Abstract: Information for assisting a doctor based on the oxygen saturation of an observation target is presented. An endoscope system includes a light source device, an image sensor, an oxygen saturation calculation unit, a distribution pattern generation unit, a disease state score calculation unit, and a monitor. The light source device emits light to irradiate the observation target. The image sensor images the observation target with reflected light of the light, and outputs an image signal. The oxygen saturation calculation unit calculates an oxygen saturation of the observation target based on the image signal. The distribution pattern generation unit generates a distribution pattern showing the distribution of the oxygen saturation. The disease state score calculation unit calculates a disease state score indicating the disease state of the observation target based on the distribution pattern. The monitor displays the disease state score or information based on the disease state score.

Abstract: A phase contrast microscope includes: an illumination light emission unit that emits illumination light for phase difference measurement to a container in which a liquid and an observation target are contained; an imaging unit that images the observation target irradiated with the illumination light; an adjustment optical system that adjusts refraction of the illumination light due to a liquid surface shape of the liquid in the container; a liquid surface shape estimation unit that estimates the liquid surface shape of the liquid in the container based on a brightness distribution of a phase difference image of the observation target captured by the imaging unit; and an adjustment information acquisition unit that acquires adjustment information for adjusting optical characteristics of the adjustment optical system based on the liquid surface shape estimated by the liquid surface shape estimation unit.

Abstract: An endoscope system includes a light source unit, an image sensor, an image signal obtaining section, a vessel position signal generator, a vessel width signal generator, and a vessel image signal generator. The light source unit generates illumination light. The image sensor captures an image of an object of interest irradiated with the illumination light. The image signal obtaining section obtains an image signal, which represents the object, from the image sensor. The vessel position signal generator generates a vessel position signal, which represents the position of a blood vessel of the object, from the image signal. The vessel width signal generator generates a vessel width signal, which represents the width of the blood vessel, from the image signal. The vessel image signal generator generates a vessel image signal, which represents the blood vessel, from the vessel position signal and the vessel width signal.

Abstract: A liquid surface in a culture vessel is irradiated with liquid-surface-measurement illumination light, and transmitted light that has passed through the liquid is detected by an imaging unit. A relative positional relationship between a focal plane of an image forming optical system and the culture vessel is changed, a detection signal for each position of the focal plane is obtained, and a liquid surface shape is estimated on the basis of the detection signal for each position of the focal plane. Then, on the basis of the estimated liquid surface shape, adjustment information for adjusting the optical characteristics of an adjustment optical system for adjusting refraction of light due to the liquid surface shape is acquired. After the optical characteristics of the adjustment optical system have been adjusted on the basis of the adjustment information, an image of a specimen is captured by irradiating the culture vessel with phase-contrast-measurement illumination light.

Abstract: There are provided an endoscope system processor device, an endoscope system, an operation method for an endoscope system processor device, and an operation method for an endoscope system for calculating objective diagnostic information, which is easier to understand than the oxygen saturation, based on the oxygen saturation. The endoscope system processor device includes: a receiving unit that receives an image signal obtained by imaging an observation target with an endoscope; an oxygen saturation calculation unit that calculates an oxygen saturation based on the image signal; a pixel specification unit that specifies an out-of-range pixel in which the oxygen saturation deviates from a specific range set in advance; and a diagnostic information calculation unit that calculates diagnostic information as a numerical value using information of the out-of-range pixel.

Abstract: There are provided an endoscope system, a processor device, an operation method, and a distance measurement device for accurately measuring the observation distance even if a colorant or residues are present in a subject. An endoscope system 10 includes a light source device 14, an endoscope 12, and an observation distance measurement unit 63. The light source device 14 emits signal light, which has a wavelength band absorbed by hemoglobin contained in the subject, to the subject. The endoscope 12 has an image sensor 48 that images the subject with reflected light of the signal light and outputs an image signal. The observation distance measurement unit 63 measures the observation distance based on the image signal.

Abstract: Information for assisting a doctor based on the oxygen saturation of an observation target is presented. An endoscope system includes a light source device, an image sensor, an oxygen saturation calculation unit, a distribution pattern generation unit, a disease state score calculation unit, and a monitor. The light source device emits light to irradiate the observation target. The image sensor images the observation target with reflected light of the light, and outputs an image signal. The oxygen saturation calculation unit calculates an oxygen saturation of the observation target based on the image signal. The distribution pattern generation unit generates a distribution pattern showing the distribution of the oxygen saturation. The disease state score calculation unit calculates a disease state score indicating the disease state of the observation target based on the distribution pattern. The monitor displays the disease state score or information based on the disease state score.

Abstract: An endoscope system includes a light source unit, an image sensor, an image signal obtaining section, a vessel position signal generator, a vessel width signal generator, and a vessel image signal generator. The light source unit generates illumination light. The image sensor captures an image of an object of interest irradiated with the illumination light. The image signal obtaining section obtains an image signal, which represents the object, from the image sensor. The vessel position signal generator generates a vessel position signal, which represents the position of a blood vessel of the object, from the image signal. The vessel width signal generator generates a vessel width signal, which represents the width of the blood vessel, from the image signal. The vessel image signal generator generates a vessel image signal, which represents the blood vessel, from the vessel position signal and the vessel width signal.

Abstract: There are provided an endoscope system processor device, an endoscope system, an operation method for an endoscope system processor device, and an operation method for an endoscope system for calculating objective diagnostic information, which is easier to understand than the oxygen saturation, based on the oxygen saturation. The endoscope system processor device includes: a receiving unit that receives an image signal obtained by imaging an observation target with an endoscope; an oxygen saturation calculation unit that calculates an oxygen saturation based on the image signal; a pixel specification unit that specifies an out-of-range pixel in which the oxygen saturation deviates from a specific range set in advance; and a diagnostic information calculation unit that calculates diagnostic information as a numerical value using information of the out-of-range pixel.

