Abstract: A phase shifter is provided. The phase shifter includes a plurality of phase shift units coupled in sequence. At least one phase shift unit of the plurality of phase shift units includes: a first conductive structure and a second conductive structure. The first conductive structure includes at least one first transmission line, and a second transmission line connected to the at least one first transmission line, the second transmission line being configured as an inductive load. The second conductive structure includes at least one third transmission line, each third transmission line being configured to form a capacitor with a first transmission line. The first transmission line, the third transmission line and the capacitor constitute at least a portion of a phase shift communication path of the phase shifter.

Abstract: A method of making a chip includes depositing a first polysilicon layer on a top surface and a bottom surface of a substrate. The method further includes patterning the first polysilicon layer to define a recess, wherein the first polysilicon layer is completed removed from the recess. The method further includes implanting dopants into the substrate to define an implant region. The method further includes depositing a contact etch stop layer (CESL) in the recess, wherein the CESL covers the implant region. The method further includes patterning the CESL to define a CESL block. The method further includes forming a waveguide and a grating in the substrate. The method further includes forming an interconnect structure over the waveguide, the grating and the CESL block. The method further includes etching the interconnect structure to define a cavity aligned with the grating.

Abstract: The present disclosure provides a phased array antenna, including a waveguide radiation unit, a phase shifter unit and a waveguide power dividing unit, a radiation patch and a first waveguide feed structure in the waveguide radiation unit are the same in number, and a first transmission port of each first waveguide feed structure is arranged corresponding to the radiation patch; the waveguide power dividing unit includes second waveguide feed structures, and a first transmission port of each second waveguide feed structure corresponds to a second feed region of at least one phase shifter; each of the first waveguide feed structure and the second waveguide feed structures includes a ridge waveguide structure; the ridge waveguide structure is provided with at least one sidewall; defining a waveguide cavity of the ridge waveguide structure; at least one ridge protruding toward the waveguide cavity is arranged on the at least one sidewall.

Abstract: According to implementations of the present disclosure, there is provided a context-based image coding solution. According to the solution, a reference image of a target image is obtained. A contextual feature representation is extracted from the reference image, the contextual feature representation characterizing contextual information associated with the target image. Conditional encoding or conditional decoding is performed on the target image based on the contextual feature representation. In this way, the enhancement of the performance is achieved in terms of the reconstruction quality and the compression efficiency.

Abstract: A balun structure and an electronic device. The balun structure includes: a dielectric substrate; a first grounding conductive layer, a first transmission line, a second transmission line, and a third transmission line, wherein at least one coupling structure is connected in series between a first end and a second end of the third transmission line. The coupling structure includes a first coupling part and a second coupling part, wherein in the same coupling structure, one end of the first coupling part facing the second coupling part has at least one first branch line, and one end of the second coupling part facing the first coupling part has at least one second branch line; and in the same coupling structure, the first branch line of the first coupling part is in coupling connection with the second branch line of the second coupling part.

Abstract: The present disclosure provides a waveguide conversion device and wireless communication system. The waveguide conversion device includes: a waveguide cavity including a waveguide transmission cavity and a waveguide back cavity facing each other; a base substrate between the waveguide transmission cavity and the waveguide back cavity, the base substrate including at least a first substrate; and a conversion module on the first substrate and including a balanced antenna, a first differential strip-line and a second differential strip-line, wherein the balanced antenna is in a region where the waveguide transmission cavity faces the waveguide back cavity, the balanced antenna includes a first output port and a second output port; a first end of the first differential strip-line is connected to the first output port of the balanced antenna, and a first end of the second differential strip-line is connected to the second output port of the balanced antenna.

Abstract: An optical waveguide structure of a semiconductor photonic device includes a first semiconductor waveguide, a second semiconductor waveguide, and an air seam between the first and second semiconductor waveguides. The semiconductor waveguides extend in a first direction, and a plurality of air seams extend in a second direction. Each of the air seams is disposed between two adjacent semiconductor waveguides. A distance between the two adjacent semiconductor waveguides is less than a width of each semiconductor waveguide.

