Patents by Inventor Yen-Cheng Liu

Yen-Cheng Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230086723
    Abstract: In an embodiment, a processor may include an execution engine to execute a plurality of instructions, a memory to store a tagged data structure comprising a plurality of entries, and an eviction circuit. The eviction circuit may be to: generate a pseudo-random number responsive to an eviction request for the tagged data structure; in response to a determination that the pseudo-random number is outside of a valid eviction range for the plurality of entries, generate an alternative identifier by rotating through the valid eviction range, the valid eviction range comprising a range of numbers that are valid to identify victim entries of the tagged data structure; and evict a victim entry from the tagged data structure, the victim entry associated with the alternative identifier. Other embodiments are described and claimed.
    Type: Application
    Filed: September 23, 2021
    Publication date: March 23, 2023
    Inventors: Yongmei Zhang, Yedidya Hilewitz, Yen-Cheng Liu
  • Publication number: 20230091205
    Abstract: Methods and apparatus relating to memory side prefetch architecture for improved memory bandwidth are described. In an embodiment, logic circuitry transmits a Direct Memory Controller Prefetch (DMCP) request to cause a prefetch of data from memory. A memory controller receives the DMCP request and issues a plurality of read operations to the memory in response to the DMCP request. Data read from the memory is stored in a storage structure in response to the plurality of read operations. Other embodiments are also disclosed and claimed.
    Type: Application
    Filed: September 20, 2021
    Publication date: March 23, 2023
    Applicant: Intel Corporation
    Inventors: Adrian Moga, Ugonna Echeruo, Eduard Roytman, Krishnakanth Sistla, Joseph Nuzman, Brinda Ganesh, Meenakshisundaram Chinthamani, Yen-Cheng Liu, Sai Prashanth Muralidhara, Vivek Kozhikkottu, Hanna Alam, Narasimha Sridhar Srirangam
  • Patent number: 11604730
    Abstract: A processor, including a core; and a cache-coherent memory fabric coupled to the core and having a primary cache agent (PCA) configured to provide a primary access path; and a secondary cache agent (SCA) configured to provide a secondary access path that is redundant to the primary access path, wherein the PCA has a coherency controller configured to maintain data in the secondary access path coherent with data in the main access path.
    Type: Grant
    Filed: July 27, 2020
    Date of Patent: March 14, 2023
    Assignee: Intel Corporation
    Inventors: Rahul Pal, Philip Abraham, Ajaya Durg, Bahaa Fahim, Yen-Cheng Liu, Sanilkumar Mm
  • Patent number: 11591211
    Abstract: A method of manufacturing a semiconductive structure includes receiving a first substrate; disposing an interconnection layer on the first substrate; forming a plurality of conductors over the interconnection layer; filing gaps between the plurality of conductors with a film; forming a barrier layer over the film; removing the barrier layer; and partially removing the film to expose a portion of the interconnection and leave a portion of the interconnection layer covered by the film.
    Type: Grant
    Filed: October 7, 2019
    Date of Patent: February 28, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD.
    Inventors: Yen-Cheng Liu, Cheng-Yu Hsieh, Shang-Ying Tsai, Kuei-Sung Chang
  • Patent number: 11586579
    Abstract: Methods and apparatuses relating to hardware processors with multiple interconnected dies are described. In one embodiment, a hardware processor includes a plurality of physically separate dies, and an interconnect to electrically couple the plurality of physically separate dies together. In another embodiment, a method to create a hardware processor includes providing a plurality of physically separate dies, and electrically coupling the plurality of physically separate dies together with an interconnect.
    Type: Grant
    Filed: October 28, 2021
    Date of Patent: February 21, 2023
    Assignee: Intel Corporation
    Inventors: Nevine Nassif, Yen-Cheng Liu, Krishnakanth V. Sistla, Gerald Pasdast, Siva Soumya Eachempati, Tejpal Singh, Ankush Varma, Mahesh K. Kumashikar, Srikanth Nimmagadda, Carleton L. Molnar, Vedaraman Geetha, Jeffrey D. Chamberlain, William R. Halleck, George Z. Chrysos, John R. Ayers, Dheeraj R. Subbareddy
  • Patent number: 11537520
    Abstract: Disclosed embodiments relate to remote atomic operations (RAO) in multi-socket systems. In one example, a method, performed by a cache control circuit of a requester socket, includes: receiving the RAO instruction from the requester CPU core, determining a home agent in a home socket for the addressed cache line, providing a request for ownership (RFO) of the addressed cache line to the home agent, waiting for the home agent to either invalidate and retrieve a latest copy of the addressed cache line from a cache, or to fetch the addressed cache line from memory, receiving an acknowledgement and the addressed cache line, executing the RAO instruction on the received cache line atomically, subsequently receiving multiple local RAO instructions to the addressed cache line from one or more requester CPU cores, and executing the multiple local RAO instructions on the received cache line independently of the home agent.
