Abstract: A light-emitting diode structure is disclosed. A substrate has a first semiconductor layer, a light-emitting layer and a second semiconductor layer formed thereon. The first and second semiconductor layers are of opposite conductivity types. A first contact electrode is disposed between the first semiconductor layer and the substrate, and has a protruding portion extending into the second semiconductor layer. A barrier layer is conformally formed on the first contact electrode and exposes a top surface of the protruding portion. A current blocking member is disposed on the barrier layer and around at least a sidewall of the protruding portion. A second contact electrode is disposed between the first semiconductor layer and the first contact electrode, and in direct contact with the first semiconductor layer, wherein the second contact electrode is electrically insulated from the first contact electrode by the barrier layer.

Abstract: A light emitting diode (LED) is disclosed. The LED includes a substrate, a first semiconductor layer, an active layer, a second semiconductor layer, and a patterned structure. The first semiconductor layer having first and second regions is positioned on the substrate, wherein the first region is thicker than the second region. The active layer is positioned on the first region of the first semiconductor layer. The second semiconductor layer is positioned on the active layer, wherein the first and second semiconductor layers have opposite conductivities. The patterned structure is formed on a sidewall of the first region of the first semiconductor layer or on a sidewall of the second semiconductor layer.

Abstract: A server system includes a rack, a power supply module, a switch, and a plurality of servers. The rack can be divided into a plurality of rack units. The rack units are parallel to each other and vertically arranged. The power supply module and the switch are disposed in close proximity to each other in at least one of the rack units. The power supply is adjacent to the rear side of the rack. The switch is adjacent to the front side of the rack. Each of the servers is disposed in one of the other rack units and electrically connected to the power supply module and the switch.

Abstract: Disclosed is a method for making a rubber liner of a composite pressure vessel. At first, rubber is located in a mold. The rubber and the mold are located in a vacuum bag, heated and pressed so that the rubber is vulcanized and molded into a semi-product of the rubber liner. Sand is filled in the semi-product. The sand is tamped and heated so that it is hardened and molded. A reinforcement element in the form of a wire or tape is wound around the semi-product. Two semi-products are brought into contact with each other. An un-vulcanized rubber band is provided around and attached to the semi-products. The rubber liners and the reinforcement elements are heated and vulcanized with composite resin. Finally, the water soluble sand mold is dissolved and removed so that the final product of the rubber liner is made, and so is the composite pressure vessel.

Abstract: A rack server system controlled by a remote controller includes a number of server units and a middle plane board. Each of the server units includes a baseboard management controller (BMC), a server-end connector, and a server-end switch, coupled to the BMC and the server-end connector for regulating communication operation therebetween. The middle plane board includes an integrated connector and a plane-end switch, coupled to the server-end switches of each of the server units and the integrated connector for regulating communication operation thereamong. The remote controller is coupled to the rack server system via one of the integrated connector and the server-end connectors and manages the communication operation of the server units.

Abstract: A rack server system includes a number of server units and a rack. The rack server includes a back plane, a control module, a fan module and a power supply module. The back plane includes a number of slots, via which the server units are respectively connected to the back plane. The fan module is connected to the control module, and dissipates heat generated by the server units under the control of the control module. The power supply module is connected to the control module, and powers the server units under the control of the control module.

Abstract: A device producing a patterned plate includes a die and an electromagnetic actuator. The die includes a patterned surface with a pattern formed thereon and a fracturing part. The tubular work piece is disposed between the die and the electromagnetic actuator such that walls of the tubular work piece correspond to walls of the die. When the electromagnetic actuator is supplied with a current pulse, an eddy current is induced in the tubular work piece, generating a repulsive force between the electromagnetic actuator and the tubular work piece. Therefore, the tubular work piece impacts the die, and a forming surface of the tubular work piece is deformed against the patterned surface and the fracturing part, thus replicating the pattern of the patterned surface onto the forming surface. At the same time, the tubular work piece is fractured at the position corresponding to the fracturing part.

Abstract: A light-emitting diode chip structure including a conductive substrate, a semiconductor stacking layer and a patterned seed crystal layer is provided. The conductive substrate has a surface. The surface has a first region and a second region alternately distributed over the surface. The semiconductor stacking layer is disposed on the conductive substrate, and the surface of the conductive substrate faces the semiconductor stacking layer. The patterned seed crystal layer is disposed on the first region of the surface of the conductive substrate and between the conductive substrate and the semiconductor stacking layer. The patterned seed crystal layer separates the semiconductor stacking layer from the first region. The semiconductor stacking layer covers the patterned seed crystal layer and the second region, and is electrically connected to the conductive substrate through the second region. A fabrication method of the light-emitting diode chip structure is also provided.

