Patents by Inventor Yen-Cheng Liu

Yen-Cheng Liu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210064117
    Abstract: A method and apparatus to monitor architecture events is disclosed. The architecture events are linked together via a push bus mechanism with each architectural event having a designated time slot. There is at least one branch of the push bus in each core. Each branch of the push bus may monitor one core with all the architectural events. All the data collected from the events by the push bus is then sent to a power control unit.
    Type: Application
    Filed: November 13, 2020
    Publication date: March 4, 2021
    Inventors: Yen-Cheng LIU, P. Keong OR, Krishnakanth V. SISTLA, Ganapati SRINIVASA
  • Patent number: 10936490
    Abstract: Method and apparatus for per-agent control and quality of service of shared resources in a chip multiprocessor platform is described herein. One embodiment of a system includes: a plurality of core and non-core requestors of shared resources, the shared resources to be provided by one or more resource providers, each of the plurality of core and non-core requestors to be associated with a resource-monitoring tag and a resource-control tag; a mapping table to store the resource monitoring and control tags associated with each non-core requestor; and a tagging circuitry to receive a resource request sent from a non-core requestor to a resource provider, the tagging circuitry to responsively modify the resource request to include the resource-monitoring and resource-control tags associated with the non-core requestor in accordance to the mapping table and send the modified resource request to the resource provider.
    Type: Grant
    Filed: June 27, 2017
    Date of Patent: March 2, 2021
    Assignee: Intel Corporation
    Inventors: Andrew J. Herdrich, Edwin Verplanke, Stephen R. Van Doren, Ravishankar Iyer, Eric R. Wehage, Rupin H. Vakharwala, Rajesh M. Sankaran, Jeffrey D. Chamberlain, Julius Mandelblat, Yen-Cheng Liu, Stephen T. Palermo, Tsung-Yuan C. Tai
  • Patent number: 10925032
    Abstract: Aspects of the disclosure provide a method and device performing input bit allocation that includes receiving broadcasting information bits, generating timing related bits for the broadcasting information bits, and selecting a portion of the generated timing related bits. The method and device can further include allocating each of the selected timing related bits to selected input bits of an encoder, so that each of the selected timing related bits is allocated to an input bit of the encoder corresponding to an available bit channel of the encoder where the selected inputs bits of the encoder correspond to encoded bits that are located in a front portion of the encoded bits.
    Type: Grant
    Filed: October 2, 2018
    Date of Patent: February 16, 2021
    Assignee: MEDIATEK INC.
    Inventors: Wei-De Wu, Chia-Wei Tai, Yen-Cheng Liu
  • Publication number: 20210004328
    Abstract: Methods and apparatus implementing Hardware/Software co-optimization to improve performance and energy for inter-VM communication for NFVs and other producer-consumer workloads. The apparatus include multi-core processors with multi-level cache hierarchies including and L1 and L2 cache for each core and a shared last-level cache (LLC). One or more machine-level instructions are provided for proactively demoting cachelines from lower cache levels to higher cache levels, including demoting cachelines from L1/L2 caches to an LLC. Techniques are also provided for implementing hardware/software co-optimization in multi-socket NUMA architecture system, wherein cachelines may be selectively demoted and pushed to an LLC in a remote socket. In addition, techniques are disclosure for implementing early snooping in multi-socket systems to reduce latency when accessing cachelines on remote sockets.
    Type: Application
    Filed: September 21, 2020
    Publication date: January 7, 2021
    Inventors: Ren Wang, Andrew J. Herdrich, Yen-cheng Liu, Herbert H. Hum, Jong Soo Park, Christopher J. Hughes, Namakkal N. Venkatesan, Adrian C. Moga, Aamer Jaleel, Zeshan A. Chishti, Mesut A. Ergin, Jr-shian Tsai, Alexander W. Min, Tsung-yuan C. Tai, Christian Maciocco, Rajesh Sankaran
  • Patent number: 10867836
    Abstract: A semiconductor device includes a first wafer and a second wafer. The first wafer has a top portion. The second wafer is disposed on the top portion of the first wafer, wherein the second wafer has a bottom portion bonded on the top portion of the first wafer, and a non-bonded area of the bottom portion has a width smaller than 0.5 mm. The bottom portion of the second wafer has a size smaller than or equal to that of the top portion of the first wafer. In some embodiments, the top portion of the first wafer has first rounded corners, and the bottom portion of the second wafer has second corners. A cross-sectional view of each of the second rounded corners has a radius smaller than that of each of first rounded corners. In some embodiments, the bottom portion of the second wafer has right angle corners.