    Type: Grant
    Filed: October 5, 2021
    Date of Patent: December 27, 2022
    Assignee: Intel Corporation
    Inventors: Doddaballapur N. Jayasimha, Samantika S. Sury, Christopher J. Hughes, Jonas Svennebring, Yen-Cheng Liu, Stephen R. Van Doren, David A. Koufaty
  • Patent number: 11513957
    Abstract: Methods and apparatus implementing Hardware/Software co-optimization to improve performance and energy for inter-VM communication for NFVs and other producer-consumer workloads. The apparatus include multi-core processors with multi-level cache hierarchies including and L1 and L2 cache for each core and a shared last-level cache (LLC). One or more machine-level instructions are provided for proactively demoting cachelines from lower cache levels to higher cache levels, including demoting cachelines from L1/L2 caches to an LLC. Techniques are also provided for implementing hardware/software co-optimization in multi-socket NUMA architecture system, wherein cachelines may be selectively demoted and pushed to an LLC in a remote socket. In addition, techniques are disclosure for implementing early snooping in multi-socket systems to reduce latency when accessing cachelines on remote sockets.
    Type: Grant
    Filed: September 21, 2020
    Date of Patent: November 29, 2022
    Assignee: Intel Corporation
    Inventors: Ren Wang, Andrew J. Herdrich, Yen-cheng Liu, Herbert H. Hum, Jong Soo Park, Christopher J. Hughes, Namakkal N. Venkatesan, Adrian C. Moga, Aamer Jaleel, Zeshan A. Chishti, Mesut A. Ergin, Jr-shian Tsai, Alexander W. Min, Tsung-yuan C. Tai, Christian Maciocco, Rajesh Sankaran
  • Patent number: 11500636
    Abstract: Disclosed embodiments relate to spatial and temporal merging of remote atomic operations.
    Type: Grant
    Filed: February 24, 2020
    Date of Patent: November 15, 2022
    Assignee: Intel Corporation
    Inventors: Christopher J. Hughes, Joseph Nuzman, Jonas Svennebring, Doddaballapur N. Jayasimha, Samantika S. Sury, David A. Koufaty, Niall D. McDonnell, Yen-Cheng Liu, Stephen R. Van Doren, Stephen J. Robinson
  • Publication number: 20220261002
    Abstract: The described positional awareness techniques employing sensory data gathering and analysis hardware with reference to specific example implementations implement improvements in the use of sensors, techniques and hardware design that can enable specific embodiments to find new area to cover by a robot encountering an unexpected obstacle traversing an area in which the robot is performing an area coverage task. The sensory data are gathered from an operational camera and one or more auxiliary sensors.
    Type: Application
    Filed: April 25, 2022
    Publication date: August 18, 2022
    Applicant: Trifo, Inc.
    Inventors: Zhe ZHANG, Weikai LI, Qingyu CHEN, Yen-Cheng LIU
  • Patent number: 11314262
    Abstract: The described positional awareness techniques employing sensory data gathering and analysis hardware with reference to specific example implementations implement improvements in the use of sensors, techniques and hardware design that can enable specific embodiments to find new area to cover by a robot encountering an unexpected obstacle traversing an area in which the robot is performing an area coverage task. The sensory data are gathered from an operational camera and one or more auxiliary sensors.
    Type: Grant
    Filed: February 21, 2020
    Date of Patent: April 26, 2022
    Assignee: Trifo, Inc.
    Inventors: Zhe Zhang, Weikai Li, Qingyu Chen, Yen-Cheng Liu
  • Publication number: 20220114122
    Abstract: A physical layer (PHY) is coupled to a serial, differential link that is to include a number of lanes. The PHY includes a transmitter and a receiver to be coupled to each lane of the number of lanes. The transmitter coupled to each lane is configured to embed a clock with data to be transmitted over the lane, and the PHY periodically issues a blocking link state (BLS) request to cause an agent to enter a BLS to hold off link layer flit transmission for a duration. The PHY utilizes the serial, differential link during the duration for a PHY associated task selected from a group including an in-band reset, an entry into low power state, and an entry into partial width state.
