Abstract: With the present invention, buses and silicon IPs are simulated together. A virtual platform is provided for designing hardware and system. And correct and fast simulations of I/Os are provided through the I/Os on a FPGA. Thus, software performances are monitored and system bottlenecks are acquired.

Abstract: A power supplying device includes: an output transformer including first and second output coils for generating first intermediate voltages from an input voltage; a voltage adjusting transformer including primary and secondary coils; a first rectifying-and-filtering circuit connected to the first output coil for generating a first output voltage from the first intermediate voltage obtained from the first output coil; the primary coil being connected in parallel to the first output coil, the secondary coil being connected in series to the second output coil and being coupled to the primary coil for generating a second intermediate voltage from the first intermediate voltage obtained from the first output coil; and a second rectifying-and-filtering circuit connected to the secondary coil for generating a second output voltage from a combined voltage combining the second intermediate voltage obtained from the secondary coil with the first intermediate voltage obtained from the second output coil.

Abstract: The invention provides a method for reading a first data storage of a memory cell. The method comprises sensing a first current of the memory cell by applying a first bit line voltage on the memory cell. When the first current is larger than a first reference current with respect to the first bit line voltage, the first data storage is determined to be at an un-programmed state. Otherwise, a second current of the memory cell is sensed by applying a second bit line voltage on the memory cell. When the difference between the first current and the second current is larger than the difference between the first reference current and the second reference current, the first data storage is determined to be at the un-programmed state.

Abstract: A cable connecting terminal has a conductive column in a terminal box, a plurality of plurality of steel elastic sheets around the conductive column, and arc slots on the conductive column corresponding to the plurality of steel elastic sheets. A conductive end of the cable inserted into the terminal box through the first or second cable hole, the conductive end of the cable is pressed by the pressing portions of the plurality of steel elastic sheets and tightly contacts the arc slot of the conductive column and is secured by the one-way securing portions of the plurality of steel elastic sheets.

Abstract: A memory apparatus and a method thereof for operating a memory are provided herein. The apparatus has the memory and a controller. The memory has a plurality of memory cells, and each the memory cells has a first side and the second side. Each of the first side and the second side is programmable to store one bit of data. The controller programs the first sides and the second sides of the memory cells to different levels. Several threshold voltage distributions of the programmed memory cells could be overlapped with each other. The controller distinguishes the bits of the memory cells by comparing the threshold voltages of the memory cells with the different levels and by comparing the threshold voltages with those of neighbor sides.

Abstract: An electronic device case structure includes a case body, a pivoting seat, a pushing member, and a driving member. An accommodating slot is formed on the case body for a peripheral device to be inserted therein. The case body has a disposition hole communicating with the accommodating slot and an internal space of the case body. The pivoting seat is disposed in the case body, and the pushing member is pivoted to the pivoting seat. The pushing member has a pushing segment, protruding in the accommodating slot through the disposition hole and a connecting segment. The driving member includes a coupling end connected to the connecting segment and an operation end, The operation end is to be pressed to make the driving member move inwards, so as to have the pushing segment to move towards the outside of the accommodating slot, thereby pushing and ejecting the peripheral device.

Abstract: A layer of nanoparticles having a dimension on the order of 10 nm is employed to form a current constricting layer or as a hardmask for forming a current constricting layer from an underlying insulator layer. The nanoparticles are preferably self-aligning and/or self-planarizing on the underlying surface. The current constricting layer may be formed within a bottom conductive plate, within a phase change material layer, within a top conductive plate, or within a tapered liner between a tapered via sidewall and a via plug contains either a phase change material or a top conductive material. The current density of the local structure around the current constricting layer is higher than the surrounding area, thus allowing local temperature to rise higher than surrounding material. The total current required to program the phase change memory device, and consequently the size of a programming transistor, is reduced due to the current constricting layer.

Abstract: Memory devices and methods for operating such devices are described herein. A method as described herein includes applying a bias arrangement to a memory cell to change the resistance state from a higher resistance state to a lower resistance state. The bias arrangement comprises a first voltage pulse and a second voltage pulse across the phase change memory element, the second voltage pulse having a voltage polarity different from that of the first voltage pulse.

Abstract: A layer of nanoparticles having a dimension on the order of 10 nm is employed to form a current constricting layer or as a hardmask for forming a current constricting layer from an underlying insulator layer. The nanoparticles are preferably self-aligning and/or self-planarizing on the underlying surface. The current constricting layer may be formed within a bottom conductive plate, within a phase change material layer, within a top conductive plate, or within a tapered liner between a tapered via sidewall and a via plug contains either a phase change material or a top conductive material. The current density of the local structure around the current constricting layer is higher than the surrounding area, thus allowing local temperature to rise higher than surrounding material. The total current required to program the phase change memory device, and consequently the size of a programming transistor, is reduced due to the current constricting layer.