Abstract: The present disclosure provides a method for manufacturing a board-to-board connection structure. The method includes defining a first through hole in a first circuit board, disposing a first connector within the first through hole by a first conductive paste, and connecting the first connector to a second circuit board on which a second connector is installed, thereby realizing a connection of the two circuit boards, and reducing a height of the two circuit boards after the connection. That is, the height of the board-to-board connection structure is reduced. Additionally, since the first connector is received within the first through hole, the first connector is not easy to be damaged and oxidized. The present disclosure further provides a board-to-board connection structure manufactured by the above method.

Abstract: A semiconductor device includes a substrate, a fin structure and an isolation layer formed on the substrate and adjacent to the fin structure. The semiconductor device includes a gate structure formed on at least a portion of the fin structure and the isolation layer. The semiconductor device includes an epitaxial layer including a strained material that provides stress to a channel region of the fin structure. The epitaxial layer has a first region and a second region, in which the first region has a first doping concentration of a first doping agent and the second region has a second doping concentration of a second doping agent. The first doping concentration is greater than the second doping concentration. The epitaxial layer is doped by ion implantation using phosphorous dimer.

Abstract: An autonomous vehicle longitudinal-and-lateral control method for preventing motion sickness is disclosed. Firstly, a vehicle dynamics model is established, and the current vehicle travelling state and road surface information are determined according to the vehicle dynamics model. After the vehicle travelling state and road surface information are acquired, the desired velocity, desired acceleration, and desired wheel turning angle are output according to a driver model for reducing occurrence of motion sickness while ensuring safety and efficiency, to carry out longitudinal-and-lateral control of the vehicle.

Abstract: An optical integrated circuit (IC) structure includes: a substrate including a fiber slot formed in an upper surface of the substrate and extending from an edge of the substrate, and an undercut formed in the upper surface and extending from the fiber slot; a semiconductor layer disposed on the substrate; a dielectric structure disposed on the semiconductor layer; an interconnect structure disposed in the dielectric structure; a plurality of vents that extend through a coupling region of the dielectric structure and expose the undercut; a fiber cavity that extends through the coupling region of dielectric structure and exposes the fiber slot; and a barrier ring disposed in the dielectric structure, the barrier ring surrounding the interconnect structure and routed around the perimeter of the coupling region.

Abstract: Provided is a method for analyzing oil film multi-field coupling characteristics of series friction pairs of an axial piston pump in the disclosure. According to the disclosure, based on an oil film independent analysis model of macro structures, motion states and heterogeneities of service conditions of three major friction pairs of the axial piston pair, surface microstructures of the friction pairs is introduced, and a solid-liquid-thermal multi-field coupling analysis method of the friction pairs is proposed for macro information interaction. Finally, a coupling solution of the oil film bearing characteristics of the multi-friction pairs of the system is realized by the multi-scale and multi-degree-of-freedom hydraulic-dynamic global coupling method.

Abstract: Provided is a method for analyzing oil film multi-field coupling characteristics of series friction pairs of an axial piston pump in the disclosure. According to the disclosure, based on an oil film independent analysis model of macro structures, motion states and heterogeneities of service conditions of three major friction pairs of the axial piston pair, surface microstructures of the friction pairs is introduced, and a solid-liquid-thermal multi-field coupling analysis method of the friction pairs is proposed for macro information interaction. Finally, a coupling solution of the oil film bearing characteristics of the multi-friction pairs of the system is realized by the multi-scale and multi-degree-of-freedom hydraulic-dynamic global coupling method.

