Patents by Inventor Yan Lu
Yan Lu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20230334112Abstract: A proxy-based thin-client web browsing framework enables cooperative web browsing of multiple devices. The multiple devices may include devices that are not intended for web browsing and have limited or no web browsers and/or user input capabilities. The proxy-based thin client web browsing framework employs a virtual browser at a proxy server to perform all browser-engine logics, and retrieve, render and encode web pages on behalf of the multiple devices. The multiple devices therefore only need to have limited decoding and display capabilities to perform web browsing. The proxy-based thin client web browsing framework further includes a touch controller as a remote controller for a device that has no or limited user texting or manipulating capabilities.Type: ApplicationFiled: June 22, 2023Publication date: October 19, 2023Applicant: Microsoft Technology Licensing, LLCInventors: Huifeng SHEN, Shipeng LI, Yan LU, Zhaotai PAN, Jianfeng WANG
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Publication number: 20230319292Abstract: Implementations of the subject matter described herein provide a solution for rate control based on reinforcement learning. In this solution, an encoding state of a video encoder is determined, the encoding state being associated with encoding of a first video unit by the video encoder. An encoding parameter associated with rate control in the video encoder is determined by a reinforcement learning model and based on the encoding state of the video encoder. A second video unit different from the first video unit is encoded based on the encoding parameter. In this way, it is possible to achieve a better quality of experience (QOE) for real time communication with computation overhead being reduced.Type: ApplicationFiled: June 30, 2020Publication date: October 5, 2023Applicant: Microsoft Technology Licensing, LLCInventors: Jiahao LI, Bin LI, Yan LU, Tom W. HOLCOMB, Mei-Hsuan LU, Andrey MEZENTSEV, Ming-Chieh LEE
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Publication number: 20230314718Abstract: Various embodiments of the present disclosure are directed towards an integrated circuit. The integrated circuit includes a substrate having an upper face and a lower face. The upper face includes a central region and an outer sidewall that laterally surrounds the central region and that extends from the upper face to the lower face. An optical edge coupler is disposed over the upper face of the substrate and extends in a first direction from the central region toward the outer sidewall. An outer sidewall of the optical edge coupler corresponds to the outer sidewall of the substrate and has a concave surface or a convex surface.Type: ApplicationFiled: July 1, 2022Publication date: October 5, 2023Inventors: Wei-Kang Liu, Chih-Tsung Shih, Hau-Yan Lu, Yingkit Felix Tsui
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Patent number: 11775247Abstract: In implementations of the subject matter described herein, there are provided a method and apparatus for real time screen sharing. During the screen sharing of two devices, if a certain condition is satisfied for an image encoded by a first device and an image decoded by a second device, the first device pauses image processing images. If the pause time of pausing satisfies a certain length, a parameter associated with an image compression ratio is adjusted. After the first device resumes image processing, the adjusted parameter is used to encode a new image captured on the first device. According to implementations of the subject matter described herein, a transmission code rate during the screen sharing can be controlled according to the pause time of pausing image processing. The implementations of the subject matter described herein can reduce transmission latency of screen sharing, thereby effectively ensuring the user experience.Type: GrantFiled: May 24, 2018Date of Patent: October 3, 2023Assignee: Microsoft Technology Licensing, LLC.Inventors: Bin Li, Ji-Zheng Xu, Yan Lu
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Publication number: 20230273367Abstract: Various embodiments of the present disclosure are directed towards a semiconductor package comprising optically coupled integrated circuit (IC) chips. A first IC chip and a second IC chip overlie a substrate at a center of the substrate. A photonic chip overlies the first and second IC chips and is electrically coupled to the second IC chip. A laser device chip overlies the substrate, adjacent to the photonic chip and the second IC chip, at a periphery of the substrate. The photonic chip is configured to modulate a laser beam from the laser device chip in accordance with an electrical signal from the second IC chip and to provide the modulated laser beam to the first IC chip. This facilitates optical communication between the first IC chip to the second IC chip. Various embodiments of the present disclosure are further directed towards simultaneously aligning and bonding constituents of the semiconductor package.Type: ApplicationFiled: May 23, 2022Publication date: August 31, 2023Inventors: Chih-Tsung Shih, Hau-Yan Lu, Wei-Kang Liu, Yingkit Felix Tsui