Abstract: A memory device including a memory cell comprising phase change material is described along with methods for programming the memory device. A method for programming disclosed herein includes determining a data value for the memory cell, and applying a pulse pair to store the data value. The pulse pair includes an initial pulse having a pulse shape adapted to preset the phase change material in the memory cell to a normalizing resistance state, and a subsequent pulse having a pulse shape adapted to set the phase change material from the normalizing resistance state to a resistance corresponding to the determined data value.

Abstract: Memory devices are described along with methods for manufacturing. A memory device as described herein includes a first electrode and a second electrode. The memory device further includes a diode and an anti-fuse metal-oxide memory element comprising aluminum oxide and copper oxide. The diode and the metal-oxide memory element are arranged in electrical series between the first electrode and the second electrode.

Abstract: A multi-level, phase change memory cell has first and second thermal isolation materials having different thermal conductivity properties situated in heat-conducting relation to first and second boundaries of the phase change material. Accordingly, when an electrical current is applied to raise the temperature of the memory material, heat is drawn away from the memory material asymmetrically along a line orthogonal to electric field lines between the electrodes.

Abstract: A phase change memory cell includes first and second electrodes electrically coupled by a phase change element. At least a section of the phase change element comprises a higher reset transition temperature portion and a lower reset transition temperature portion. The lower reset transition temperature portion comprises a phase change region which can be transitioned, by the passage of electrical current therethrough, from generally crystalline to generally amorphous states at a lower temperature than the higher reset transition temperature portion. The phase change element may comprise an outer, generally tubular, higher reset transition temperature portion surrounding an inner, lower reset transition temperature portion.

Abstract: A memory device includes a driver comprising a pn-junction in the form of a multilayer stack including a first doped semiconductor region having a first conductivity type, and a second doped semiconductor region having a second conductivity type opposite the first conductivity type, the first and second doped semiconductors defining a pn-junction therebetween, in which the first doped semiconductor region is formed in a single-crystalline semiconductor, and the second doped semiconductor region includes a polycrystalline semiconductor. Also, a method for making a memory device includes forming a first doped semiconductor region of a first conductivity type in a single-crystal semiconductor, such as on a semiconductor wafer; and forming a second doped polycrystalline semiconductor region of a second conductivity type opposite the first conductivity type, defining a pn-junction between the first and second regions.

Abstract: A memory device includes a driver comprising a pn-junction in the form of a multilayer stack including a first doped semiconductor region having a first conductivity type, and a second doped semiconductor plug having a second conductivity type opposite the first conductivity type, the first and second doped semiconductors defining a pn junction therebetween, in which the first doped semiconductor region is formed in a single-crystalline semiconductor, and the second doped semiconductor region includes a polycrystalline semiconductor. Also, a method for making a memory device includes forming a first doped semiconductor region of a first conductivity type in a single-crystal semiconductor, such as on a semiconductor wafer; and forming a second doped polycrystalline semiconductor region of a second conductivity type opposite the first conductivity type, defining a pn junction between the first and second regions.

Abstract: A method of programming a phase change device includes selecting a desired threshold voltage (Vth) and applying a programming pulse to a phase change material in the phase change device. The applying of the programming pulse includes applying a quantity of energy to the phase change material to drive at least a portion of this material above a melting energy level. A portion of the energy applied to the phase change material is allowed to dissipate below the melting energy level. The shape of the energy dissipation from the phase change material is controlled until the energy applied to the phase change material is less than a quenched energy level, to cause the phase change device to have the desired Vth. A remaining portion of the energy applied to the phase change material is allowed to dissipate to an environmental level.

Abstract: A memory device including a memory cell comprising phase change material is described along with methods for programming the memory device. A method for programming disclosed herein includes determining a data value for the memory cell, and applying a pulse pair to store the data value. The pulse pair includes an initial pulse having a pulse shape adapted to preset the phase change material in the memory cell to a normalizing resistance state, and a subsequent pulse having a pulse shape adapted to set the phase change material from the normalizing resistance state to a resistance corresponding to the determined data value.

Abstract: A pliable handle for a hand-held device is provided. The handle includes a tubular core member, a deformable outer sheath disposed about the tubular core member, a gel disposed between the tubular core member and the outer sheath, and first and second sealers inserted into respective ends of the tubular core member and sealing the gel between the tubular core member and the outer sheath, wherein a force applied to the outer sheath causes load movement of the gel.

Abstract: A multi-level, phase change memory cell has first and second thermal isolation materials having different thermal conductivity properties situated in heat-conducting relation to first and second boundaries of the phase change material. Accordingly, when an electrical current is applied to raise the temperature of the memory material, heat is drawn away from the memory material asymmetrically along a line orthogonal to electric field lines between the electrodes.

Abstract: A phase change memory cell includes first and second electrodes electrically coupled by a phase change element. At least a section of the phase change element comprises a higher reset transition temperature portion and a lower reset transition temperature portion. The lower reset transition temperature portion comprises a phase change region which can be transitioned, by the passage of electrical current therethrough, from generally crystalline to generally amorphous states at a lower temperature than the higher reset transition temperature portion. The phase change element may comprise an outer, generally tubular, higher reset transition temperature portion surrounding an inner, lower reset transition temperature portion.