-end circuit includes an antenna, a power amplifier, a low-noise amplifier, a first switch unit and a second switch unit. The power amplifier is connected to a transmitting unit and the antenna to form a transmission path. The low-noise amplifier is connected to a receiving unit and the antenna to form a reception path. The transmission path and the reception path selectively do not include a ?/4 transmission line connected to the antenna. The RF transceiver front-end circuit has a receiving state and a transmitting state. In the receiving state, the first switch unit is controlled and causes the transmission path to have high impedance. In the transmitting state, the second switch unit is controlled and causes the reception path to have high impedance.

Abstract: Systems and methods for identifying a pair of nodes of a plurality of nodes of a virtual optical network (VON); identifying i) an optical route between the pair of nodes and ii) a desired availability of the optical route; determining a probability density function (PDF) of a signal-to-noise ratio (SNR) of a signal of the optical route; determining a SNR threshold such that an integration of the PDF of the SNR of the signal above the SNR threshold corresponds to the desired availability of the optical route; determining a plurality of spectral efficiencies that corresponds to the SNR threshold, each spectral efficiency of the plurality of spectral efficiencies associated with a respective modulation format of a plurality of modulation formats; and identifying a particular modulation format of the plurality of modulation formats that corresponds to a maximum spectral efficiency of the plurality of spectral efficiencies.

Abstract: An electrical connector including an insulating body, a plurality of terminals, and at least one grounding member is provided. The terminals and the grounding member are disposed in the insulating body. At least one grounding terminal among the terminals and the grounding member next to the grounding terminal form an integrally-molded structure. A portion of the grounding terminal and a portion of the grounding member are misaligned from each other along an arrangement direction of the terminals.

Abstract: Disclosed are a channel estimation method and device for improving accuracy of channel estimation so as to improve the performance of a receiver. The present application provides a channel estimation method, comprising: determining an equivalent pilot sequence by means of a historical effective frequency offset value; determining a sequence for multiple correlation by using the equivalent pilot sequence; and performing multiple correlation calculation of channel estimation by using the sequence for multiple correlation.

Abstract: An electrical connector including an insulating body and a plurality of terminals disposed in the insulating body is provided. At least one of the terminals has a first section and a pair of second sections. The second sections structurally extend and branch out from the first section. On a plane where the terminals are located, orthogonal projections of the second sections are misaligned and do not overlap with each other.

Abstract: The invention relates to the field of petroleum drilling fluids, and discloses a super-amphiphobic strongly self-cleaning high-performance water-based drilling fluid comprising polymeric super-amphiphobic agent and a drilling method. The polymeric super-amphiphobic agent comprises structural units A derived from acrylamide, structural units B derived from methyl methacrylate, structural units C derived from butyl acrylate, structural units D derived from a compound represented by the following formula (1), structural units E derived from a silane coupler, and nano-titania; wherein the nano-titania is bonded to the polymeric super-amphiphobic agent via the structural unit E, and the silane coupler is a silane coupler having double bonds; R is a C3-C8 perfluoroalkyl group. A water-based drilling fluid additive prepared from the polymeric super-amphiphobic agent in the present invention has excellent wettability, inhibition, lubrication, reservoir protection, and rheology and fluid loss properties.

Abstract: The present invention discloses a method for cleaning substrate without damaging patterned structure on the substrate using ultra/mega sonic device, comprising: applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency f1 and power P1 to drive said ultra/mega sonic device; after micro jet generated by bubble implosion and before said micro jet generated by bubble implosion damaging patterned structure on the substrate, setting said ultra/mega sonic power supply at frequency f2 and power P2 to drive said ultra/mega sonic device; after temperature inside bubble cooling down to a set temperature, setting said ultra/mega sonic power supply at frequency f1 and power P1 again; repeating above steps till the substrate being cleaned.

Abstract: The present invention discloses a method for effectively cleaning vias, trenches or recessed areas on a substrate using an ultra/mega sonic device, comprising: applying liquid into a space between a substrate and an ultra/mega sonic device; setting an ultra/mega sonic power supply at frequency f1 and power P1 to drive said ultra/mega sonic device; after the ratio of total bubbles volume to volume inside vias, trenches or recessed areas on the substrate increasing to a first set value, setting said ultra/mega sonic power supply at frequency f2 and power P2 to drive said ultra/mega sonic device; after the ratio of total bubbles volume to volume inside the vias, trenches or recessed areas reducing to a second set value, setting said ultra/mega sonic power supply at frequency f1 and power P1 again; repeating above steps till the substrate being cleaned.

