Patents by Inventor Yi An SHIH

Yi An SHIH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8486592
    Abstract: A radiation-sensitive material comprising a support and a radiation sensitive composition on the support is disclosed, wherein the radiation sensitive composition includes a dispersion containing nanoparticles of a sensitizer.
    Type: Grant
    Filed: March 22, 2010
    Date of Patent: July 16, 2013
    Assignee: ISP Investments Inc.
    Inventors: Hsiao-Yi Shih, Guojin Lu, David F. Lewis, Xiang Yu
  • Patent number: 8453716
    Abstract: An exemplary heat dissipation device includes a heat pipe and a fin unit. The heat pipe includes an evaporation section and a condensing section formed at opposite ends thereof, respectively. The fin unit includes plural stacked parallel fins. Each of the fins defines a through hole therein for receiving the condensing section of the heat pipe. A flange extends from a periphery of the through hole. The flange defines two slits to divide the flange into two separate portions. The slits communicate with the through hole. A compressible structure is formed in each fin at opposite sides of the through hole. The compressible structure is aligned with the slits such that when the fin is compressed along a direction transverse to the alignment, the compressible structure is compressed and the separate portions of the flange move toward each other and closely contact the condensing section of the heat pipe.
    Type: Grant
    Filed: July 8, 2010
    Date of Patent: June 4, 2013
    Assignees: Furui Precise Component (Kunshan) Co., Ltd., Foxconn Technology Co., Ltd.
    Inventors: Yi-Shih Hsieh, Rui-Wen Sun
  • Publication number: 20130108393
    Abstract: A screw assembly includes a screw, a spring, and a mounting panel. The screw comprises a head portion and a shaft portion extending from the head portion. The spring comprises a spring body and a securing end extending from the spring body. The spring body defines a surrounding opening. The mounting panel defines a through hole corresponding to the surrounding opening. The mounting panel comprises a positioning portion. The shaft portion is located in the surrounding opening and the through hole. The spring is located between the head portion and the mounting panel. The positioning portion is configured to resist the securing end to prevent the spring from rotating.
    Type: Application
    Filed: July 10, 2012
    Publication date: May 2, 2013
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: PEI-HSI WONG, CHING-YI SHIH
  • Publication number: 20130081787
    Abstract: A heat pipe includes a sealed casing, a sealed vesicle received in the sealed casing, and a working fluid contained in the sealed vesicle. The sealed casing includes an evaporating section, a condensing section, and a connecting section connecting the evaporating section and the condensing section. The sealed vesicle is made of soft metal. The sealed vesicle comprising a heat absorbing portion attached to the evaporating section, a heat dissipating portion attached to the condensing section, and an uneven portion connecting the heat absorbing portion and the condensing section.
    Type: Application
    Filed: June 26, 2012
    Publication date: April 4, 2013
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventor: YI-SHIH HSIEH
  • Publication number: 20130068426
    Abstract: A heat dissipation device includes a centrifugal fan and a fin assembly aside the centrifugal fan. The centrifugal fan includes a casing and an impeller received in the casing, the casing defines an air outlet at one side thereof. The fin assembly is located at the air outlet of the centrifugal fan. The fin assembly includes a plurality of fins parallel to and spaced from each other. Each of the fins includes a main body and an extending portion extending form the main body toward the air outlet of the centrifugal fan. Each extending portion includes a side edge facing the air outlet of the centrifugal fan, the side edge is arc shaped and inwardly concaved toward the main body.
    Type: Application
    Filed: December 21, 2011
    Publication date: March 21, 2013
    Applicant: HON HAI PRECISION INDUSTRY CO., LTD.