Abstract: An autonomous vehicle and a system and method for operating the autonomous vehicle. The system includes a sensor and a processor. A disturbance force or yaw moment is received on the autonomous vehicle. The sensor measures a position of the autonomous vehicle within a lane of a road with respect to road boundaries and lane markings. The processor is configured to resist an effect of a disturbance force or yaw moment received on the autonomous vehicle. The processor minimizes a tracking error between a path of the autonomous vehicle and an initial track lane, wherein resisting the effect creates an inflection point in the path of the autonomous vehicle, establishes a final track lane at a closer of a lateral position of the inflection point and a lane center to the initial track lane, and tracks the path to the final track lane.

Abstract: A circuit board, with inbuilt protection against incoming and outgoing electromagnetic interference (EMI), includes an insulating adhesive portion, a first signal line, and a second signal line. The first signal line and the second signal line are surrounded and separated by an electromagnetic shielding film against EMI. The insulating adhesive portion fills a gap between the first signal line and the electromagnetic shielding film and a gap between the second signal line and the electromagnetic shielding film. External interference with signals in the circuit board is reduced, mutual interference between the first signal line and the second signal line is reduced, and electromagnetic radiation of the circuit board is also reduced. A method for manufacturing the circuit board is also disclosed.

Abstract: Various embodiments of the present disclosure are directed towards a semiconductor package comprising optically coupled integrated circuit (IC) chips. A first IC chip and a second IC chip overlie a substrate at a center of the substrate. A photonic chip overlies the first and second IC chips and is electrically coupled to the second IC chip. A laser device chip overlies the substrate, adjacent to the photonic chip and the second IC chip, at a periphery of the substrate. The photonic chip is configured to modulate a laser beam from the laser device chip in accordance with an electrical signal from the second IC chip and to provide the modulated laser beam to the first IC chip. This facilitates optical communication between the first IC chip to the second IC chip. Various embodiments of the present disclosure are further directed towards simultaneously aligning and bonding constituents of the semiconductor package.

Abstract: A method of manufacturing a circuit board assembly, including: providing a circuit substrate, the circuit substrate having a base layer, a wiring layer formed on the base layer, and a conductive casing formed on the wiring layer, the conductive casing defining a cavity for exposing the wiring layer; mounting an electronic component in the cavity, the electronic component electrically connected to the exposed wiring layer; filling a heat conductive medium in the cavity, the electronic component immersed in the heat conductive medium; forming a conductive cover on the conductive casing, the conductive cover enclosing the conductive casing.

Abstract: Innovations in adaptive encoding of screen content based on motion type are described. For example, a video encoder system receives a current picture of a video sequence. The video encoder system determines a current motion type for the video sequence and, based at least in part on the current motion type, sets one or more encoding parameters. Then, the video encoder system encodes the current picture according to the encoding parameter(s). The innovations can be used in real-time encoding scenarios when encoding screen content for a screen sharing application, desktop conferencing application, or other application. In some cases, the innovations allow a video encoder system to adapt compression to different characteristics of screen content at different times within the same video sequence.

Abstract: An optical integrated circuit (IC) structure includes: a substrate including a fiber slot formed in an upper surface of the substrate and extending from an edge of the substrate, and an undercut formed in the upper surface and extending from the fiber slot; a semiconductor layer disposed on the substrate; a dielectric structure disposed on the semiconductor layer; an interconnect structure disposed in the dielectric structure; a plurality of vents that extend through a coupling region of the dielectric structure and expose the undercut; a fiber cavity that extends through the coupling region of dielectric structure and exposes the fiber slot; and a barrier ring disposed in the dielectric structure, the barrier ring surrounding the interconnect structure and routed around the perimeter of the coupling region.

Abstract: A semiconductor device is provided. The semiconductor device includes a waveguide over a first dielectric layer. A first portion of the waveguide has a first width and a second portion of the waveguide has a second width larger than the first width. The semiconductor device includes a first doped semiconductor structure and a second doped semiconductor structure. The second portion of the waveguide is between the first doped semiconductor structure and the second doped semiconductor structure.