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Patent number: 11738749Abstract: In various embodiments, methods, systems, and vehicle apparatuses are provided. A method for implementing a lane-keeping assist unit of a vehicle by receiving information of a plurality of road geometries, and driving scenarios wherein at least one driving scenario is combined with a target path that is parallel and biased from a lane center by a desired path offset, and a reference path for guiding the vehicle to merge with the target path; adapting the reference path with control based on a selected road geometry and driving scenario; adjusting the desired path offset by considering lane markings during an intervention for an inner curve, an outer curve and a straight road; controlling the vehicle trajectory for enabling the vehicle to track the reference path; exiting the intervention once a trajectory tracking performance by the vehicle is confirmed; and aborting once an instability of the trajectory tracking performance is confirmed.Type: GrantFiled: November 9, 2020Date of Patent: August 29, 2023Assignee: GM GLOBAL TECHNOLOGY OPERATIONS LLCInventors: Jayant Sachdev, Reza Zarringhalam, Amir Takhmar, Jimmy Zhong Yan Lu, Paul A. Adam, Tetyana V. Mamchuk
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Patent number: 11727079Abstract: A computer-implemented method for displaying at least a portion of content being displayed on a first device to also be displayed on a second device. The method includes causing content to be displayed on a first device. The method then includes detecting a second device to concurrently display at least a portion of the content being displayed on the first device. A capability of the first device is compared with a capability of the second device. Based on the comparing, the at least the portion of the content is automatically provided to be displayed on the second device.Type: GrantFiled: March 2, 2021Date of Patent: August 15, 2023Assignee: Microsoft Technology Licensing, LLCInventors: Huifeng Shen, Shipeng Li, Yan Lu, Zhaotai Pan, Jianfeng Wang
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Patent number: 11700698Abstract: A method for manufacturing a circuit board comprises: a first single-sided board and an insulating structure are provided. The first single-sided board is pressed to the insulating structure and covers opposite side surfaces of the insulating structure to form a first laminated board. A second single-sided board and a third single-sided board are provided. The second single-sided board is pressed to the third single-sided board and covers opposite side walls of the third single-sided board to form a second laminated board. An inner wiring layer is formed by the second laminated board. The second laminated board with the inner wiring layer and the first laminated board are pressed to form an intermediate structure. Outer wiring layers are formed by the intermediate structure. Covering films are formed on surfaces of the outer wiring layers. Electromagnetic interference shielding layers are formed on the covering films.Type: GrantFiled: March 4, 2022Date of Patent: July 11, 2023Assignees: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Avary Holding (Shenzhen) Co., Limited.Inventors: Hao-Yi Wei, Yan-Lu Li
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Patent number: 11698489Abstract: A method for fabricating a photonic package device is provided. The method includes patterning a semiconductor layer of a semiconductor-on-insulator (SOI) substrate into a waveguide structure and at least one first semiconductor pillar; forming a metal-dielectric stack over the waveguide structure and the first semiconductor pillar; etching an opening in the metal-dielectric stack to expose the first semiconductor pillar; etching an insulator layer of the SOI substrate to form at least one insulator cap below the first semiconductor pillar; and etching a base semiconductor substrate of the SOI substrate to form at least one second semiconductor pillar below the insulator cap.Type: GrantFiled: February 18, 2022Date of Patent: July 11, 2023Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.Inventors: Ying-Hua Chen, Hau-Yan Lu, Wen-Chen Lu