Abstract: This disclosure describes a system and method for documenting and/or quantifying the inspection of the cleanliness of a surface. The documenting is attained through the capture of an image of the surface and uploading said image along with metadata about the image to a place of secure storage such as a company internal server or a web server. The quantification is attained through image analysis of the image, with or without enhancements such as UV light, to derive a value for the amount of residue remaining on the surface. This quantification can be performed on a device and sent to a server, or performed on the server itself after the image has been sent. In all cases, the inspection of cleanliness is documented with or without quantification.

Abstract: A radio-frequency (RF) transceiver front-end circuit includes an antenna, a power amplifier, a low-noise amplifier, a first switch unit and a second switch unit. The power amplifier is connected to a transmitting unit and the antenna to form a transmission path. The low-noise amplifier is connected to a receiving unit and the antenna to form a reception path. The transmission path and the reception path selectively do not include a ?/4 transmission line connected to the antenna. The RF transceiver front-end circuit has a receiving state and a transmitting state. In the receiving state, the first switch unit is controlled and causes the transmission path to have high impedance. In the transmitting state, the second switch unit is controlled and causes the reception path to have high impedance.

Abstract: A method and apparatus for cleaning semiconductor wafer, combining batch cleaning and single wafer cleaning together. The method includes: taking at least two wafers from a cassette in a load port and putting said wafers into a first tank filled with chemical solution; after processing said wafers in the first tank, taking said wafers out of the first tank and keeping said wafers wet; putting said wafers into a second tank filled with liquid; after processing said wafers in the second tank, taking said wafers out of the second tank and keeping said wafers wet; putting one of said wafers on a chuck inside a single wafer cleaning module; rotating the chuck while applying chemical solution on said wafer; applying deionized water on said wafer; drying said wafer; taking said wafer out of the single wafer cleaning module and putting said wafer back to the cassette in the load port.

Abstract: Embodiments include a middle frame for a mobile terminal and a mobile terminal. The middle frame for a mobile terminal includes a metal outer frame. An inner side of the metal outer frame is internally connected to a tray using a location structure. A plastic outer frame is formed on the inner side of the metal outer frame using an insert injection molding process, and the plastic outer frame is separately joined with the metal outer frame and the tray for curing.

Abstract: A method for preparing a substrate with an insulating buried layer includes: providing a substrate, the substrate having a supporting layer and an insulating layer arranged on a surface of the supporting layer; performing first ion implantation, implanting modified ions into the substrate, wherein a distance from an interface between the insulating layer and the supporting layer to a Gaussian distribution peak of modified ion concentration is less than 50 nm, such that the modified ions form a nano cluster in the insulating layer; and performing a second ion implantation, continuing to implant the modified ions into the insulating layer, wherein the ions are implanted in the same way as the first ion implantation, and a distance from a Gaussian distribution peak of modified ion concentration in this step to the Gaussian distribution peak of modified ion concentration in the first ion implantation is less than 80 nm.

Abstract: An apparatus for cleaning a semiconductor wafer comprises a chuck (106), an ultra or mega sonic device, an actuator (113), at least one dispenser (108, 209) and a rotating driving mechanism (111). The chuck (106) holds the semiconductor wafer (105). The actuator (113) drives the ultra or mage sonic device to a position above the surface of the semiconductor wafer (105) and a gap is formed between the ultra or mega sonic device and the surface of the semiconductor wafer (105). The at least one dispenser (108, 209) sprays cleaning liquid on the surface of the semiconductor wafer (105).

Abstract: An apparatus and a method for wet process on a semiconductor substrate are provided. The apparatus includes a process chamber (1005), a chuck (1002) for holding and positioning a semiconductor substrate (1001) disposed in the process chamber, a rotating driving mechanism (1004) driving the chuck to rotate, a chamber shroud (1006) disposed surrounding the process chamber, at least one vertical driving mechanism driving the chamber shroud to move up or down, a shielding cover (1007), at least one driving device (1008) driving the shielding cover to cover down or lift up, at least one dispenser module (1014) having a dispenser (1030) for spraying liquid to the surface of the semiconductor substrate. When the shielding cover covers above the process chamber, the chamber shroud is moved up to couple with the shielding cover, so as to seal the process chamber for preventing the liquid from splashing out of the process chamber.