    Type: Application
    Filed: December 20, 2021
    Publication date: April 14, 2022
    Applicant: Intel Corporation
    Inventors: Robert J. Safranek, Robert G. Blankenship, Venkatraman Iyer, Jeff Willey, Robert Beers, Darren S. Jue, Arvind A. Kumar, Debendra Das Sharma, Jeffrey C. Swanson, Bahaa Fahim, Vedaraman Geetha, Aaron T. Spink, Fulvio Spagna, Rahul R. Shah, Sitaraman V. Iyer, William Harry Nale, Abhishek Das, Simon P. Johnson, Yuvraj S. Dhillon, Yen-Cheng Liu, Raj K. Ramanujan, Robert A. Maddox, Herbert H. Hum, Ashish Gupta
  • Patent number: 11294852
    Abstract: Methods and apparatuses relating to hardware processors with multiple interconnected dies are described. In one embodiment, a hardware processor includes a plurality of physically separate dies, and an interconnect to electrically couple the plurality of physically separate dies together. In another embodiment, a method to create a hardware processor includes providing a plurality of physically separate dies, and electrically coupling the plurality of physically separate dies together with an interconnect.
    Type: Grant
    Filed: June 30, 2020
    Date of Patent: April 5, 2022
    Assignee: Intel Corporation
    Inventors: Nevine Nassif, Yen-Cheng Liu, Krishnakanth V. Sistla, Gerald Pasdast, Siva Soumya Eachempati, Tejpal Singh, Ankush Varma, Mahesh K. Kumashikar, Srikanth Nimmagadda, Carleton L. Molnar, Vedaraman Geetha, Jeffrey D. Chamberlain, William R. Halleck, George Z. Chrysos, John R. Ayers, Dheeraj R. Subbareddy
  • Patent number: 11294850
    Abstract: In one embodiment, a system on chip includes: a plurality of intellectual property (IP) agents formed on a semiconductor die; a mesh interconnect formed on the semiconductor die to couple the plurality of IP agents, and a plurality of mesh stops each to couple one or more of the plurality of IP agents to the mesh interconnect. The mesh interconnect may be formed of a plurality of rows each having one of a plurality of horizontal interconnects and a plurality of columns each having one of a plurality of vertical interconnects;, where at least one of the plurality of rows includes an asymmetrical number of mesh stops. Other embodiments are described and claimed.
    Type: Grant
    Filed: March 29, 2019
    Date of Patent: April 5, 2022
    Assignee: Intel Corporation
    Inventors: Brinda Ganesh, Yen-Cheng Liu, Swadesh Choudhary, Tejpal Singh, Pradeep Prabhakaran, Monam Agarwal
  • Publication number: 20220091983
    Abstract: Disclosed embodiments relate to remote atomic operations (RAO) in multi-socket systems. In one example, a method, performed by a cache control circuit of a requester socket, includes: receiving the RAO instruction from the requester CPU core, determining a home agent in a home socket for the addressed cache line, providing a request for ownership (RFO) of the addressed cache line to the home agent, waiting for the home agent to either invalidate and retrieve a latest copy of the addressed cache line from a cache, or to fetch the addressed cache line from memory, receiving an acknowledgement and the addressed cache line, executing the RAO instruction on the received cache line atomically, subsequently receiving multiple local RAO instructions to the addressed cache line from one or more requester CPU cores, and executing the multiple local RAO instructions on the received cache line independently of the home agent.
    Type: Application
    Filed: October 5, 2021
    Publication date: March 24, 2022
    Inventors: Doddaballapur N. Jayasimha, Samantika S. Sury, Christopher J. Hughes, Jonas Svennebring, Yen-Cheng Liu, Stephen R. Van Doren, David A. Koufaty
  • Patent number: 11269793
    Abstract: A physical layer (PHY) is coupled to a serial, differential link that is to include a number of lanes. The PHY includes a transmitter and a receiver to be coupled to each lane of the number of lanes. The transmitter coupled to each lane is configured to embed a clock with data to be transmitted over the lane, and the PHY periodically issues a blocking link state (BLS) request to cause an agent to enter a BLS to hold off link layer flit transmission for a duration. The PHY utilizes the serial, differential link during the duration for a PHY associated task selected from a group including an in-band reset, an entry into low power state, and an entry into partial width state.