    Inventors: CHIH-HAO YANG, LI-KAN YEH, CHING-YI SHIH
  • Patent number: 8385442
    Abstract: A transmitter and the method therefor are provided. The transmitter is applied in an orthogonal frequency division multiplexing (OFDM) based or other multicarrier communication systems. The transmitter uses N sub-carriers. Among the N sub-carriers, L sub-carriers (or tones) are reserved for PAPR reduction. L is less than N. The method includes the following steps. Original frequency domain data symbols are generated and fed into the reserved-tone symbol generation unit. The reserved-tone symbols are generated by using pure frequency domain signal processing. Then the reserved-tone symbols are combined with original data symbols to generate combined PAPR reduction signal. The resultant PAPR reduction signal can be fed into reserved-tone symbol generation unit iteratively to obtain updated reserved-tone symbols. For proper iterations, the original data symbols combined with L frequency domain reserved-tone symbols will result in lower PAPR transmit signal.
    Type: Grant
    Filed: December 21, 2009
    Date of Patent: February 26, 2013
    Assignee: Industrial Technology Research Institute
    Inventors: Jia-Hao Wu, Yun-Yi Shih, Pang-An Ting, Ming-Che Lin
  • Publication number: 20120328054
    Abstract: A signal receiving method of a receiver includes the following steps. A time-domain received signal is transformed into a frequency-domain received signal, which includes multiple pilot symbols and multiple data symbols. Multiple channel impulse responses corresponding to the pilot symbols are estimated. Multiple inter-carrier interference and inter-block interference (ICIIBI) values corresponding to the pilot symbols are estimated based on the pilot symbols and the corresponding channel impulse responses. Multiple ICIIBI values corresponding to the data symbols are obtained via an interpolation operation according to the ICIIBI values corresponding to the pilot symbols. The estimated corresponding ICIIBI values are cancelled from the data symbols. The interference-cancelled data symbols are demapped to obtain soft-decision or hard-decision bits.
    Type: Application
    Filed: June 22, 2011
    Publication date: December 27, 2012
    Applicant: MaxRise Inc.
    Inventor: Shih-Yi SHIH
  • Publication number: 20120250121
    Abstract: The present invention provides a holographic storage apparatus comprising a polarizing beam splitter configured to split an incoming beam into an object beam and a reference beam; a first spatial light modulator configured to modulate the object beam with an array of data; a second spatial light modulator configured to phase modulate the reference beam with an orthogonal phase function; a holographic medium configured to record an interference pattern between the modulated object beam and the modulated reference beam; a first image sensor configured to read an image of the modulated object beam; and a second image sensor configured to read an image of the modulated reference beam.
    Type: Application
    Filed: May 8, 2012
    Publication date: October 4, 2012
    Inventors: Tin Maung Aye, Tomasz Jannson, Andrew Kostrzewski, Min-Yi Shih
  • Publication number: 20120156583
    Abstract: A dual-material co-injection molded bipolar plate and its manufacturing method are disclosed, in which the manufacturing method comprises the steps of: injecting a skin polymer melt containing a first conductive material into a mold cavity of a bipolar plate mold; sequential or simultaneous injecting a core polymer melt containing a second conductive and the skin polymer melt into the mold cavity; molding a bipolar plate, being a sandwich structure having a core layer packed inside a skin layer, while enabling a conductive grid composed of the first conductive material and the second conductive material to be formed between the core layer and the skin layer for improving the through-plane conductivity of the bipolar plate.
    Type: Application
    Filed: May 9, 2011
    Publication date: June 21, 2012
    Applicant: CHUNG YUAN CHRISTIAN UNIVERSITY
    Inventors: Shia-Chung Chen, Hsin-Shu Peng, Ming-Yi Shih
  • Patent number: 8199387
    Abstract: The present invention provides a holographic storage apparatus comprising a polarizing beam splitter configured to split an incoming beam into an object beam and a reference beam; a first spatial light modulator configured to modulate the object beam with an array of data; a second spatial light modulator configured to phase modulate the reference beam with an orthogonal phase function; a holographic medium configured to record an interference pattern between the modulated object beam and the modulated reference beam; a first image sensor configured to read an image of the modulated object beam; and a second image sensor configured to read an image of the modulated reference beam.