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Publication number: 20230209066Abstract: Techniques are described for efficiently encoding video data by skipping evaluation of certain encoding modes based on various evaluation criteria. In some solutions, intra-block evaluation is performed in a specific order during encoding, and depending on encoding cost calculations of potential intra-block encoding modes, evaluation of some of the potential modes can be skipped. In some solutions, some encoding modes can be skipped depending on whether blocks are simple (e.g., simple vertical, simple horizontal, or both) or non-simple. In some solutions, various criteria are applied to determine whether chroma-from-luma mode evaluation can be skipped. The various solutions can be used independently and/or in combination.Type: ApplicationFiled: February 28, 2023Publication date: June 29, 2023Applicant: Microsoft Technology Licensing, LLCInventors: Thomas W. Holcomb, Jiahao Li, Bin Li, Yan Lu, Mei-Hsuan Lu, Andrey Mikhaylovic Mezentsev, Ming-Chieh Lee
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Publication number: 20230187447Abstract: A semiconductor device includes a substrate, a fin structure and an isolation layer formed on the substrate and adjacent to the fin structure. The semiconductor device includes a gate structure formed on at least a portion of the fin structure and the isolation layer. The semiconductor device includes an epitaxial layer including a strained material that provides stress to a channel region of the fin structure. The epitaxial layer has a first region and a second region, in which the first region has a first doping concentration of a first doping agent and the second region has a second doping concentration of a second doping agent. The first doping concentration is greater than the second doping concentration. The epitaxial layer is doped by ion implantation using phosphorous dimer.Type: ApplicationFiled: February 6, 2023Publication date: June 15, 2023Inventors: Yu-Chang LIN, Chun-Feng NIEH, Huicheng CHANG, Hou-Yu CHEN, Yong-Yan LU
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Patent number: 11672083Abstract: A composite circuit board includes a composite circuit board unit, a first solder mask formed on a first metal protection layer of the composite circuit board unit, and a second solder mask formed on a second metal protection layer of the composite circuit board unit. Two ends of a first outer conductive circuit are bent back toward each other and spaced apart a predetermined distance to form a first window. Two ends of a second outer conductive circuit are bent back toward each other and spaced apart a predetermined distance to form a second window.Type: GrantFiled: October 8, 2021Date of Patent: June 6, 2023Assignees: HongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Avary Holding (Shenzhen) Co., Limited.Inventors: Yang Li, Yan-Lu Li
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Publication number: 20230171877Abstract: A circuit board includes a dielectric substrate, a signal line and a pair of ground wires. The dielectric substrate includes a base and an elevated platform protruding from an upper surface of the base. The signal line is conformally disposed on the dielectric substrate and includes a first segment disposed on an upper surface of the elevated platform, a second segment extending on the upper surface of the base, and a third segment disposed on a sidewall of the elevated platform and connecting the first segment and the second segment. The pair of ground wires are disposed on the dielectric substrate and are spaced apart from the signal line. A projection of the second segment of the signal line on the upper surface of the base partly overlaps projections of the pair of ground wires on the upper surface of the base.Type: ApplicationFiled: December 29, 2021Publication date: June 1, 2023Inventors: Hao-Yi WEI, Childe ZHU, Yan-Lu LI
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Publication number: 20230168722Abstract: A mobile communication device having a first component and a second component is provided. The first component and the second component are configured movable relative to each other within a predefined position range. The predefined position range includes a plurality of positions of the first component relative to the second component. The mobile communication device further includes a position determination unit configured to determine a position of the first component relative to the second component in the predefined position range. At least one of the first component and the second component includes an antenna configured for wireless communication. The mobile communication device further includes a controller configured to drive the antenna based on the determined position of the first component relative to the second component.Type: ApplicationFiled: February 25, 2022Publication date: June 1, 2023Inventors: Qing De XIA, Klaus Heinz GOEBEL, Jun LIU, Matan LEVY, Yan LU, Joy PODDAR