    Type: Grant
    Filed: July 23, 2020
    Date of Patent: March 8, 2022
    Assignee: Intel Corporation
    Inventors: Robert J. Safranek, Robert G. Blankenship, Venkatraman Iyer, Jeff Willey, Robert Beers, Darren S. Jue, Arvind A. Kumar, Debendra Das Sharma, Jeffrey C. Swanson, Bahaa Fahim, Vedaraman Geetha, Aaron T. Spink, Fulvio Spagna, Rahul R. Shah, Sitaraman V. Iyer, William Harry Nale, Abhishek Das, Simon P. Johnson, Yuvraj S. Dhillon, Yen-Cheng Liu, Raj K. Ramanujan, Robert A. Maddox, Herbert H. Hum, Ashish Gupta
  • Patent number: 11256657
    Abstract: In one embodiment, an apparatus includes an interconnect to couple a plurality of processing circuits. The interconnect may include a pipe stage circuit coupled between a first processing circuit and a second processing circuit. This pipe stage circuit may include: a pipe stage component having a first input to receive a signal via the interconnect and a first output to output the signal; and a selection circuit having a first input to receive the signal from the first output of the pipe stage component and a second input to receive the signal via a bypass path, where the selection circuit is dynamically controllable to output the signal received from the first output of the pipe stage component or the signal received via the bypass path. Other embodiments are described and claimed.
    Type: Grant
    Filed: March 26, 2019
    Date of Patent: February 22, 2022
    Assignee: Intel Corporation
    Inventors: Tejpal Singh, Yedidya Hilewitz, Ankush Varma, Yen-Cheng Liu, Krishnakanth V. Sistla, Jeffrey Chamberlain
  • Publication number: 20220050805
    Abstract: Methods and apparatuses relating to hardware processors with multiple interconnected dies are described. In one embodiment, a hardware processor includes a plurality of physically separate dies, and an interconnect to electrically couple the plurality of physically separate dies together. In another embodiment, a method to create a hardware processor includes providing a plurality of physically separate dies, and electrically coupling the plurality of physically separate dies together with an interconnect.
    Type: Application
    Filed: October 28, 2021
    Publication date: February 17, 2022
    Inventors: NEVINE NASSIF, YEN-CHENG LIU, KRISHNAKANTH V. SISTLA, GERALD PASDAST, SIVA SOUMYA EACHEMPATI, TEJPAL SINGH, ANKUSH VARMA, MAHESH K. KUMASHIKAR, SRIKANTH NIMMAGADDA, CARLETON L. MOLNAR, VEDARAMAN GEETHA, JEFFREY D. CHAMBERLAIN, WILLIAM R. HALLECK, GEORGE Z. CHRYSOS, JOHN R. AYERS, DHEERAJ R. SUBBAREDDY
  • Patent number: 11144108
    Abstract: A method and apparatus to monitor architecture events is disclosed. The architecture events are linked together via a push bus mechanism with each architectural event having a designated time slot. There is at least one branch of the push bus in each core. Each branch of the push bus may monitor one core with all the architectural events. All the data collected from the events by the push bus is then sent to a power control unit.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: October 12, 2021
    Assignee: INTEL CORPORATION
    Inventors: Yen-Cheng Liu, P. Keong Or, Krishnakanth V. Sistla, Ganapati Srinivasa
  • Patent number: 11138112
    Abstract: Disclosed embodiments relate to remote atomic operations (RAO) in multi-socket systems. In one example, a method, performed by a cache control circuit of a requester socket, includes: receiving the RAO instruction from the requester CPU core, determining a home agent in a home socket for the addressed cache line, providing a request for ownership (RFO) of the addressed cache line to the home agent, waiting for the home agent to either invalidate and retrieve a latest copy of the addressed cache line from a cache, or to fetch the addressed cache line from memory, receiving an acknowledgement and the addressed cache line, executing the RAO instruction on the received cache line atomically, subsequently receiving multiple local RAO instructions to the addressed cache line from one or more requester CPU cores, and executing the multiple local RAO instructions on the received cache line independently of the home agent.
    Type: Grant
    Filed: April 11, 2019
    Date of Patent: October 5, 2021
    Assignee: Intel Corporation
    Inventors: Doddaballapur N. Jayasimha, Samantika S. Sury, Christopher J. Hughes, Jonas Svennebring, Yen-Cheng Liu, Stephen R. Van Doren, David A. Koufaty
  • Publication number: 20210224190
    Abstract: Examples described herein relate to programming a memory rule for a home agent, wherein the programming a memory rule for a home agent comprises: receiving at least one memory rule programming and based on a cluster associated with the home agent, configuring a memory rule register using a memory rule programming from among the at least one memory rule programming. In some examples, receiving at least one memory rule programming includes receiving a first memory rule programming and receiving a second memory rule programming. In some examples, a mask is applied to reject the first memory rule programming; and applying the mask to accept the second memory rule programming and program the memory rule for the home agent.
    Type: Application
    Filed: April 6, 2021
    Publication date: July 22, 2021
    Inventors: Vinit MATHEW ABRAHAM, Yen-Cheng LIU