Abstract: A semiconductor storage device 100 includes a controller package 110 having a BGA terminal on a bottom surface thereof; and one or a plurality of memory packages 120 each including a plurality of semiconductor storage elements and mounted on the controller package. The controller package includes a bottom substrate having the BGA terminal on a bottom surface thereof; a power supply IC, mounted on the bottom substrate, for supplying a plurality of power supplies; and a controller mounted on the bottom substrate and operable by the plurality of power supplies supplied from the power supply IC. The controller provides an interface with an external system via the BGA terminal and controls a read operation from the semiconductor storage elements and a write operation to the semiconductor storage elements.

Abstract: A semiconductor storage device 100 includes a controller package 110 having a BGA terminal on a bottom surface thereof; and one or a plurality of memory packages 120 each including a plurality of semiconductor storage elements and mounted on the controller package. The controller package includes a bottom substrate having the BGA terminal on a bottom surface thereof; a power supply IC, mounted on the bottom substrate, for supplying a plurality of power supplies; and a controller mounted on the bottom substrate and operable by the plurality of power supplies supplied from the power supply IC. The controller provides an interface with an external system via the BGA terminal and controls a read operation from the semiconductor storage elements and a write operation to the semiconductor storage elements.

Abstract: A method of manufacturing a semiconductor device and a semiconductor device including a first semiconductor element mounted on a first surface of a base plate, wherein solder balls are formed on a second opposite surface of the base plate—such that the second opposite surface includes an area without solder balls. At least one second semiconductor element is mounted to the base plate at the area of the second surface without solder balls. The at least one semiconductor element may be mounted to the base plate using low molecular adhesive, or in the alternative, high temperature solder.

Abstract: A BGA substrate which has a back surface to which a heat radiating plate is attached and an opening for accommodating a relay wiring substrate therein, which is provided in the center of its surface, is used. The relay wiring substrate to which an ASIC chip and a memory chip are flip-chip connected, is bonded to the heat radiating plate in the opening with a thermal conductive bonding material. Further, each of the back surfaces of the ASIC chip and the memory chip is connected to a metal cap for sealing the opening through a thermal conductive material interposed therebetween.

Abstract: A method of manufacturing a semiconductor device and a semiconductor device including a first semiconductor element mounted on a first surface of a base plate, wherein solder balls are formed on a second opposite surface of the base plate—such that the second opposite surface includes an area without solder balls. At least one second semiconductor element is mounted to the base plate at the area of the second surface without solder balls. The at least one semiconductor element may be mounted to the base plate using low molecular adhesive, or in the alternative, high temperature solder.

Abstract: A method of manufacturing a semiconductor device and a semiconductor device including a first semiconductor element mounted on a first surface of a base plate, wherein solder balls are formed on a second opposite surface of the base plate-such that the second opposite surface includes an area without solder balls. At least one second semiconductor element is mounted to the base plate at the area of the second surface without solder balls. The at least one semiconductor element may be mounted to the base plate using low molecular adhesive, or in the alternative, high temperature solder.

Abstract: A BGA substrate which has a back surface to which a heat radiating plate is attached and an opening for accommodating a relay wiring substrate therein, which is provided in the center of its surface, is used. The relay wiring substrate to which an ASIC chip and a memory chip are flip-chip connected, is bonded to the heat radiating plate in the opening with a thermal conductive bonding material. Further, each of the back surfaces of the ASIC chip and the memory chip is connected to a metal cap for sealing the opening through a thermal conductive material interposed therebetween.

Abstract: A semiconductor apparatus includes a semiconductor device to be mounted on a circuit board; a plurality of conductive posts electrically connected to the semiconductor device; and a plurality of conductive bumps each provided on an outer end of each of the conductive posts, so that the plurality of conductive bump is soldered onto the circuit board when the semiconductor device is mounted on the circuit board. A distance between a peripheral edge of the semiconductor device and an outer edge of the conductive post is determined to be narrow so that a solderbility or wetting condition of the conductive bumps can be visibly recognized easily.

Abstract: A BGA substrate which has a back surface to which a heat radiating plate is attached and an opening for accommodating a relay wiring substrate therein, which is provided in the center of its surface, is used. The relay wiring substrate to which an ASIC chip and a memory chip are flip-chip connected, is bonded to the heat radiating plate in the opening with a thermal conductive bonding material. Further, each of the back surfaces of the ASIC chip and the memory chip is connected to a metal cap for sealing the opening through a thermal conductive material interposed therebetween.

Abstract: A method of manufacturing a semiconductor device and a semiconductor device including a first semiconductor element mounted on a first surface of a base plate, wherein solder balls are formed on a second opposite surface of the base plate-such that the second opposite surface includes an area without solder balls. At least one second semiconductor element is mounted to the base plate at the area of the second surface without solder balls. The at least one semiconductor element may be mounted to the base plate using low molecular adhesive, or in the alternative, high temperature solder.

Abstract: A semiconductor device 10 includes a silicon substrate 20 having a first interconnection layer 24, a second interconnection layer 26, and grooves 22 provided at the second main surface 20b. Mounted on the substrate 20 are one or more semiconductor chips 30 having chip external terminals 32 electrically connected to the first interconnection layer; and one or more peripheral chips 40 electrically connected to the first interconnection layer on the silicon substrate. By the provision of the grooves 22, the heat radiating property is improved.