    Type: Grant
    Filed: July 26, 2016
    Date of Patent: December 15, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Kuei-Sung Chang, Ching-Ray Chen, Yen-Cheng Liu, Shang-Ying Tsai
  • Publication number: 20200356502
    Abstract: A physical layer (PHY) is coupled to a serial, differential link that is to include a number of lanes. The PHY includes a transmitter and a receiver to be coupled to each lane of the number of lanes. The transmitter coupled to each lane is configured to embed a clock with data to be transmitted over the lane, and the PHY periodically issues a blocking link state (BLS) request to cause an agent to enter a BLS to hold off link layer flit transmission for a duration.
    Type: Application
    Filed: July 23, 2020
    Publication date: November 12, 2020
    Applicant: Intel Corporation
    Inventors: Robert J. Safranek, Robert G. Blankenship, Venkatraman Iyer, Jeff Willey, Robert Beers, Darren S. Jue, Arvind A. Kumar, Debendra Das Sharma, Jeffrey C. Swanson, Bahaa Fahim, Vedaraman Geetha, Aaron T. Spink, Fulvio Spagna, Rahul R. Shah, Sitaraman V. Iyer, William Harry Nale, Abhishek Das, Simon P. Johnson, Yuvraj S. Dhillon, Yen-Cheng Liu, Raj K. Ramanujan, Robert A. Maddox, Herbert H. Hum, Ashish Gupta
  • Patent number: 10817425
    Abstract: Methods and apparatus implementing Hardware/Software co-optimization to improve performance and energy for inter-VM communication for NFVs and other producer-consumer workloads. The apparatus include multi-core processors with multi-level cache hierarchies including and L1 and L2 cache for each core and a shared last-level cache (LLC). One or more machine-level instructions are provided for proactively demoting cachelines from lower cache levels to higher cache levels, including demoting cachelines from L1/L2 caches to an LLC. Techniques are also provided for implementing hardware/software co-optimization in multi-socket NUMA architecture system, wherein cachelines may be selectively demoted and pushed to an LLC in a remote socket. In addition, techniques are disclosure for implementing early snooping in multi-socket systems to reduce latency when accessing cachelines on remote sockets.
    Type: Grant
    Filed: December 26, 2014
    Date of Patent: October 27, 2020
    Assignee: Intel Corporation
    Inventors: Ren Wang, Andrew J. Herdrich, Yen-cheng Liu, Herbert H. Hum, Jong Soo Park, Christopher J. Hughes, Namakkal N. Venkatesan, Adrian C. Moga, Aamer Jaleel, Zeshan A. Chishti, Mesut A. Ergin, Jr-shian Tsai, Alexander W. Min, Tsung-yuan C. Tai, Christian Maciocco, Rajesh Sankaran
  • Publication number: 20200334196
    Abstract: Methods and apparatuses relating to hardware processors with multiple interconnected dies are described. In one embodiment, a hardware processor includes a plurality of physically separate dies, and an interconnect to electrically couple the plurality of physically separate dies together. In another embodiment, a method to create a hardware processor includes providing a plurality of physically separate dies, and electrically coupling the plurality of physically separate dies together with an interconnect.
    Type: Application
    Filed: June 30, 2020
    Publication date: October 22, 2020
    Inventors: NEVINE NASSIF, YEN-CHENG LIU, KRISHNAKANTH V. SISTLA, GERALD PASDAST, SIVA SOUMYA EACHEMPATI, TEJPAL SINGH, ANKUSH VARMA, MAHESH K. KUMASHIKAR, SRIKANTH NIMMAGADDA, CARLETON L. MOLNAR, VEDARAMAN GEETHA, JEFFREY D. CHAMBERLAIN, WILLIAM R. HALLECK, GEORGE Z. CHRYSOS, JOHN R. AYERS, DHEERAJ R. SUBBAREDDY
  • Publication number: 20200327084
    Abstract: An interface for coupling an agent to a fabric supports a set of coherent interconnect protocols and includes a global channel to communicate control signals to support the interface, a request channel to communicate messages associated with requests to other agents on the fabric, a response channel to communicate responses to other agents on the fabric, and a data channel to couple to communicate messages associated with data transfers to other agents on the fabric, where the data transfers include payload data.