Abstract: A multimedia player includes an execution button for generating an execute instruction when operated, an auxiliary card associated with a file managing instruction, an auxiliary card reader for electrically connecting with the auxiliary card, and a control unit electrically connected to the execution button and the auxiliary card reader. The control unit is operable, in response to the execute instruction from the execution button, to execute the file managing instruction associated with the auxiliary card that is electrically connected to the auxiliary card reader.

Abstract: A vertical light emitting diode (VLED) die includes a first metal having a first surface and an opposing second surface; a second metal on the second surface of the first metal; a p-type semiconductor layer on the first surface of the first metal; a multiple quantum well (MQW) layer on the p-type semiconductor layer configured to emit light; and an n-type semiconductor layer on the multiple quantum well (MQW) layer.

Abstract: A light emitting diode (LED) die includes a first substrate having a first surface and an opposing second surface; a second substrate on the second surface of the first substrate; a p-type semiconductor layer on the first surface of the first substrate; a multiple quantum well (MQW) layer on the p-type semiconductor layer configured to emit light; and an n-type semiconductor layer on the multiple quantum well (MQW) layer.

Abstract: A light-emitting diode chip structure including a conductive substrate, a semiconductor stacking layer and a patterned seed crystal layer is provided. The conductive substrate has a surface. The surface has a first region and a second region alternately distributed over the surface. The semiconductor stacking layer is disposed on the conductive substrate, and the surface of the conductive substrate faces the semiconductor stacking layer. The patterned seed crystal layer is disposed on the first region of the surface of the conductive substrate and between the conductive substrate and the semiconductor stacking layer. The patterned seed crystal layer separates the semiconductor stacking layer from the first region. The semiconductor stacking layer covers the patterned seed crystal layer and the second region, and is electrically connected to the conductive substrate through the second region. A fabrication method of the light-emitting diode chip structure is also provided.

Abstract: Techniques for controlling current flow in semiconductor devices, such as LEDs are provided. For some embodiments, a current-guiding structure may be provided including adjacent high and low contact areas. For some embodiments, a second current path (in addition to a current path between an n-contact pad and a substrate) may be provided. For some embodiments, both a current-guiding structure and second current path may be provided.

Abstract: A multimedia player includes an execution button for generating an execute instruction when operated, an auxiliary card associated with a file managing instruction, an auxiliary card reader for electrically connecting with the auxiliary card, and a control unit electrically connected to the execution button and the auxiliary card reader. The control unit is operable, in response to the execute instruction from the execution button, to execute the file managing instruction associated with the auxiliary card that is electrically connected to the auxiliary card reader.

Abstract: A data security protection method generates dynamic encryption keys and dynamic decryption keys for a host and a client during data transmission between the host and the client. The host stores a host initial key K0, and determines a host key Kn using a one-way hash function based on the host initial key K0. The client stores a client initial key K?0, and determines a client key K?n using the one-way hash function based on the client initial key K?0. Original data Rn is encrypted as encrypted data Xn using the host key Kn before being sent to the client. The client decrypts the encrypted data Xn using the client key K?n, to obtain the original data Rn.

Abstract: A water supply control method for a water tower connected to a server through a high water level sensor and a low water level sensor installed on the water tower. A solar panel is controlled to supply power to a motor of the water tower during off-peak hours and a current water level in the water tower has reached a lowest water level but has not reached a highest water level. An alternating current power supply is controlled to supply power to the motor during off-peak hours and the current water level in the water tower has not reached the lowest water level, or during peak hours and the current water level in the water tower has not reached the highest water level.

Abstract: An electronic device connects with one or more Internet Protocol (IP) cameras via a network. The electronic device receives a first real-time image of a monitored area captured by an IP camera at a first resolution, compares the first real-time image with an initial image of the monitored area, to determine if suspicious activity appears in the monitored area. If suspicious activity appears in the monitored area, the electronic device generates and sends a control command to the IP camera via the network, to automatically adjust the resolution of the IP camera from the first resolution to a second resolution.

Abstract: Techniques for controlling current flow in semiconductor devices, such as LEDs are provided. For some embodiments, a current guiding structure may be provided including adjacent high and low contact areas. For some embodiments, a second current path (in addition to a current path between an n-contact pad and a metal alloy substrate) may be provided. For some embodiments, both a current guiding structure and second current path may be provided.