Abstract: A semiconductor device with a lightly doped drain and a method of manufacturing the same are provide. The method includes the step of providing a semiconductor substrate having a first area and a second area. A gate dielectric layer and a conductive layer are subsequently formed on the semiconductor substrate. The conductive layer is then selectively removed so that a first gate electrode is formed on the gate dielectric layer corresponding to the first area, and a portion of remains of the conductive layer substantially overlies the second area. A first impurity of first conduction type is then doped in the first area. A spacer is formed on a sidewall of the first gate electrode. A second impurity of first conduction type is doped in the first area to form a thin film transistor of first conduction type. A patterned mask layer defining a second gate electrode of the conductive layer corresponding to the second area is formed over the semiconductor substrate.

Abstract: A top emission organic light emitting display with a reflective layer therein is provided. The reflective layer, a first electrode, an organic layer, and a transparent second electrode are subsequently formed on the substrate. When a bias voltage is applied to the first electrode and the transparent second electrode, the organic layer emits radiation. The reflective layer reflects radiation from the organic layer toward the transparent second electrode, and therefore the emission efficiency of the OLED increases.

Abstract: A method for fabricating a thin film transistor array and driving circuit comprising the steps of: providing a substrate; patterning a polysilicon layer and an N+ thin film over the substrate to form a plurality of islands; patterning the islands to form P+ doped regions; patterning out source/drain terminals and the lower electrode of a storage capacitor; etching back the N+ thin film; patterning out a gate and the upper electrode of the storage capacitor and patterning a passivation layer and a conductive layer to form pixel electrodes and a wiring layout.

Abstract: A method of silicon crystallization that includes providing an insulated substrate, depositing a layer of amorphous silicon over the substrate, crystallizing the layer of amorphous silicon in an oxygen environment for a reduced surface roughness on the layer of crystallized silicon, and oxidizing the layer of amorphous silicon simultaneously with crystallizing the layer of amorphous silicon to form a layer of gate insulator.

Abstract: A method of transferring a thin film device onto a plastic sheet. A silver-containing buffer layer is formed on a glass substrate. A transferred layer including a thin film device is formed on part of the silver-containing buffer layer. At least one first hole penetrates the transferred layer and an edge of the silver-containing buffer layer is exposed. A first plastic layer including at least one second hole is adhered to the transferred layer with a removable glue, wherein the second hole corresponds to the first hole, and part of the first plastic layer is located above the edge of the silver-containing buffer layer. The silver-containing buffer layer is oxidized to expand, thereby separating the silver-containing buffer layer from the transferred layer. A second plastic layer is adhered to the transferred layer. The removable glue is eliminated to remove the first plastic layer.

Abstract: An LCD panel is provided, the LCD panel having a substrate, a conductive layer positioned on the substrate, and a dielectric layer disposed on the surface of the conductive layer. First, a photoresist layer with an opening is formed on the dielectric layer. An etching process is then performed to form a contact hole along the opening. After that, a post treatment process is performed to form a protective layer to reduce damage on the conductive layer when the photoresist layer is stripped.