    Type: Application
    Filed: June 27, 2020
    Publication date: October 15, 2020
    Inventors: Swadesh Choudhary, Robert G. Blankenship, Siva Prasad Gadey, Sailesh Kumar, Vinit Mathew Abraham, Yen-Cheng Liu
  • Publication number: 20200319886
    Abstract: Disclosed embodiments relate to spatial and temporal merging of remote atomic operations.
    Type: Application
    Filed: February 24, 2020
    Publication date: October 8, 2020
    Applicant: Intel Corporation
    Inventors: Christopher J. Hughes, Joseph Nuzman, Jonas Svennebring, Doddaballapur N. Jayasimha, Samantika S. Sury, David A. Koufaty, Niall D. McDonnell, Yen-Cheng Liu, Stephen R. Van Doren, Stephen J. Robinson
  • Patent number: 10795853
    Abstract: Methods and apparatuses relating to hardware processors with multiple interconnected dies are described. In one embodiment, a hardware processor includes a plurality of physically separate dies, and an interconnect to electrically couple the plurality of physically separate dies together. In another embodiment, a method to create a hardware processor includes providing a plurality of physically separate dies, and electrically coupling the plurality of physically separate dies together with an interconnect.
    Type: Grant
    Filed: September 30, 2017
    Date of Patent: October 6, 2020
    Assignee: Intel Corporation
    Inventors: Nevine Nassif, Yen-Cheng Liu, Krishnakanth V. Sistla, Gerald Pasdast, Siva Soumya Eachempati, Tejpal Singh, Ankush Varma, Mahesh K. Kumashikar, Srikanth Nimmagadda, Carleton L. Molnar, Vedaraman Geetha, Jeffrey D. Chamberlain, William R. Halleck, George Z. Chrysos, John R. Ayers, Dheeraj R. Subbareddy
  • Publication number: 20200311018
    Abstract: In one embodiment, an apparatus includes an interconnect to couple a plurality of processing circuits. The interconnect may include a pipe stage circuit coupled between a first processing circuit and a second processing circuit. This pipe stage circuit may include: a pipe stage component having a first input to receive a signal via the interconnect and a first output to output the signal; and a selection circuit having a first input to receive the signal from the first output of the pipe stage component and a second input to receive the signal via a bypass path, where the selection circuit is dynamically controllable to output the signal received from the first output of the pipe stage component or the signal received via the bypass path. Other embodiments are described and claimed.
    Type: Application
    Filed: March 26, 2019
    Publication date: October 1, 2020
    Inventors: Tejpal Singh, Yedidya Hilewitz, Ankush Varma, Yen-Cheng Liu, Krishnakanth V. Sistla, Jeffrey Chamberlain
  • Publication number: 20200301830
    Abstract: Examples described herein relate to processor circuitry to issue a cache coherence message to a central processing unit (CPU) cluster by selection of a target cluster and issuance of the request to the target cluster, wherein the target cluster comprises the cluster or the target cluster is directly connected to the cluster. In some examples, the selected target cluster is associated with a minimum number of die boundary traversals. In some examples, the processor circuitry is to read an address range for the cluster to identify the target cluster using a single range check over memory regions including local and remote clusters. In some examples, issuance of the cache coherence message to a cluster is to cause the cache coherence message to traverse one or more die interconnections to reach the target cluster.
    Type: Application
    Filed: June 5, 2020
    Publication date: September 24, 2020
    Inventors: Vinit MATHEW ABRAHAM, Jeffrey D. CHAMBERLAIN, Yen-Cheng LIU, Eswaramoorthi NALLUSAMY, Soumya S. EACHEMPATI
  • Patent number: 10705961
    Abstract: A processor includes a cache-side address monitor unit corresponding to a first cache portion of a distributed cache that has a total number of cache-side address monitor storage locations less than a total number of logical processors of the processor. Each cache-side address monitor storage location is to store an address to be monitored. A core-side address monitor unit corresponds to a first core and has a same number of core-side address monitor storage locations as a number of logical processors of the first core. Each core-side address monitor storage location is to store an address, and a monitor state for a different corresponding logical processor of the first core. A cache-side address monitor storage overflow unit corresponds to the first cache portion, and is to enforce an address monitor storage overflow policy when no unused cache-side address monitor storage location is available to store an address to be monitored.