    Type: Grant
    Filed: September 14, 2009
    Date of Patent: June 12, 2012
    Assignee: Physical Optics Corporation
    Inventors: Tin Maung Aye, Tomasz Jannson, Andrew Kostrzewski, Min-Yi Shih
  • Publication number: 20120021340
    Abstract: A fabrication method for enhancing the electrical conductivity of bipolar plates, adapted for laminating a three-layered structure that is constructed by sandwiching a bonding layer made of a conductive material between two bipolar plates made of a thermoplastic polymer composite, is disclosed, which comprises the steps of: using an induction coil to heat up the bonding layer; and exerting a pressure upon the two bipolar plates for laminating the bonding layer to the two bipolar plates. With the aforesaid method, not only the through-plane conductivity with regard to the two bipolar plates can be enhanced, but also the processing time is greatly reduced.
    Type: Application
    Filed: June 22, 2011
    Publication date: January 26, 2012
    Applicant: CHUNG YUAN CHRISTIAN UNIVERSITY
    Inventors: Shia-Chung Chen, Jen-An Chang, Ming-Yi Shih
  • Publication number: 20110297356
    Abstract: An exemplary heat dissipation device includes a heat pipe and a fin unit. The heat pipe includes an evaporation section and a condensing section formed at opposite ends thereof, respectively. The fin unit includes plural stacked parallel fins. Each of the fins defines a through hole therein for receiving the condensing section of the heat pipe. A flange extends from a periphery of the through hole. The flange defines two slits to divide the flange into two separate portions. The slits communicate with the through hole. A compressible structure is formed in each fin at opposite sides of the through hole. The compressible structure is aligned with the slits such that when the fin is compressed along a direction transverse to the alignment, the compressible structure is compressed and the separate portions of the flange move toward each other and closely contact the condensing section of the heat pipe.
    Type: Application
    Filed: July 8, 2010
    Publication date: December 8, 2011
    Applicants: FOXCONN TECHNOLOGY CO., LTD., FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD.
    Inventors: YI-SHIH HSIEH, RUI-WEN SUN
  • Publication number: 20110235280
    Abstract: A heat dissipation apparatus includes a heat sink and fasteners. The heat sink defines a plurality of through holes therein. An inner thread is formed on an inner surface of each through hole. Each fastener includes a bolt and a spring around the bolt. The bolt includes a main post, a cap formed on a top of the main post, and a engaging portion formed on a bottom of the main post. A retaining thread is formed on an outer surface of the main post near the engaging portion. The retaining thread matches the inner thread of the through hole. The retaining thread of the main post is configured to pass through the through hole by threading the retaining thread though the inner thread of the through hole. After the retaining thread has passed through the through hole, the retaining thread abuts a bottom surface of the heat sink.
    Type: Application
    Filed: April 22, 2010
    Publication date: September 29, 2011
    Applicant: FOXCONN TECHNOLOGY CO., LTD.
    Inventor: YI-SHIH HSIEH
  • Publication number: 20110235301
    Abstract: A heat dissipation apparatus includes a base plate and a plurality of fasteners. A plurality of mounting arms extends outwardly from the base plate. Each mounting arm defines a through hole therein. An inner thread is formed on an inner surface of each through hole. Each fastener includes a main post, a cap formed at a top of the main post, and an engaging portion formed at a bottom of the main post. A retaining thread is formed on an outer surface of the main post adjacent the engaging portion. The retaining thread matches the inner thread of the through hole of the corresponding mounting arm. The retaining thread is passable through the through hole of the mounting arm by threadingly passing the retaining thread through the inner thread of the through hole of the mounting arm whereupon the fastener remains preassembled in the through hole.
    Type: Application
    Filed: April 22, 2010
    Publication date: September 29, 2011
    Applicants: FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: YI-SHIH HSIEH, YONG-JIAN WANG
  • Patent number: 7990321
    Abstract: A multiband antenna is located on a substrate and comprises a first radiator, a second radiator, a feeding portion, a grounding portion and a third radiation. The first radiator transmits at least two frequency band signals. The second radiator is connected to the first radiator, and is arranged so as to surround the first radiator. The feeding portion feeds electromagnetic signals to the first radiator and the second radiator. The third radiator is located between the grounding portion and the second radiator, and electrically connected to the grounding portion.
    Type: Grant
    Filed: April 10, 2009
    Date of Patent: August 2, 2011
    Assignee: Hon Hai Precision Industry Co., Ltd.