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Patent number: 11652781Abstract: A data processing method based on a mobile edge computing (MEC) platform includes receiving a target data packet transmitted by a terminal, determining whether the target data packet includes a network service header (NSH) tag, and when determining that the target data packet includes the NSH tag, transmitting the target data packet to a target MEC platform corresponding to the NSH tag for data processing.Type: GrantFiled: March 4, 2021Date of Patent: May 16, 2023Assignee: LENOVO (BEIJING) CO., LTD.Inventors: Yan Lu, Liangliang Ma, Min Ji, Feiyu Zeng
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Publication number: 20230138038Abstract: Disclosed in some examples are methods, systems, and machine-readable mediums which determine jitter buffer delay by inputting jitter buffer and currently observed network status information to a machine learned model that is trained using a reinforcement learning (RL) method. The model maps these inputs to an action to compress, stretch, or hold the jitter buffer delay, which is used by a recipient computing device to optimize the jitter buffer delay. The model may be trained using a simulator that uses network traces of past real streaming sessions (e.g., communication sessions) of users. By training the model through reinforcement learning, the model learns to make better decisions through reinforcement in the form of reward signals that reflect the performance of each decision.Type: ApplicationFiled: December 30, 2022Publication date: May 4, 2023Inventors: Xiulian Peng, Vinod Prakash, Xiangyu Kong, Sriram Srinivasan, Yan Lu
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Publication number: 20230114417Abstract: Steel for glass lining, comprising the following chemical elements in mass percent: C: 0.015-0.060%, Si: 0.01-0.50%, Mn: 0.20-1.5%, P: 0.005-0.10%, Al: 0.010-0.070%, Ti: 0.10-0.30%, and the balance of Fe and other inevitable impurities. The microstructure of the steel for glass lining is a ferrite or a combination of a ferrite and a cementite. In addition, also disclosed is a production method for steel for glass lining, comprising the steps of (1) smelting, refining, and continuous casting to obtain a slab; (2) heating, the heating temperature being 1050-1250° C.; (3) hot rolling, the final temperature of hot rolling being controlled to be 800-920° C.; (4) cooling; and (5) thermal treatment. The steel for glass lining has excellent machinability and low temperature toughness, and also has excellent lining performance.Type: ApplicationFiled: February 23, 2021Publication date: April 13, 2023Applicant: BAOSHAN IRON & STEEL CO., LTD.Inventors: Quanshe SUN, Shijie YAO, Yan LU, Junkai WANG, Qin QIN
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Patent number: 11625521Abstract: A method for debugging a logic system design including a target module to be debugged. The method includes receiving a first gate-level netlist associated with the logic system design and a second gate-level netlist associated with the target module that are generated based on a description of the logic system design, obtaining runtime information of an input signal of the target module by running the first gate-level netlist, and obtaining runtime information of the target module by running the second gate-level netlist based on the runtime information of the input signal of the target module.Type: GrantFiled: September 2, 2021Date of Patent: April 11, 2023Assignee: XEPIC CORPORATION LIMITEDInventor: Yan Lu
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Patent number: 11622875Abstract: An intestinal barrier sleeve release system includes a tubular housing having a first opening at one end and a second opening at the other end. A tubular sleeve to be released is disposed in the housing. A release body connected to the one end of the tubular sleeve is disposed at the first opening of the housing and is made of a material that can be dissolved and absorbed in human intestines. An inner sheath, a middle sheath and an outer sheath are sequentially set and move relative to each other. The inner sheath and the middle sheath are operated to move axially, the release body is disengaged from the housing, and the tubular sleeve moves out of the housing and is released at a specified position of the human intestines.Type: GrantFiled: June 28, 2017Date of Patent: April 11, 2023Assignee: HANGZHOU TANGJI MEDICAL TECHNOLOGY CO., LTD.Inventors: Yuxing Zuo, Yan Lu
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Patent number: D991914Type: GrantFiled: November 19, 2021Date of Patent: July 11, 2023Assignee: NOD STUDIO LIMITEDInventor: Yan Lu