    Type: Grant
    Filed: September 27, 2013
    Date of Patent: July 7, 2020
    Assignee: Intel Corporation
    Inventors: Yen-Cheng Liu, Bahaa Fahim, Erik G. Hallnor, Jeffrey D. Chamberlain, Stephen R. Van Doren, Antonio Juan
  • Publication number: 20200192388
    Abstract: The described positional awareness techniques employing sensory data gathering and analysis hardware with reference to specific example implementations implement improvements in the use of sensors, techniques and hardware design that can enable specific embodiments to find new area to cover by a robot encountering an unexpected obstacle traversing an area in which the robot is performing an area coverage task. The sensory data are gathered from an operational camera and one or more auxiliary sensors.
    Type: Application
    Filed: February 21, 2020
    Publication date: June 18, 2020
    Applicant: Trifo, Inc.
    Inventors: Zhe ZHANG, Weikai LI, Qingyu CHEN, Yen-Cheng LIU
  • Patent number: 10571925
    Abstract: The described positional awareness techniques employing sensory data gathering and analysis hardware with reference to specific example implementations implement improvements in the use of sensors, techniques and hardware design that can enable specific embodiments to find new area to cover by a robot performing an area coverage task of an unexplored area. The sensory data are gathered from an operational camera and one or more auxiliary sensors.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: February 25, 2020
    Assignee: Trifo, Inc.
    Inventors: Zhe Zhang, Weikai Li, Qingyu Chen, Yen-Cheng Liu
  • Patent number: 10571926
    Abstract: The described positional awareness techniques employing sensory data gathering and analysis hardware with reference to specific example implementations implement improvements in the use of sensors, techniques and hardware design that can enable specific embodiments to find new area to cover by a robot encountering an unexpected obstacle traversing an area in which the robot is performing an area coverage task. The sensory data are gathered from an operational camera and one or more auxiliary sensors.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: February 25, 2020
    Assignee: Trifo, Inc.
    Inventors: Zhe Zhang, Weikai Li, Qingyu Chen, Yen-Cheng Liu
  • Patent number: 10572260
    Abstract: Disclosed embodiments relate to spatial and temporal merging of remote atomic operations.
    Type: Grant
    Filed: December 29, 2017
    Date of Patent: February 25, 2020
    Assignee: Intel Corporation
    Inventors: Christopher J. Hughes, Joseph Nuzman, Jonas Svennebring, Doddaballapur N. Jayasimha, Samantika S. Sury, David A. Koufaty, Niall D. McDonnell, Yen-Cheng Liu, Stephen R. Van Doren, Stephen J. Robinson
  • Publication number: 20200031662
    Abstract: A method of manufacturing a semiconductive structure includes receiving a first substrate; disposing an interconnection layer on the first substrate; forming a plurality of conductors over the interconnection layer; filing gaps between the plurality of conductors with a film; forming a barrier layer over the film; removing the barrier layer; and partially removing the film to expose a portion of the interconnection and leave a portion of the interconnection layer covered by the film.
    Type: Application
    Filed: October 7, 2019
    Publication date: January 30, 2020
    Inventors: YEN-CHENG LIU, CHENG-YU HSIEH, SHANG-YING TSAI, KUEI-SUNG CHANG
  • Publication number: 20190391939
    Abstract: A physical layer (PHY) is coupled to a serial, differential link that is to include a number of lanes. The PHY includes a transmitter and a receiver to be coupled to each lane of the number of lanes. The transmitter coupled to each lane is configured to embed a clock with data to be transmitted over the lane, and the PHY periodically issues a blocking link state (BLS) request to cause an agent to enter a BLS to hold off link layer flit transmission for a duration.
    Type: Application
    Filed: February 25, 2019
    Publication date: December 26, 2019
    Applicant: Intel Corporation
    Inventors: Robert J. Safranek, Robert G. Blankenship, Venkatraman Iyer, Jeff Willey, Robert Beers, Darren S. Jue, Arvind A. Kumar, Debendra Das Sharma, Jeffrey C. Swanson, Bahaa Fahim, Vedaraman Geetha, Aaron T. Spink, Fulvio Spagna, Rahul R. Shah, Sitaraman V. Iyer, William Harry Nale, Abhishek Das, Simon P. Johnson, Yuvraj S. Dhillon, Yen-Cheng Liu, Raj K. Ramanujan, Robert A. Maddox, Herbert H. Hum, Ashish Gupta