    Inventor: Yen-Yi Shih
  • Publication number: 20110115472
    Abstract: A control circuit for current detection is disclosed. The control circuit outputting an output current to a power device comprises at least one first Field Effect Transistor (FET) coupled to the positive input terminal of an operational amplifier. The first FET is coupled to the power device through two voltage terminals, wherein the output current is passed through the first FET. The control circuit further comprises at least one second FET coupled to the first FET and the negative input terminal of the first operational amplifier, utilizing the virtual-short characteristic of the first operational amplifier to form a current mirror with the first FET, and copying the output current to generate a copy current by a scale whereby the output current is detected by the copy current. The invention detects the output current without consuming additional power so as to measure the power consumption for the power device.
    Type: Application
    Filed: January 7, 2010
    Publication date: May 19, 2011
    Inventors: Yuh-Min Lin, Ho-Yi Shih
  • Publication number: 20110048679
    Abstract: A heat dissipation apparatus includes a flat heat pipe and a plurality of fins stacked together. Each fin defines a substantially rectangular-shaped receiving hole therein for receiving a condenser section of the flat heat pipe and a small-sized accommodating hole therein for accommodating a solder paste. A combining sidewall extends from an edge of the receiving hole, and includes elongated top and bottom planar plates, and a short plate extending from one end of the bottom planar plate towards the top planar plate. The accommodating hole is located at a junction of the top planar plate and the short plate. The solder paste accommodated in the accommodating hole is melted to flow into the receiving hole to fill up a clearance between the flat heat pipe and the combining sidewall to combine the flat heat pipe and the fins together.
    Type: Application
    Filed: October 19, 2009
    Publication date: March 3, 2011
    Applicants: FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: YI-SHIH HSIEH, JIN-JUN RAO
  • Publication number: 20100247899
    Abstract: A radiation-sensitive material comprising a support and a radiation sensitive composition on the support is disclosed, wherein the radiation sensitive composition includes a dispersion containing nanoparticles of a sensitizer.
    Type: Application
    Filed: March 22, 2010
    Publication date: September 30, 2010
    Inventors: Hsiao-Yi Shih, Guojin Lu, David F. Lewis, Xiang Yu
  • Publication number: 20100241911
    Abstract: An address generator of a communication data interleaver and a communication data decoding circuit are provided. The address generator includes a first operation unit and a second operation unit. The first operation unit receives a first parameter and a first operation result. The first operation unit performs a recursive operation according to the first parameter and the first operation result and outputs the first operation result. The second operation unit receives the first operation result, a second operation result, and a second parameter. According to a transmission mode signal, whether the second operation unit generates a second operation result is determined by performing a recursive operation according to the first operation result, the second parameter, and the second operation result, or by calculating the first operation result and the second parameter.
    Type: Application
    Filed: April 6, 2009
    Publication date: September 23, 2010
    Applicant: Industrial Technology Research Institute
    Inventors: Yun-Yi Shih, Chun-Yu Chen, Cheng-Hung Lin, An-Yu Wu
  • Publication number: 20100236760
    Abstract: A heat pipe includes a casing having an inner wall. A plurality of protrusions are radially formed on the inner wall of the casing. The plurality of protrusions are spaced from each other and extend longitudinally from one end of the casing to the other end of the casing. A main groove is defined between every two adjacent protrusions. The protrusions each define a plurality of first auxiliary grooves and a plurality of second auxiliary grooves being alternatively arranged with respect to each other along a longitudinal direction of the casing. The first auxiliary and the second auxiliary grooves each communicate two adjacent main grooves. The first auxiliary grooves each are inclined at an angle with respect to a longitudinal axis of the casing, and the second auxiliary grooves each are inclined at another different angle with respect to the longitudinal axis of the casing.
    Type: Application
    Filed: July 17, 2009
    Publication date: September 23, 2010
    Applicants: FURUI PRECISE COMPONENT (KUNSHAN) CO., LTD., FOXCONN TECHNOLOGY CO., LTD.
    Inventors: YI-SHIH HSIEH, YONG-JIAN WANG